FLC-BTMDC746 Specification FLC-BTMDC746 Specification Type: Document Number: FLC-BTMDC746 Version: 0.1 Release Date: 08-10-2009 Flaircomm Technologies Inc. Address：No.5 Bibo Road, Keyuan Building, 4F, Zhangjiang Hi-Tech Park, Shanghai 201203, P.R.China Telephone: 86-21-51088733 Fax: 86-21-50276103 www.flaircomm.
FLC-BTMDC746 Specification Release Record Version Number 0.
FLC-BTMDC746 Specification TABLE OF CONTENTS 1. 1.1 1.2 INTR ODUCTION ................................................................................................................................ 5 BLOCK DIAGRAM OF THE FLC-BTMDC746 MODULE ......................................................................... 5 FEATURES ............................................................................................................................................ 5 2. GENERAL SPECIFICATION...............
FLC-BTMDC746 Specification TABLE OF FIGURES Figure 1 FLC-BTMDC746Bluetooth Solution for Car Electronics Systems .................................................. 5 Figure 4 FLC-BTMDC746 pin definition ....................................................................................................... 8 Figure 12 Recommended PCB Mounting Pattern ......................................................................................... 12 TABLE OF TABLES Table 2: General Specification .....................
FLC-BTMDC746 Specification 1. Introduction FLC-BTMDC746 is a fully integrated Bluetooth module. It is one of the BlueToneTM series products developed by Flaircomm. FLC-BTMDC746 is based on CSR’s Bluecore4-ROM with specific interface design to meet automobile industrial and mobile accessory customers’ needs. It complies with Bluetooth qualified certification and FCC. FLC-BTMDC746 complies with Bluetooth specification version 2.1+EDR Class 1. It integrates RF, Baseband controller, etc.
FLC-BTMDC746 Specification 2. General Specification Table 1: General Specification Product Model BlueToneTM Series Bluetooth Module FLC-BTMDC746 Bluetooth Specification Standard Frequency Band Modulation Method Maximum Data Rate Hopping RF Input Impedance Baseband Crystal OSC Bluetooth2.1, Class I 2.4~2.
FLC-BTMDC746 Specification Standby Current <0.
FLC-BTMDC746 Specification 3. Pin Definition 3.1 Pin Configuration and Package Dimensions Figure 2 FLC-BTMDC746 pin definition 3.2 Pin Definition Table 2: Pin Definition of FLC-BTMDC746 Pin Symbol I/O Type Description 1 GND Ground Ground connection. 2 VCC Power Positive power supply for RF circuitry. 3 MODE Input Not connected. 4 UART_RTS Output 5 UART_RXD Input 6 USB_D+ Differential USB data plus with built-in 1.5KOhm pull-up resistor. 7 USB_D- Differential USB data minis.
FLC-BTMDC746 Specification 10 GND Ground Ground connection. 11 VDD Power Positive supply for digital circuitry. 12 /RST Input Reset if low. Input debounced so must be low for > 5ms to cause a reset. 13 /SPI_CS Input Chip select for Serial Peripheral Interface device, active low. 14 SPI_CLK Input Serial Peripheral Interface clock. 15 SPI_MISO Output Serial Peripheral Interface data output. 16 SPI_MOSI Input Serial Peripheral Interface data input.
FLC-BTMDC746 Specification Terminal Min Typical Max Unit Input/Output Voltage Level 3.1 3.3 3.6 V VIL input logic low -0.4 - +0.8 V VIH input logic high 3.1 - 3.7 V VOL output logic low - - 0.2 V VOH output logic high 2.9 - - V Strong pull-up -100 -40 -10 uA Strong pull-down 10 40 100 uA Weak pull-up -5.0 -1.0 -0.2 uA Weak pull-down 0.2 1.0 5.
FLC-BTMDC746 Specification 4. FLC-BTMDC746 Interfaces Description 4.1 USB FLC-BTMDC746module contains a Full Speed (12Mbit/s) USB v2.0 interface operating as a USB client peripheral device. It is capable of driving the USB cable directly thus no external USB transceiver is required. It also features an internal USB pull-up resistor on USB_D+ signal to identify itself as a Full Speed USB device.
FLC-BTMDC746 Specification 5. Recommended PCB Mounting Pattern Figure 3 Recommended PCB Mounting Pattern 5.1 Layer Guidelines To obtain the optimal system performance, a system integrator incorporating this module into the design should follow the following PCB guidelines: Do not place any copper or metal near, underneath or above the antenna.
FLC-BTMDC746 Specification No more than one flow run. To ensure enough solder pastes are deposited on the soldering pads, the stencil should be at least 0.15mm thick. Always use a low residue “no clean” solder paste.
FLC-BTMDC746 Specification 6. Regulatory Compliances 6.1 Bluetooth FLC-BTMDC746 module complies with the following Bluetooth 2.0+EDR specifications: Radio Specification (Part A, Volume 2 Core System Package) Baseband Specification (Part A, Volume 2 Core System Package) Link Management Specification (Part C, Volume 2 Core System Package) HCI Specification (Part E, Volume 2 Core System Package) 6.
FLC-BTMDC746 Specification 6.3 CE FLC-BTMDC746 module conforms to the following standards, thus in accordance with the provisions of the EC Directives 89/336/EEC, 92/31/EEC and 93/68/EEC: EN 301 489-17 V.1.2.1: EN 55022, EN 55024, EN 61000 EN 300.328 V1.6.1 6.
FLC-BTMDC746 Specification 7.
