FLC-BTM501 Datasheet FLC-BTM501/FLC-BTMDC751 Datasheet Document Type: Bluetooth Module Datasheet Document Number: FLC-BTM501-DS Document Version: V1.6 Release Date: 2013/12/18 Copyright 2012~ 2014 by Flaircomm Microelectronics Inc., All Right Reserved Without written permission from Flaircomm Microelectronics Inc.
FLC-BTM501 Datasheet Release Record Version Release Date 1.0 1.1 1.2 1.3 1.4 1.5 1.6 2012/06/26 2012/09/06 2012/11/01 2012/11/16 2013/07/26 2013/08/15 2013/12/18 Flaircomm Microelectronics Confidential Comments Release Modify operating temperature. Modify power consumptions. Modify Features. Modify table of Mechanical Characteristic. Small modifications. Modify Mechanical Characteristic.
FLC-BTM501 Datasheet CONTENTS 1. 1.1 1.2 1.3 1.4 INTRODUCTION ............................................................................................................................................... 6 NAMING DECLARATION ..................................................................................................................................... 6 BLOCK DIAGRAM .....................................................................................................................................
FLC-BTM501 Datasheet 9. 10. RECOMMENDED REFLOW PROFILE ...................................................................................................... 29 ORDERING INFORMATION .................................................................................................................... 30 10.1 PRODUCT PACKAGING INFORMATION .............................................................................................................. 30 10.2 ORDERING INFORMATION .................................
FLC-BTM501 Datasheet TABLES AND FIGURES Table 1: Naming Declaration ........................................................................................................................................ 6 Table 2: General Specification ...................................................................................................................................... 9 Table 3: Pin Definition ................................................................................................................
FLC-BTM501 Datasheet 1. Introduction FLC-BTM501 is a small form factor, low power and highly economic Bluetooth radio module that allows OEM to add wireless capability to their products. The module supports multiple interfaces that make it simple to design into fully certified embedded Bluetooth solutions. With FLC’s AT+™ programming interfaces, designers can easily customize their applications to support different Bluetooth profiles, such HS/HF, A2DP, AVRCP, OPP, DUN, SPP, and etc.
FLC-BTM501 Datasheet 1.2 Block Diagram Balun Filter Antenna PIOs Microphone Input USB SPI BlueCore5-MM UART Speaker Outputs AUX_DAC AIOs Flash Crystal VDD Figure 1: Block Diagram 1.3 Features Bluetooth v2.1+EDR, Class 2 Profiles including HS/HF, A2DP, AVRCP, OPP, DUN, SPP, and etc. UART and USB programming and data interfaces Small form factor SMT pads for easy and reliable PCB mounting BQB/FCC/CE Certified RoHS compliant APTX 1.
FLC-BTM501 Datasheet Measurement and monitoring systems Industrial sensors and controls Medical devices Industrial PCs and laptops Flaircomm Microelectronics Confidential -8-
FLC-BTM501 Datasheet 2. General Specification Bluetooth Specification Standard Bluetooth2.1+EDR, Class II Profiles HS/HF, A2DP, AVRCP, OPP, DUN, SPP, etc. detailed profiles depends on the firmware Frequency Band 2.402GHz ~ 2.480GHz Maximum Data Rate 3Mbps RF Input Impedance 50 ohms Baseband Crystal OSC 16MHz Interface Sensitivity RF TX Power UART, PIO, AIO, USB, SPI, Speaker, Microphone, etc. -86dBm@0.1%BER 4dBm Power Supply Voltage 2.7V ~ 3.
FLC-BTM501 Datasheet 3. Pin Definition 3.1 Pin Configuration Figure 2: Pin Configuration 3.
FLC-BTM501 Datasheet pull-down only CMOS input with weak internal pull-up Chip select for Synchronous Serial Interface for programming only, active low 6 SPI_CSB 7 PIO10 Bi-directional with programmable strength internal pull-up/down Programmable input/output line 8 PIO11 Bi-directional with programmable strength internal pull-up/down Programmable input/output line 9 PIO5 Bi-directional with programmable strength internal pull-up/down Programmable input/output line 10 PIO3 Bi-directional
FLC-BTM501 Datasheet 33 GND Ground Ground 34 PIO14 Bi-directional with programmable strength internal pull-up/down Programmable input/output line 35 PIO9 Bi-directional with programmable strength internal pull-up/down Programmable input/output line 36 PIO4 Bi-directional with programmable strength internal pull-up/down Programmable input/output line 37 GND Ground Ground 38 UART_TX Bi-directional CMOS output, tristate, with weak internal pull-up UART data output 39 UART_RX CMOS inpu
FLC-BTM501 Datasheet 4. Physical Interfaces 4.1 Power Supply The transient response of the regulator is important. If the power rails of the module are supplied from an external voltage source, the transient response of any regulator used should be 20μs or less. It is essential that the power rail recovers quickly. 4.2 Reset The module may be reset from several sources: RESETB pin, power-on reset, a UART break character or via a software configured watchdog timer.
FLC-BTM501 Datasheet 4.
FLC-BTM501 Datasheet 4.3.4 DAC The DAC contains two second order Sigma Delta converters allowing two separate channels that are identical in functionality as show in Figure 3. 4.3.5 DAC Sample Rate Selection and Warping Each DAC supports the following sample rates: 8kHz, 11.025kHz, 16kHz, 22.05kHz, 24kHz, 32kHz, 44.1kHz, 48kHz.
FLC-BTM501 Datasheet The gain of the output stage is controlled by a 3-bit programmable resistive divider, which sets the gain in steps of approximately 3dB. The multi-bit stream from the digital circuitry is low pass filtered by a second order bi-quad filter with a pole at 20kHz. The signal is then amplified in the fully differential output stage, which has a gain bandwidth of typically 1MHz. 4.4 RF Interface The module integrates a balun filter.
FLC-BTM501 Datasheet 4.7 Serial Interfaces 4.7.1 UART This is a standard UART interface for communicating with other serial devices. The UART interface provides a simple mechanism for communicating with other serial devices using the RS232 protocol. When the module is connected to another digital device, UART_RX and UART_TX transfer data between the two devices. The remaining two signals, UART_CTS and UART_RTS, can be used to implement RS232 hardware flow control where both are active low indicators.
FLC-BTM501 Datasheet 7.1.5 of the USB specification v1.2. The internal pull-up pulls USB_DP high to at least 2.8V when loaded with a 15kΩ ±5% pull-down resistor (in the hub/host) when VDD =3.1V. This presents a Thevenin resistance to the host of at least 900Ω. Alternatively, an external 1.5kΩ pull-up resistor can be placed between a PIO line and DP on the USB cable. 4.7.2.
FLC-BTM501 Datasheet 4.7.2.2 Bus-Powered Mode In bus-powered mode, the application circuit draws its current from the 5V VBUS supply on the USB cable. The module negotiates with the PC during the USB enumeration stage about how much current it is allowed to consume. For Class 2 Bluetooth applications, FLC recommends that the regulator used to derive 3.3V from VBUS is rated at 100mA average current and should be able to handle peaks of 120mA without foldback or limiting.
FLC-BTM501 Datasheet Figure 8: Example EEPROM Connection with I2C Interface 4.7.4 SPI The synchronous serial port interface (SPI) can be used for system debugging. It can also be used for in-system programming for the flash memory within the module. SPI interface uses the SPI_MOSI, SPI_MISO, SPI_CSB and SPI_CLK pins. Testing points for the SPI interface are reserved on board in case that the firmware shall be updated during manufacture.
FLC-BTM501 Datasheet 5. Electrical Characteristic 5.1 Absolute Maximum Rating Rating Min Max Unit Storage Temperature -40 +120 °C PIO/AIO Voltage -0.4 +3.6 V VDD_3V3 Voltage -0.4 +3.6 V USB_DP/USB_DN Voltage -0.4 +3.6 V Other Terminal Voltages except RF -0.4 VDD+0.4 V Min Typical Max Unit Storage Temperature -40 -- +85 °C Operating Temperature Range (for A and I grade) -40 -- +85 °C Operating Temperature Range (for V and C grade) -20 -- +70 °C VDD_3V3 Voltage +2.
FLC-BTM501 Datasheet -5 -1.0 -0.2 μA -0.2 +1.0 5.0 μA I/O pad leakage current -1 0 +1 μA CI Input Capacitance 1.0 - 5.0 pF Resistive Strength Rpuw weak pull-up strength at VDD-0.2V 500k - 2M Ω Rpdw weak pull-up strength at 0.2V 500k - 2M Ω Rpus strong pull-up strength at VDD-0.2V 10k - 50k Ω Rpds strong pull-up strength at 0.2V 10k - 50k Ω With weak pull-up With weak pull-down Table 9: Digital Terminal 5.3.
FLC-BTM501 Datasheet 5.3.4 Internal CODEC - Digital to Analogue Converter Parameter Resolution Output Sample Rate, Fsample Signal / Noise, fin=1kHz, BW=20Hz>20kHz A-Weighted THD+N<0.01% 0dBFS signal Load-100kΩ Fsample = 8kHz Fsample = 11.025kHz Fsample = 16kHz Fsample = 22.05kHz Fsample = 32kHz Fsample = 44kHz Fsample = 48kHz Digital Gain Gain Resolution Min Typical Max Unit 8 - 16 48 Bits kHz -24 95 95 95 95 95 95 95 1/32 21.
FLC-BTM501 Datasheet 5.4 Power consumptions Search Unconnected (Deep Sleep Idle Mode) Connected Idle Play with Minimum Volume Play with Maximum Volume Shutdown ~30mA ~0.
FLC-BTM501 Datasheet 6.
FLC-BTM501 Datasheet 7.
FLC-BTM501 Datasheet 8. Recommended PCB Layout and Mounting Pattern Placement and PCB layout are critical to optimize the performances of a module without on-board antenna designs. The trace from the antenna port of the module to an external antenna should be 50 and must be as short as possible to avoid any interference into the transceiver of the module. The location of the external antenna and RF-IN port of the module should be kept away from any noise sources and digital traces.
FLC-BTM501 Datasheet General design recommendations are: The length of the trace or connection line should be kept as short as possible. Distance between connection and ground area on the top layer should at least be as large as the dielectric thickness. Routing the RF close to digital sections of the system board should be avoided. To reduce signal reflections, sharp angles in the routing of the micro strip line should be avoided.
FLC-BTM501 Datasheet 9. Recommended Reflow Profile The soldering profile depends on various parameters necessitating a set up for each application. The data here is given only for guidance on solder reflow. ℃ 250 217 210 A 25 0 B 1 2 C 3 D 4 E 5 6 min Figure 15: Recommended Reflow Profile Pre-heat zone (A) — This zone raises the temperature at a controlled rate, typically 0.5 – 2 C/s. The purpose of this zone is to preheat the PCB board and components to 120 ~ 150 C.
FLC-BTM501 Datasheet 10. Ordering Information 10.
FLC-BTM501 Datasheet Figure 17: Product Packaging Information (Tray) Flaircomm Microelectronics Confidential -31-
FLC-BTM501 Datasheet 10.2 Ordering information FLC-BTM501XYZA Product Revision Shipping Package Product Package Product Grade Figure 18: Ordering Information 10.2.1 Product Revision Product Revision Product Grade Availability A B D E C/V C/V A/I A/I Yes Yes Yes Yes Table 16: Product Revision 10.2.2 Shipping Package Shipping Package 0 1 2 Description Quantity Availability Foam Tray Plastic Tray Tape — 100x10x3 = 3000 1000x5 = 5000 No Yes Yes Table 17: Shipping Package 10.2.
11. Cautions &Warnings 11.1 EU Regulatory Conformance Hereby, Flaircomm Microelectronics,Inc. declares that this device is in compliance with the essential requirements and other relevant provisions of Directive 1999/5/EC. The product is conformity with the following standards. SAFETY (Art. 3.1(a)): • EN 60950-1:2006+A11:2009:+A1:2010+A12:2011+A2:2013 HEALTH (Art. 3.1(a)): • EN 62479:2010 EMC (Art. 3.1(b)): • EN 301 489-1 V1.9.2:2011 • EN 301 489-17 V2.2.1:2012 RADIOS (Art. 3.2) • EN 300 328 V1.9.
1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required.
As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.