PRODUCT SPECIFICATION F89ESSM23 Wi-Fi Single-band 1x1 Module Datasheet Version:v1.
F89ESSM23 Module Datasheet Part NO. Ordering Information Description RTL8189ES-VB,b/g/n,Wi-Fi,1T1R,12.5X14mm,SDIO FG89ESSM23-W2 Customer: Customer P/N: Signature: Date: Office: 14th floor, Block B, phoenix zhigu, Xixiang Street, Baoan District, Shenzhen Factory: NO.8, Litong RD., Liuyang Economic & Technical Development Zone, Changsha, CHINA TEL:+86-755-2955-8186 FN-LINK TECHNOLOGY LIMITED Website:www.fn-link.
F89ESSM23 CONTENTS 1. General Description.................................................................................................... 5 1.1 Introduction......................................................................................................................... 5 1.2 Description ......................................................................................................................... 5 2. Features............................................................................
F89ESSM23 Revision History Date Contents of Revision Change V1.0 2022/02/25 New version V1.
F89ESSM23 1. General Description 1.1 Introduction F89ESSM23 is a highly integrated and excellent performance Wireless LAN (WLAN) SDIO network interface device. High-speed wireless connection up to 150 Mbps. This WLAN Module design is based on Realtek RTL8189ES. It is a highly integrated single-chip 1*1 SISO Wireless LAN (WLAN) SDIO network interface controller complying with the 802.11n specification. It combines a MAC, a 1T1R capable baseband, and RF in a single chip.
,j=rJ 2. ι 1r11< 眩管理 Features General Features • Operate at I SM frequency bands (2 .4GHz) • I EEE standardssupport: IEEE 802. I I b, I EEE 802. I l g, I EEE 802.
F89ESSM23 4. General Specification 4.1 WI-FI Specification Feature Description WLAN Standard IEEE 802.11 b/g/n Wi-Fi compliant Frequency Range 2.400 GHz ~ 2.4835 GHz (2.4 GHz ISM Band) Number of Channels 2.4GHz：Ch1 ~ Ch13 IEEE 802.11b:21.34dBm IEEE 802.11g:20.64dBm FCC+IC Output Power IEEE 802.11n(HT20):19.70dBm; IEEE 802.11n(HT40):19.52dBm Spectrum Mask Meet with IEEE standard Freq.
F89ESSM23 Vendor ID - Product ID - FN-LINK TECHNOLOGY LIMITED 8
F89ESSM23 6.2 Pin Definition details NO. Name Type Description Voltage 1 SD_CMD I/O SDIO Command Input 2 SD_D3 I/O SDIO Data Line 3 3 SD_D2 I/O SDIO Data Line 2 4 SD_D1 I/O SDIO Data Line 1 5 SD_D0 I/O SDIO Data Line 0 6 SD_CLK I SDIO Clock Input 7 GND Ground connections 8 GND Ground connections 9 ANTENNA RF OUT 10 WAKE Wake Function 11 VDIOSDIO SDIO Voltage 1.8V-3.3V 12 3.3 Power Supply 13 CS P:POWER 3.
F89ESSM23 7.2 Power Consumption Mode Status Power(mW) Note 3.3Vx70mA =231 20M 3.3Vx75 mA =248 40M 3.3Vx75mA =248 20M 3.3Vx75 mA =248 40M 3.3Vx100 mA =330 20M 3.3Vx110 mA=363 40M Power save mode 3.3Vx20 mA =66 DTIM=100ms Device Disable 3.3Vx25 mA =82.5 Radio Off 3.3Vx0 mA =0 Link RX OS Windows XP TX 7.3 Interface Circuit time series 7.3.
F89ESSM23 TIH TODLY HS DEF HS DEF HS Input Hold Time Output Delay Time 6 5 2 - 14 14 ns ns ns ns ns 7.3.2 SDIO/GSPI Interface Signal Level The SDIO and GSPI signal level ranges from 1.8V to 3.3V. The DC characteristics of a typical signal level, 3.3V/2.8V/1.8V are shown in section 6.3.2 Digital IO Pin DC Characteristics, page 9. 7.3.3 SDIO Interface Power-On Sequence After power-on, the SDIO interface is selected by the RTL8189ES-VB automatically when a valid SDIO command is received.
F89ESSM23 Tnon_rdy: SDIO not ready duration. In this state the RTL8189ES may respond to commands without the ready bit set. After the ready bit is set, the host will initiate the full card detection procedure. Power-On Flow Description We recommend that the card detection procedures are divided into two phases: a 3.3V power pre-charge phase and a formal power-up phase. For the 3.3V power pre-charge phase, the power ramp up duration is not limited. The 3.
F89ESSM23 Definitions T33ramp’: The 3.3V power pre-charge ramp up duration before formal power up. We recommend that a 3.3V power-on and then power-off sequence is executed by the host controller before the formal power-on sequence. This procedure can eliminate the host card detection issue when the power ramp up duration is too long or the system warm reboot fails. Toff : The duration 3.3V is cut off before formal power up. T33ramp: The 3.3V main power ramp up duration. T12ramp: The internal 1.
F89ESSM23 8. Size reference 8.1 Module Picture L x W : 12.5 x 14 (+0.3/-0.1) mm H: 2.0 (±0.2) mm Weight 0.48g 8.
F89ESSM23 8.3 Layout Recommendation 9. The Key Material List Item Part Name 1 PCB 2 Description Manufacturer FN-8900 4L,FR4,TG150,14X12.
F89ESSM23 10. Recommended Reflow Profile Referred to IPC/JEDEC standard. Peak Temperature :<250。 c Number of Times ： 三 2 times 。 ” SI 1-2℃／ sec aax . (217℃ to peak) I peak :245+0t-5℃ m M Time (sec) 16 PW E bH t 啤 5 Lm 饨 ，－ 岳 40 -60sec llax . 2℃／sec .
F89ESSM23 12. Package 12.1 Reel A roll of 1500pcs 12.
F89ESSM23 Using self-adhesive tape Color of plastic disc: blue size ：350*350*35mm NY bag size:460mm*385mm The packing case size:350*210*370mmg FN-LINK TECHNOLOGY LIMITED 18
F89ESSM23 13. Moisture sensitivity The Modules is a Moisture Sensitive Device level 3, in according with standard IPC/JEDEC J-STD-020, take care all the relatives requirements for using this kind of components.
F89ESSM23 FCC/IC Statements (OEM) Integrator has to assure compliance of the entire end-product incl. the integrated RF Module. For 15 B (§15.107 and if applicable §15.109) compliance, the host manufacturer is required to show compliance with 15 while the module is installed and operating. Furthermore the module should be transmitting and the evaluation should confirm that the module's intentional emissions (15C) are compliant (fundamental / out-of-band).
F89ESSM23 compromettre le fonctionnement. Radio Frequency Exposure Statement for IC The device has been evaluated to meet general RF exposure requirements. The device can be used in mobile exposure conditions. The min separation distance is 20cm. Déclaration d'exposition aux radiofréquences pour IC L'appareil a été évalué pour répondre aux exigences générales en matière d'exposition aux RF. L'appareil peut être utilisé dans des conditions d'exposition mobiles.
F89ESSM23 Co-location Warning: This equipment could not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with the FCC multi-transmitter product procedures. Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01 2.2 List of applicable FCC rules FCC Part 15.247 2.
Hereby, FN-LINK TECHNOLOGY LIMITED declare that the radio equipment type wifi module is compliance with Directive 2014/53/EU. Operating Frequency Range WiFi 2412 - 2472 MHz The maximum RF Output Power 17.40dBm Manufacturer Information： Company: FN-LINK TECHNOLOGY LIMITED Address: No.8, Litong Road, Liuyang Economic & Technical Development Zone, Changsha, Hunan, CHINA Contact person: Jim Hu E-mail: jim@fn-link.
