H158A-SM Wi-Fi Single-band 1X1 802.11b/g/n & BLE5.
H158A-SM Module Datasheet Office: 6 Floor, Building U6, Junxiang U8 Park, Hangcheng Avenue, Bao'an District, Shenzhen City, CHINA Factory: No.8, Litong Road, Liuyang Economic & Technical Development Zone, Changsha, Hunan, CHINA TEL: +86-755-2955-8186 Website: www.fn-link.
H158A-SM Revision History Version Date Revision Content Draft Approved 1.0 2020/12/23 New version Lxy SZS 1.1 2021/3/27 Remove shielding Lxy Szs 1.2 2021/4/6 Upgrade tx power limit Lxy Szs 1.3 2021/6/11 Added planeness information Lxy Lgp 1.4 2021/7/5 Revise BLE type module P/N Lxy Lgp 1.5 2021/8/16 Added -01 type P/N LXY QJP 1.5 2021/09/04 Update to WiFi+BLE version LXY QJP 1.
H158A-SM CONTENTS 1 Overview ..................................................................................................................... 3 1.1 Introduction ............................................................................................................ 3 1.2 Features .................................................................................................................3 1.3 General Specification ................................................................................
H158A-SM 1 Overview 1.1 Introduction H158A-SM is a highly integrated and excellent performance Wireless LAN (WLAN) SDIO2.0 network interface device. Based on iCOMM chipset SV6158M. support 802.11b/g/n +BLE5.0 standard. 1.2 Features Operate at ISM frequency bands (2.4GHz) CMOS MAC, Baseband PHY, and RF in a single chip for 802.
H158A-SM 1.3 General Specification Model Name H158A-SM Product Description Support Wi-Fi +BLE5.0 functionalities Dimension L x W x T: 12 x 12 x 1.7 mm Wi-Fi Interface Support SDIO Operating temperature -10°C to 65°C Storage temperature -40°C to +85°C 1.4 Recommended Operating Rating Min. Typ. Max. Unit -10 25 65 VBAT 3.0 3.3 3.6 deg.C V VDDIO 1.7 1.8 or 3.3 3.6 V Operating Temperature 1.5 Current informations Vcc=3.3V, Ta=25°C, unit: mA current mean 11b 11Mbps TX mode 186.
H158A-SM ※1.6 EEPROM Information WI-FI Vendor ID - Product ID - 2 General Specification 2.1 Wi-Fi RF Specifications function Description WLAN STANDARD frequency range IEEE 802.11 b/g/n Wi-Fi compliant 2412MHz to 2462MHz 2422MHz to 2452MHz Support channel 802.11b/g/n(HT20):11 802.11n(HT40):7 Spectrum Mask IEEE Frequency Error ±20PPM Output Power BLE:7.42dBm; 2.4G:16.
11n,20MHz@10% PER 11n ,40MHz@10% PER maximum input level antenna - MCS0 @ -89 dBm ≤-85 - MCS1 @ -86 dBm ≤-82 - MCS2 @ -84 dBm ≤-80 - MCS3 @ -80 dBm ≤-77 - MCS4 @ -77 dBm ≤-73 - MCS5 @ -72 dBm ≤-69 - MCS6 @ -71 dBm ≤-68 - MCS7 @ -70 dBm ≤-67 - MCS0 @ -89 dBm ≤-82 - MCS1 @ -85 dBm ≤-79 - MCS2 @ -83 dBm ≤-77 - MCS3 @ -80 dBm ≤-74 - MCS4 @ -76 dBm ≤-70 - MCS5 @ -71 dBm ≤-66 - MCS6 @ -70 dBm ≤-65 - MCS7 @ -68 dBm ≤-64 H158A-SM 802.11b : -10 dBm 802.
H158A-SM Maximum Input Level GFSK (1Mbps): -20dBm 3 Pin Assignments 3.1 Pin Outline 3.
H158A-SM 9 VCC33 10~11 NC 12 RST 13 WL_HOST_WAKE 14 SDIO_DATA_2 15 SDIO_DATA_3 16 SDIO_DATA_CMD 17 SDIO_DATA_CLK 18 SDIO_DATA_D0 19 SDIO_DATA_D1 20 GND 21 NC 22 VDIO 23~30 NC 31 GND 32 NC 33 GND 34~35 NC 36 GND 37 GPIO01 38 GPIO00 39~44 NC P:POWER I:INPUT O:OUTPUT 3.3V IN NC Reset, default pull high,active low WLAN WAKE HOST,GPIO14 SDIO_D2, GPIO17 SDIO_D3, GPIO18 SDIO_CMD, GPIO19 SDIO_CLK, GPIO20 SDIO_D0, GPIO21 SDIO_D1, GPIO22 GND NC 1.8 or 3.
H158A-SM H: 1.7 (±0.2) mm Planeness <0.1mm Weight 0.40g 4.2 Marking Description NA 4.3 Module Physical Dimensions 4.
H158A-SM 6 Host Interface Timing Diagram 6.1 SDIO Pin Description The module supports SDIO version 2.0 for all 1.8V 4-bit UHSI speeds: SDR12(25 Mbps), and SDR25(50Mbps) in addition to the 3.3V default speed(25MHz) and high speed (50 MHz).
H158A-SM DATA3 Data Line 3 CLK Clock CMD Command Line 6.2 SDIO Default Mode Timing Diagram 6.3 SDIO Power-on sequence Figure 4 shows the power-on sequence of the SV615XP from power-up to firmware download, including the initial device power-on reset evoked by LDO_EN signal. The LDO_EN input level must be kept the same as VDDIO voltage level. After initial power-on, the LDO_EN signal can be held low to turn off the SV615XP or pulsed low to induce a subsequent reset.
H158A-SM sequence of the SV615XP. From that point, the typical SV615XP power-on sequence is shown below: 1. Within 1.3 millisecond, the internal power-on reset (POR) will be done. And host could download firmware code of DPLL setting if the crystal is not default setting, 26MHz. The internal running clock is crystal frequency. 2. After 100us of DPLL settling time, host could set internal clock to full speed and finish all the downloading of firmware code.
H158A-SM The SV615XP LDO_EN pin can be used to completely reset the entire chip. After this signal has been de-asserted, the SV615XP is in off mode waits for host communication. Until then, the MAC, BB, and SOC blocks are powered off and all modules are held in reset. Once the host has initiated communication, the SV615XP turns on its crystal and later on DPLL. After all clocks are stable and running, the resets to all blocks are automatically de-asserted.
H158A-SM 7 Reference Design L1 1 10pF C1 NP W L_ANT 2 3 C2 NP 4 5 GPIO12 6 7 8 3.
H158A-SM Chipset SV6158M,11b/g/n/BLE,SDIO,WiFi,4x4mm, QFN32 iCOMMSEMI Inductor 0603 4.7uH,20%,400mA Sunlord，cenke，ceaiya 10 Environmental Requirements 10.1 Recommended Reflow Profile Referred to IPC/JEDEC standard. Peak Temperature : <250°C Number of Times : ≤2 times 10.
H158A-SM 1. Please press 1 : 1 and then expand outward proportion to 0.7 mm, 0.12 mm thickness When open a stencil. 2. Take and use the WIFI module, please insure the electrostatic protective measures. 3. Reflow soldering temperature should be according to the customer the main size of the products, such as the temperature set at 250 + 5 ℃ for the MID motherboard. About the module packaging, storage and use of matters needing attention are as follows: 1.
H158A-SM 11 Package 11.1 Reel A roll of 1500pcs 11.
H158A-SM Using self-adhesive tape Size of black tape:24mm*32.6m the cover tape :21.3mm*32.
H158A-SM The packing case size:335*255*360mm 12.3 Moisture sensitivity The Modules is a Moisture Sensitive Device level 3, in according with standard IPC/JEDEC J-STD-020, take care all the relatives requirements for using this kind of components. Moreover, the customer has to take care of the following conditions: a) Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity (RH).
1. FCC Statement FCC Statement FCC standards: FCC CFR Title 47 Part 15 Subpart C Section 15.247 Integral antenna with antenna gain 4dBi This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
