RB1762-25 www.sziton.com Ver0.1 -July., 2021 RB1762-25 Bluetooth Module DISCLAIMER AND COPYRIGHT NOTICE Information in this document, including URL references, is subject to change without notice. This document is provided “As if” with no whatsoever, including any warranty of merchantability, noninfringement, fitness for any purpose, or any warranty otherwise arising out of any proposal, specification or samples.
RB1762-25 www.sziton.com Ver0.1 - July, 2021 Table of Contents Table of Contents....................................................................................................................... 2 1 Device Overview...................................................................................................................... 3 1.1 Features............................................................................................................................................3 1.
RB1762-25 www.sziton.com Ver0.1 - July, 2021 1 Device Overview 1.
RB1762-25 www.sziton.com Ver0.1 - July, 2021 2.2 Pin Functions Table 1. Pin Attributes of RB1762-25 Pin Name Type 1,2,8,9,25 GND Ground 3 P3_1 I/O 4 P3_0 I/O 5 P0_3 I/O 6 P1_1 I/O 7 P1_0 I/O 10 RESET I 11 12 13 14 15 16 17 P0_6 P0_5 P0_4 P0_2 P0_1 P0_0 P2_2 ITON Technology Corp.
RB1762-25 www.sziton.com 18 19 20 21 22 Ver0.1 - July, 2021 P2_3 P2_4 P2_5 P2_6 P2_7 I/O I/O I/O I/O I/O 23 P5_0 Ground 24 VDD Power Supply ITON Technology Corp.
RB1762-25 www.sziton.com Ver0.1 - July, 2021 Note:Pin Multiplexer All GPINote:Pin Multiplexer All GPIO pins are configurable via the built-in pin multiplexer(PINMUX), The table shows all GPIO pin configurations.All pins have an internal pull-up pull-down resistor for controlling GPIO_PU and GPIO_PD.O pins are configurable via the built-in pin multiplexer(PINMUX), The table shows all GPIO pin configurations.All pins have an internal pull-up pull-down resistor for controlling GPIO_PU and GPIO_PD.
RB1762-25 www.sziton.com Ver0.1 - July, 2021 3.2 Power Consumption: Condition: VDD=3V, ambient temperature: 25C 1) Low Power Mode Power Mode Power down Always on 32k Retention Registers RCOSC/XTAL SRAM ON OFF OFF CPU OFF Wakeup Current Method Consumption(Typical) Wakeup by GPIO 450nA 2)Active Mode Condition:VDD=3V,ambient temperature:25℃ Power Mode Current Consumption(Typical) Active RX mode 7.3mA Active TX mode(TX power:0dBm) 7.9mA Active TX mode(TX power:4dBm) 9.
RB1762-25 www.sziton.com Ver0.1 - July, 2021 30~2000MHz, -30 Wanted signal level=-67dBm 2003~2399MHz, Blocker Power(dBm) -35 Wanted signal level=-67dBm 2484~2997MHz, -35 Wanted signal level=-67dBm 3000MHz~12.
RB1762-25 www.sziton.com Ver0.1 - July, 2021 5 Mechanical and Package 5.1 Mechanical Dimension PCB thickness:0.8mm . Product thickness 2.70mm±0.3mm Figure 6. Mechanical Dimension Note:Unit is mm. Size tolerance:±0.13mm. 5.2 Package Information Figure 8. Packaging Information ITON Technology Corp.
RB1762-25 www.sziton.com Ver0.1 - July, 2021 6 Thermal Reflow Referred to IPC/JEDEC standard. Peak temperature: <250°C Number of times: 6≤2 Figure 9. Recommended Reflow for Lead Free Solder Note:Suggest the module can't be go through the reflow furnace again. 7 Ordering Information Part NO. RB1762-25 Working Voltage VDD:1.8V~3.3V ANT Shielding cover PCB ANT included Remark 8 Revision History Date Version No. 2020.07.19 V0.1 ITON Technology Corp.
FCC Regulatory notices Modification statement Haier US Appliance Solutions, Inc. has not approved any changes or modifications to this device by the user. Any changes or modifications could void the user’s authority to operate the equipment. Interference statement This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt RSS standard(s).
ISED Canada Statement: This device contains licence-exempt tasmittre(s)/receiver(s)/ that comply with Innovation Science and Economic Development Canada 's licence-exempt RSS(s). Operation is subject to the following two conditions: 1) this device may not cause interference and 2) this device must accept any interference, including interference that may cause undesired operation of the device.
OEM Statement a. The module manufacturer must show how compliance can be demonstrated only for specific host or hosts b. The module manufacturer must limit the applicable operating conditions in which t transmitter will be used, and c. The module manufacturer must disclose that only the module grantee can make the te evaluation that the module is compliant in the host.
2.2 List of applicable FCC rules List the FCC rules that are applicable to the modular transmitter. These are the rules that specifically establish the bands of operation, the power, spurious emissions, and operating fundamental frequencies. DO NOT list compliance to unintentional-radiator rules (Part 15 Subpart B) since that is not a condition of a module grant that is extended to a host manufacturer. See also Section 2.
2.5 Trace antenna designs For a modular transmitter with trace antenna designs, see the guidance in Question 11 of KDB Publication 996369 D02 FAQ – Modules for Micro-Strip Antennas and traces. The integration information shall include for the TCB review the integration instructions for the following aspects: layout of trace design, parts list (BOM), antenna, connectors, and isolation requirements.4 a) Information that includes permitted variances (e.g.
2.8 Label and compliance information Grantees are responsible for the continued compliance of their modules to the FCC rules. This includes advising host product manufacturers that they need to provide a physical or e-label stating “Contains FCC ID” with their finished product. See Guidelines for Labeling and User Information for RF Devices – KDB Publication 784748.