322x Network Node Reference Manual Document Number: 1322xNNRM Rev. 1.
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Contents About This Book Audience . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii Chapter 1 Safety Information 1.1 1.2 1.2.1 1.
.2.3 Power Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2 4.3 RF Circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3 4.4 USB Connector (“B” Receptacle). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3 4.5 LEDs, Switch, Buttons and Joystick. . . . . . . . . . . . . . . . . . . . . . . . . . .
About This Book This manual describes Freescale’s 1322x Network Node evaluation board. The 1322x Network Node contains a Freescale third-generation, low power, 2.4 GHz radio frequency transceiver, with 32-bit ARM7 core based MCU, hardware acceleration for both the IEEE Standard 802.15.4 MAC and AES security, and a full set of MCU peripherals into an 99-pin LGA Platform-in-Package (PiP). Audience This manual is intended for system designers. Organization This document is organized into 5 chapters.
Definitions, Acronyms, and Abbreviations The following list defines the acronyms and abbreviations used in this document. ADC Analog to Digital Converter AES Advanced Encryption Standard ARM Advanced RISC Machine COG Chip on Glass CTS Clear to Send DAC Digital to Analog Converter DMA Direct Memory Access I2C Inter-Integrated Circuit is a multi-master serial computer bus ISM Industrial Scientific Medical 2.
Chapter 1 Safety Information 1.1 FCC Guidelines This equipment is for use by developers for evaluation purposes only and must not be incorporated into any other device or system. This device may not be sold to the general public. Integrators will be responsible for reevaluating the end product (including the transmitter) and obtaining a separate FCC authorization. FCC approval of this device only covers the original configuration of this device as supplied.
Safety Information 1.2.2 47 C.F.R. Sec.15.105(b) This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. The antenna(s) used for this equipment must be installed to provide a separation distance of at least 8 inches (20cm) from all persons. This device complies with Part 15 of the FCC Rules. Operation is subject to the following three conditions: 1. This device may not cause harmful interference. 2.
Chapter 2 1322x Network Node Module Overview and Description 2.1 Introduction The 1322x Network Node (NN) is an IEEE 802.15.4 compliant evaluation board based on the Freescale MC1322x device. The heart of the 1322x Network Node is Freescale’s MC1322x 99-pin LGA Platform-in-Package (PiP) solution that can be used for wireless applications ranging from simple proprietary point-to-point connectivity to complete ZigBee mesh networking.
1322x Network Node Module Overview and Description 2.2 Features The 1322x Network Node provides the following features: • Full IEEE 802.15.4 compliant wireless node; ZigBee capable with Freescale’s BeeStack software stack • Based on Freescale’s third-generation MC1322x ZigBee platform which incorporates a complete, low power, 2.4 GHz radio frequency transceiver, 32-bit ARM7 core based MCU, hardware acceleration for both the IEEE 802.15.
1322x Network Node Module Overview and Description — Reference oscillator can be driven from an external source — Optional 32.768 kHz crystal oscillator for accurate real-time delays 2.3 Board Level Specifications Table 2-1. 1322x Network Node Specifications Parameter Units MIN TYP Notes/Conditions MAX General Size (Enclosure: X, Y, Z) Size (PCB: X, Y) Layer build (PCB) 135x100x40 mm 125x85 mm 0.8 / 0.032 mm / in Dielectric material (PCB) 4-Layer FR4 Power Voltage supply (DC) 4.
1322x Network Node Module Overview and Description Table 2-1. 1322x Network Node Specifications Parameter 802.15.4 Output power -30 0 Harmonics 2nd harmonics 3rd harmonics Units Notes/Conditions +2 dBm Over range of Pout from IC control in 2 dB steps. Note: On channel 26, output power should not exceed -5 dBm (power setting 0x0E) to meet FCC Part 15 requirements. -30 -30 dBm dBm Harmonics are compliant to ETSI and FCC regulatory approval standards RF Receiver 802.15.
Chapter 3 System Overview and Functional Block Descriptions This section provides an overview of the Network Node and block diagrams. 3.1 System Block Diagram The following is the 1322x Network Node system level block diagram.
System Overview and Functional Block Descriptions 3.2 System Overview The heart of the 1322x Network Node is Freescale’s MC1322x 99-pin LGA Platform-in-Package (PiP) solution that can be used for wireless applications ranging from simple proprietary point-to-point connectivity to complete ZigBee mesh networking. The MC1322x is designed to provide a highly integrated, total solution, with premier processing capabilities and very low power consumption.
System Overview and Functional Block Descriptions The RF radio interface provides for low cost and high density as shown in Figure 3-3. An onboard balun along with a TX/RX switch allows direct connection to a single-ended 50-Ω antenna. The integrated PA provides programmable output power typically from -30 dBm to +2dBm, and the RX LNA provides -95 dBm sensitivity. This solution also has onboard bypass capacitors and crystal load capacitors for the smallest footprint in the industry.
System Overview and Functional Block Descriptions 3.4 Low-cost 2.4 GHz ISM Band radio The MC1322x provides an onboard balun, antenna switch, and LNA. The only external component required for the radio is an antenna. The Network Node provides a PCB-mounted SMA that connects to an external antenna for a complete solution. Figure 3-4 shows the RF network external to the MC1322x. • Typical output power is 0 dBm, with +2 dBm max • Typical sensitivity is -95 dBm.
System Overview and Functional Block Descriptions 3.7 128x64 Pixel Monochrome Graphic LCD Display The Network Node supports a 128x64 pixel chip-on-glass (COG) STN transmissive monochrome graphic LCD that provides for alpha-numeric or graphic readout. The LCD module is mounted on top of the main circuit board and connects via a flat flex cable (FFC). • The display is an OPTREX #F-51553GNBJ-LW-AB • Viewing area is 66.8 (W) × 35.
System Overview and Functional Block Descriptions • 3.10 — The audio output source is jumper selectable via J10 Audio output processing - The DAC or PWM out signal is filtered through an active 2-pole LPF. From the filter the signal passes through a passive attenuator, and then is amplified and driven to either an on-board speaker or the headset earphone. — The attenuator provides a volume control that is controlled via a software 32 linear tap programmable, non-volatile digital potentiometer.
Chapter 4 Interface Locations and Pinouts This chapter provides a description of the interface location and pinout of the 1322x Network Node PCB. 4.1 Overview This chapter provides the locations (as shown in Figure 4-1) and descriptions of switches, jumpers, and connectors on the 1322x Network Node PCB.
Interface Locations and Pinouts 4.2 Power Management The module can be powered from the DC power jack, the USB port, or the battery pack. 4.2.1 Supply Sources Table 4-1 lists the supply sources, connectors, and voltages. Board maximum current draw is rated at 100 mA. Table 4-1. Power Supply Sources Source Connector Min (Volts) Typical (Volts) Max (Volts) DC Source J5 4.4 5 12 USB J6 4.4 5 5.25 AA Battery Pack BC1 ~2.0 3 3.2 4.2.2 Notes Use DC only source.
Interface Locations and Pinouts 4.3 RF Circuitry The external antenna is connected via the provided SMA connector (J7). NOTE Only the provided Antenova antenna (model Titanus) should be used with this module. This RF design has been certified with this antenna. ® Figure 4-2. Antenova® Titanus Model Antenna 4.4 USB Connector (“B” Receptacle) The USB connector is designated as J6. Figure 4-3 shows the connector pinout. Figure 4-3. USB Connector Pinout 1322x Network Node Reference Manual, Rev. 1.
Interface Locations and Pinouts 4.5 LEDs, Switch, Buttons and Joystick The Network Node contains a total four red LEDs and one green LED • The four red LEDs are driven by the MCU and controlled by the software application. • As previously stated, the green LED is directly connected to the on-board regulator and acts as a "Power On" indication. As also previously stated, SW7 is an on/off slide switch that connects the power supplies. There are five pushbuttons total.
Interface Locations and Pinouts 4.6 LCD Connector The LCD module is connected to the main circuit board via a 30-conductor flat flex cable (FFC) with 0.5 mm spacing. The main board connector is an FFC, Right Angle Dip, zero insertion force (ZIF), 30 pin connector (J13). NOTE The LCD connector is a ZIF unit. Be sure to release the connector before trying to connect or disconnect the FFC to the LCD. 4.7 4.7.
Interface Locations and Pinouts 4.7.2 Nexus Mictor Interface Connector The MC1322x also supports connection to a subset of the defined Nexus Mictor connector. The hardware interface is a 38-pin Mictor 0.64mm/0.025inch spacing target connector (J11). Table 4-4 shows the device pins that are connected to the associated Mictor pinouts. The 38-pin MICTOR connector has a "plug security" for avoid reverse plug-in. J11 is located on the bottom side of the main board. Table 4-4.
Interface Locations and Pinouts 4.8 Audio Subsystem Connections The audio subsystem uses the following connections: • 2.5mm stereo jack J12 - for headset mic and earphone • Jumper J10 - selects audio output source. See Figure 4-4 for connections. AUD FILTER INPUT J10 1 2 3 1 2 3 SERIAL DAC PWM TSM-103-01-L-SV Audio Select 1-2 DAC 3-2 PWM Figure 4-4. J10 Audio Output Source Jumper 4.9 GPIO Connector The GPIO connector (J2) is a standard 2.54mm/0.1inch spacing, 26-pin header.
Interface Locations and Pinouts Table 4-5. GPIO Connector J2 Pinouts (continued) 9 ADC5 ADC Analog Input Channel or GPIO Hardwired to LCD data buffer. Use Jumper J14 to disable.
Interface Locations and Pinouts NOTE The FLASH must first be cleared before loading a new image to FLASH. The 1322x Network Node has two jumper sites (J19 and J20, Figure 4-5) that must be used to erase the FLASH: 1. Short Jumper J3 Pin 1 to Pin 2 with a shorting bar. 2. Short Jumper J20 Pin 1 to Pin 2 with another shorting bar. 3. Turn on power, push the reset button, and wait a few seconds. 4. Turn off power. 5. Remove the jumper shorting bars. 6. The board is now ready for boot operation.
Interface Locations and Pinouts VCC J18 1 2 HDR_2X1 R1 10K Not Mounted 1.5V U17 1 2 3 4 1 2 3 4 8 7 6 5 8 7 6 5 ADC1_VREFH R120 120K 1% LM285M R121 24.9K 1% Figure 4-6. ADC Voltage 1.5 Vdc Voltage Reference 4.12 Jumper Selection Table 4-6 lists all the possible jumper selections for the Network Node.
A B C D CLKIN 3 4 2 1 R6 390R 90122-26 2 4 6 8 10 12 14 16 18 20 22 24 26 J2 R83 10K Not Mounted 2 4 6 8 10 12 14 16 18 20 22 24 26 1 3 5 7 9 11 13 15 17 19 21 23 25 1 3 5 7 9 11 13 15 17 19 21 23 25 SW2 DTSM63N SWITCH2 GPIO Pin Header 3 4 2 1 Push Buttons R8 390R VCC 3 4 2 1 TP7 D3 LHR974 LED3 5 1 2 1 2 VCC 3 4 2 1 Audio V_AUD Audio 0R 0R Recovery Mode JTAG RTCK Disable RTCK JTAG RTCK Enable 1.5V 4 C50 100nF 3 1 2 3 7 CLKIN 1 2 2 4 1 6 5 4 8 LT1129CST-3.
A B C D 5 + NC1 NC2 BUZ1 NDT-03C 1 2 3 4 3 5 2 4 1 STX-2550-5NTR J12 Mic. Biasing TP25 TP23 TP15 TP50 R24 100K 22uF C19 1 R57 4.7K R56 4.7K C24 1uF V_AUD R25 1K 4 11K R85 V_AUD TP20 TP17 10UF C14 R23 TP49 100K V_AUD TP48 R15 10K V_AUD 2 3 R58 27K R20 200K U2A MC33204DTBG A3 B3 B1 B2 C3 100K NCP4896 VP1 INM NC OUTA SD SE/BTL OUTB GND BYP U6 R26 47pF C20 C25 1uF A2 C2 A1 C1 Audio Amplifier 270pF C46 - + V_AUD C44 1uF C29 4.7nF Mic.
A B C 5 SPI_SS SPI_MISO SPI_MOSI SPI_SCK ADC2 ADC3 ADC4 ADC5 TMR0 TMR1 UART2_RTS UART2_CTS V_DIS V_DIS 1 7 R99 100K 74HCT04A U14A 2 74HCT04A 14 5V_LCD R100 100K C71 100nF R101 100K 100nF C72 V_DIS 1 2 8 4 13 10 R98 100K 11 12 22 2 3 4 5 6 7 8 9 10 1 V_DIS 5 GND NC B0 B1 B2 B3 B4 B5 B6 B7 13 23 21 20 19 18 17 16 15 14 24 5V_LCD MC74LVXC3245DT GND GND OE T/R A0 A1 A2 A3 A4 A5 A6 A7 VCCA U16 VCCB 74HCT04A 12 6 74HCT04A U14C 7.
A B C 5 USB-B VUSB DataData+ GND SHIELD1 SHIELD2 J6 1 2 3 4 5 6 15pF 15pF C43 500mA RT2 C42 4 1 3 2 R50 R51 1 60OHM L2 0R 0R 2 C34 1uF V_MAIN + 1 C56 10nF C40 100nF TP38 C41 C57 4.7uF 3 LT1129CST-3.
Schematic, Board Layout, and Bill of Material Figure 5-5. Network Node PCB Component Location (Top View) Figure 5-6. Network Node PCB Test Points (Bottom View) 1322x Network Node Reference Manual, Rev. 1.
Schematic, Board Layout, and Bill of Material Figure 5-7. Network Node PCB Layout (Top View) Figure 5-8. Network Node PCB Layout (Bottom View) 1322x Network Node Reference Manual, Rev. 1.
Schematic, Board Layout, and Bill of Material Table 5-1. Bill of Materials Qty Part Reference Description Value Voltage Tolerance Manufacturer Manufacturer Part Number 1 ANT1 F_Antenna PCB F Antenna Not A Part NOT A PART 1 BUZ1 SMD Speaker NDT-03C Star Micronics NDT-03C 1 C54 Ceramic Capacitor C0G 10pF 50V 5% Murata GRM1555C1H100JZ01 0 C1,C55,C58 Ceramic Capacitor C0G 10pF 50V 5% Murata GRM1555C1H100JZ01 3 C24,C25,C44 Ceramic Capacitor X5R 1uF 6.
Schematic, Board Layout, and Bill of Material Table 5-1. Bill of Materials Qty Part Reference 2 C60,C73 3 Description Low ESR Tantal Capacitor Value Voltage Tolerance 47uF 16V +/-10% C63,C64,C65 Aluminum Electrolytic Capacitor low ESR CV-GX 4.7uF 35V 5 C66,C67,C68 Aluminum Electrolytic ,C69,C70 Capacitor 1uF 0 C7,C12 Ceramic Capacitor C0G 1 C75 2 C8,16 3 Manufacturer Manufacturer Part Number Avx TPSD476K016R150 20% Sanyo 35CV4.
Schematic, Board Layout, and Bill of Material Table 5-1.
Schematic, Board Layout, and Bill of Material Table 5-1. Bill of Materials Qty Part Reference Description RES MF 24.9K 1/16W 1% 0402 Value 1 R121 4 R122,R123,R RES MF 1.0K 1/16W 5% 1K 124,R125 0402 2 RT1,RT2 Polyswitch Overcurrent Protection Device 500mA 5 SW1,SW2,S W3,SW4,SW 5 SMD Tact Switch 2.6N (7.0mm) 1 SW6 1 Voltage Tolerance 24.9K Manufacturer Manufacturer Part Number 1% Koa Speer 5% Vishay CRCW04021K00JNED Intertechnology 13.
Schematic, Board Layout, and Bill of Material Table 5-1. Bill of Materials Qty Part Reference Description Value 0 X2 Crystal SMD 32.768kH z 1 D11 128x64 pixel monochrome display w. LED backlight 1 BC1 PCB Battery Holder 2xAA 1 J1 1 Voltage Tolerance +-20ppm Manufacturer Manufacturer Part Number Abracon ABS25-32.768-12.5-2-T F-51553G NBJ-LW-A B Optrex F-51553GNBJ-LW-AEN 2462 Keystone 2462 Dual Row Right Angle pin 90122-20 header 0.
Schematic, Board Layout, and Bill of Material 1322x Network Node Reference Manual, Rev. 1.
