H158A-S Wi-Fi Single-band 1X1 802.
H158A-S Module Datasheet Office: 6 Floor, Building U6, Junxiang U8 Park, Hangcheng Avenue, Bao'an District, Shenzhen City, CHINA Factory: No.8, Litong Road, Liuyang Economic & Technical Development Zone, Changsha, Hunan, CHINA TEL: +86-755-2955-8186 Website: www.fn-link.
H152A-S Revision History Version Date Revision Content Draft Approved 1.
CONTENTS H158A-S 1 Overview....................................................................................................................................1 1.1 Introduction......................................................................................................................... 1 1.2 Features.............................................................................................................................. 1 1.3 General Specification...........................................
H158A-S 1 Overview 1.1 Introduction H158A-S is a highly integrated and excellent performance Wireless LAN (WLAN) SDIO2.0 network interface device. Based on iCOMM chipset SV6158P. support 802.11b/g/n standard. 1.2 Features Operate at ISM frequency bands (2.4GHz) CMOS MAC, Baseband PHY, and RF in a single chip for 802.
H158A-S 1.3 General Specification Model Name H158A-S Product Description Support Wi-Fi functionalities Dimension L x W x T: 12 x 12 x 2.2 mm (typical) Wi-Fi Interface Support SDIO Operating temperature -10°C to 70°C Storage temperature -40°C to +85°C 1.4 Recommended Operating Rating Min. Typ. Max. Unit -10 25 70 VBAT 3.0 3.3 3.6 deg.C V VDDIO 1.7 1.8 or 3.3 3.6 V Operating Temperature 1.5 Current informations Vcc=3.3V, Ta=25°C, unit: mA current Typ. Max. 802.
H158A-S ※1.6 EEPROM Information WI-FI Vendor ID - Product ID - 2 General Specification 2.1 Wi-Fi RF Specifications Feature Description WLAN Standard IEEE 802.11 b/g/n Wi-Fi compliant Frequency Range 2.400 GHz ~ 2.4835 GHz (2.4 GHz ISM Band) Number of Channels 2.4GHz：Ch1 ~ Ch14 Spectrum Mask Min. b/g/n Typ. b/g/n Max. b/g/n Unit b/g/n 1st side lobes(to fc ± 11MHZ) - -43/-30/-40 - dBr 2st side lobes(to fc ± 22MHZ) - -52/-33/-58 - dBr Freq.
H158A-S SISO Receive Sensitivity (11n,20MHz) @10% PER SISO Receive Sensitivity (11n ,40MHz) @10% PER Maximum Input Level Antenna Reference - MCS=0 PER @ -89 dBm ≤-85 - MCS=1 PER @ -86 dBm ≤-82 - MCS=2 PER @ -84 dBm ≤-80 - MCS=3 PER @ -80 dBm ≤-77 - MCS=4 PER @ -77 dBm ≤-73 - MCS=5 PER @ -72 dBm ≤-69 - MCS=6 PER @ -71 dBm ≤-68 - MCS=7 PER @ -70 dBm ≤-67 - MCS=0, PER @ -89 dBm ≤-82 - MCS=1, PER @ -85 dBm ≤-79 - MCS=2, PER @ -83 dBm ≤-77 - MCS=3, PER @ -80 dBm ≤-74 - MCS
H158A-S 3.2 Pin Definition Pin # Name 1 2 3 4 GND ANT GND NC 5 GPIO12 6~8 9 10~11 12 13 14 15 16 17 NC VCC33 NC RST WL_HOST_WAKE SDIO_DATA_2 SDIO_DATA_3 SDIO_DATA_CMD SDIO_DATA_CLK FN-LINK TECHNOLOGY LIMITED Description GND RF OUTPUT GND NC Default low setting to SDIO mode, pull high into SPI mode NC 3.
H158A-S 18 19 20 21 22 23~30 31 32 33 34~35 36 37 38 39~44 SDIO_DATA_D0 SDIO_D0, GPIO21 SDIO_DATA_D1 SDIO_D1, GPIO22 GND GND NC NC VDIO 1.8 or 3.3V NC NC GND GND NC NC GND GND NC NC GND GND GPIO01 UART LOG TX GPIO00 UART LOG RX NC NC P:POWER I:INPUT O:OUTPUT 4 Dimensions 4.1 Module Picture L x W : 12 x 12 (+0.3/-0.1) mm H: 2.2 (±0.2) mm Weight FN-LINK TECHNOLOGY LIMITED 0.
H158A-S 4.2 Marking Description 4.
H158A-S 4.4 Layout Reference (unit: mm ) 6 Host Interface Timing Diagram 6.1 SDIO Pin Description The module supports SDIO version 2.0 for all 1.8V 4-bit UHSI speeds: SDR12(25 Mbps), and SDR25(50Mbps) in addition to the 3.3V default speed(25MHz) and high speed (50 MHz).
H158A-S SD 4-Bit Mode DATA0 Data Line 0 DATA1 Data Line 1 or Interrupt DATA2 Data Line 2 or Read Wait DATA3 Data Line 3 CLK Clock CMD Command Line 6.2 SDIO Default Mode Timing Diagram 6.
H158A-S download, including the initial device power-on reset evoked by LDO_EN signal. The LDO_EN input level must be kept the same as VDDIO voltage level. After initial power-on, the LDO_EN signal can be held low to turn off the SV615XP or pulsed low to induce a subsequent reset. After LDO_EN is assert and host starts the power-on sequence of the SV615XP. From that point, the typical SV615XP power-on sequence is shown below: 1. Within 1.3 millisecond, the internal power-on reset (POR) will be done.
H158A-S The SV615XP LDO_EN pin can be used to completely reset the entire chip. After this signal has been de-asserted, the SV615XP is in off mode waits for host communication. Until then, the MAC, BB, and SOC blocks are powered off and all modules are held in reset. Once the host has initiated communication, the SV615XP turns on its crystal and later on DPLL. After all clocks are stable and running, the resets to all blocks are automatically de-asserted.
H158A-S 7 Reference Design 1 L1 10pF WL_ANT 2 3 C1 NP C2 NP 4 5 GPIO12 6 7 3.
H158A-S FGH158ASXX-00 SV6158P,b/g/n,WiFi 2.4G,1T1R,SDIO,单天线,带屏蔽盖 9 The Key Material List 24MHZ CL=12pF,10ppm ECEC,HOSONIC,TKD,JW T H158A-S-V1.0 green, 4L, 12X12X0.8mm XY-PCB,LX-PCB,SL-PCB, Sunlord Chipset SV6158,11b/g/n, SDIO WiFi, 4x4mm,QFN32 iCOMMSEMI Inductor 0603 4.7uH,20%,400mA Sunlord，cenke，ceaiya Shielding H158A-S-V1.0 屏蔽盖 信太，精力通 Crystal PCB 3225 10 Environmental Requirements 10.1 Recommended Reflow Profile Referred to IPC/JEDEC standard.
H158A-S 1. Please press 1 : 1 and then expand outward proportion to 0.7 mm, 0.12 mm thickness When open a stencil. 2. Take and use the WIFI module, please insure the electrostatic protective measures. 3. Reflow soldering temperature should be according to the customer the main size of the products, such as the temperature set at 250 + 5 ℃ for the MID motherboard. About the module packaging, storage and use of matters needing attention are as follows: 1.
H158A-S 11 Package 11.1 Reel A roll of 2000pcs 11.2 Packaging Detail the take-up package Using self-adhesive tape Size of black tape:24mm*32.6m the cover tape :21.3mm*32.
H158A-S NY bag size:420mm*450mm size ：335*335*55mm The packing case size:335*255*360mm 12.3 Moisture sensitivity The Modules is a Moisture Sensitive Device level 3, in according with standard IPC/JEDEC J-STD-020, take care all the relatives requirements for using this kind of components. Moreover, the customer has to take care of the following conditions: a) Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity (RH).
H158A-S e) Baking is required if the humidity indicator inside the bag indicates 10% RH or more FN-LINK TECHNOLOGY LIMITED 17 Proprietary & Confidential Information
Federal Communications Commission (FCC) Declaration of Conformity FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment. This device complies with Part 15 of the FCC Rules. (15.
