欧智通科技 Fn-Link F89FTSM13-W3 WiFi Single-band 1X1 802.
FN-LINK TECHNOLOGY LIMITED CONTENTS 0 REVESION HISTORY............................................................................................................................................... 3 1.1 MODEL NO DEFINITION....................................................................................................................................... 3 1 2 3 4 5 INTRODUCTIONS........................................................................................................................
FN-LINK TECHNOLOGY LIMITED 0. Revision History REV NO Date Rev.1.0 2015-7-9 http://www.fn-link.
FN-LINK TECHNOLOGY LIMITED 1. Introduction 1.1 Overview F89FTSM13-W3 is a highly integrated and excellent performance Wireless LAN (WLAN) SDIO network interface device. High-speed wireless connection up to 150 Mbps. The general hardware for the module is shown in Figure 1. This WLAN Module design is based on Realtek RTL8189FTV. It is a highly integrated single-chip 1*1 SISO (Multiple In Multiple Out) Wireless LAN (WLAN) SDIO network interface controller complying with the 802.11n specification.
FN-LINK TECHNOLOGY LIMITED 2. GENERAL SPECIFICATION 2.1 WiFi RF Specifications Main Chipset RTL8189FTV Operating Frequency 2.400～2.4835GHz Standards WiFi: IEEE 802.11b, IEEE 802.11g, IEEE 802.11n, Modulation WiFi: 802.11b: CCK(11, 5.5Mbps), QPSK(2Mbps), BPSK(1Mbps), 802.11 g/n: OFDM PHY Data rates WiFi: 802.11b: 11,5.5,2,1 Mbps 802.11g: 54,48,36,24,18,12,9,6 Mbps 802.11n: up to 150Mbps Receiver Sensitivity 802.11b@11Mbps -82±1dBm 802.11g@54Mbps -71±1dBm 802.
FN-LINK TECHNOLOGY LIMITED 3. Mechanical Specification 3.1 Outline Drawing 3.2 PCB LAYOUT (Unit: ±0.15mm) http://www.fn-link.
FN-LINK TECHNOLOGY LIMITED 3.3 PIN Assignment Pin # Name Description 1 GND GND 2 RF RF OUTPUT 3 GND GND 4~8 NC NC 9 VBAT 3.3V Optional 10 NC NC 11 NC NC 12 WL_REG_ON WL_REG_ON 13 WL_HOST_WAKE WAKE UP 14 SDIO_DATA_2 SDIO_D2 15 SDIO_DATA_3 SDIO_D3 16 SDIO_DATA_CMD SDIO_CMD 17 SDIO_DATA_CLK SDIO_CLK 18 SDIO_DATA_D0 SDIO_D0 19 SDIO_DATA_D1 SDIO_D1 20 GND GND 21 NC NC 22 VDIO 1.8~3.
FN-LINK TECHNOLOGY LIMITED 32 NC NC 33 GND GND 34~35 NC NC 36 GND GND 37~40 NC NC 41 GND GND 42~44 NC NC 3.4 Application Circuit http://www.fn-link.
FN-LINK TECHNOLOGY LIMITED 4. Environmental Requirements 4.1 Operating & storage tempreture Operating Storage MTBF (Mean Time Between Failures) Temperature: -20°C to +70°C Relative Humidity: 10-90% (non-condensing) Temperature: -40°C to +80°C (non-operating) Relative Humidity: 5-90% (non-condensing) Over 150,000hours 4.2 Recommended Reflow Profile Referred to IPC/JEDEC standard. Peak Temperature : <250°C Number of Times : ≤2 times 4.
FN-LINK TECHNOLOGY LIMITED 3. Once opened, such as when not used up within 168 hours: 1). The module must be again to remove the module moisture absorption. 2). The baking temperature: 125 ℃, 8 hours. 3.) After baking, put the right amount of desiccant to seal packages. 5. PACKING INFORMATION 5.1 Blister packaging A piece of 100 PCS 5.2 Coiling Packaging A roll of 2000pcs http://www.fn-link.
FCC Statement: This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference. (2) This device must accept any interference received, including interference that may cause undesired operation. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules.
IMPORTANT NOTE: This module is intended for OEM integrator only and the OEM integrators and instructed to ensure that the end user has no manual instructions to remove or install the device. The OEM integrator is still responsible for the FCC compliance requirement of the end product, which integrates this module. Integration is typically strictly restricted to Grantee himself or dedicated OEM integrators under control of the Grantee.
