F88FTUM13
FN-LINK TECHNOLOGY LIMITED CONTENTS 0 REVESION HISTORY.......................................................................................................................................3 1 INTRODUCTIONS............................................................................................................................................. 4 2 3 1.1 OVERVEIW..........................................................................................................................................
FN-LINK TECHNOLOGY LIMITED 0. Revision History REV NO Date Rev1.0 2016-02-29 http://www.fn-link.
FN-LINK TECHNOLOGY LIMITED 1. Introduction 1.1 Overview F88FTUM13 is a highly integrated and excellent performance Wireless LAN (WLAN) USB2.0 network interface device. High-speed wireless connection up to 150 Mbps. The general hardware for the module is shown in Figure 1. This WLAN Module design is based on Realtek RTL8188FTV. It is a highly integrated single-chip 1*1 MIMO (Multiple In Multiple Out) Wireless LAN (WLAN) USB2.0 network interface controller complying with the 802.11n specification.
FN-LINK TECHNOLOGY LIMITED Transmit Output Power WiFi: 802.11b <16dBm 802.11g <14dBm 802.11n <13dBm EVM 802.11b /11Mbps : EVM≦-9dB 802.11g /54Mbps : EVM≦-25dB 802.11n /65Mbps : EVM≦-28dB 802.11b@8% PER 11Mbps -86dBm Receiver Sensitivity 802.11g@10% PER 54Mbps -73dBm 802.11n@10% PER HT20_MCS 7 -70dBm HT40_MCS 7 -66dBm WiFi 2.4GHz: Operating Channel 11: (Ch.
FN-LINK TECHNOLOGY LIMITED 3. Mechanical Specification 3.1 Outline Drawing (Unit: ±0.15mm) (TOP) http://www.fn-link.
FN-LINK TECHNOLOGY LIMITED 3.2 PIN Assignment Pin # Name Description 1 VDD33 3.3V DC power supply input 2 HSDM USB DATA- 3 HSDP USB DATA+ 4 GND Ground 5 CHIP_EN This Pin Can Externally Shutdown RTL8188FTV 6 Host_Wake_Dev Host Wake Device Input Pin 7 Dev_Wake_Host Device Wake Host Output Pin 8 GND RF GROUND 9 ANT External Antenna (2.4GHz 50Ohm ) http://www.fn-link.
FN-LINK TECHNOLOGY LIMITED 3.3 Application Circuit 4. Environmental Requirements 4.1 Operating& Storage Conditions Operating Storage MTBF (Mean Time Between Failures) Temperature: 0°C to +70°C Relative Humidity: 10-90% (non-condensing) Temperature: -40°C to +80°C (non-operating) Relative Humidity: 5-90% (non-condensing) Over 150,000hours 4.2 Recommended Reflow Profile Referred to IPC/JEDEC standard. Peak Temperature : <250°C Number of Times : ≤2 times http://www.fn-link.
FN-LINK TECHNOLOGY LIMITED 4.3 Patch WIFI modules installed before the notice: WIFI module installed note: 1. Please press 1 : 1 and then expand outward proportion to 0.7 mm, 0.12 mm thickness When open a stencil 2. Take and use the WIFI module, please insure the electrostatic protective measures. 3. Reflow soldering temperature should be according to the customer the main size of the products, such as the temperature set at 250 + 5 ℃ for the MID motherboard.
FN-LINK TECHNOLOGY LIMITED 5. PACKING INFORMATION 5.1 Blister packaging A piece of 100 PCS 5.2 Coiling Packaging A roll of 2000pcs http://www.fn-link.
FN-LINK TECHNOLOGY LIMITED 1 The module will be responsible to satisfy SAR/RF Exposure requirements, when the module integrated into any (portable, mobile, fixed) host device. 2AATL-F88FTUM13 http://www.fn-link.
FN-LINK TECHNOLOGY LIMITED This devic has been evaluated and shown compliant with the FCC RF Exposure limits under fixed exposure conditions (antennas are greater than 20cm from a person's body) when installed in certain specific OEM configurations. FCC Radiation Exposure Statement: This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
Attention: Limited Modular Approval ‐ this RF Module may not be sold to the generic public and requires professional installation. Due to the fact that this RF Module is not equipped with an own shielding, the end‐product incl. this RF Module has to show compliance to the FCC rules (15C / radiated emissions). (OEM) Integrator has to assure compliance of the entire end‐product incl. the integrated RF Module. Additional measurements (15C) and/or equipment authorizations (e.
