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FM101-CG

Hardware Guide

V1.0

Summary of content (74 pages)

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FM101-CG Hardware Guide V1.
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Copyright Copyright ©2021 Fibocom Wireless Inc. All rights reserved. Without the prior written permission of the copyright holder, any company or individual is prohibited to excerpt, copy any part of or the entire document, or transmit the document in any form. Notice The document is subject to update from time to time owing to the product version upgrade or other reasons. Unless otherwise specified, the document only serves as the user guide.
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Contents Contents Change History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 1. Foreword . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1.1. Document Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1.2. Safety Instructions . . . . . . . . . . . . . . . . . . . . . . . . .
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Contents 5.2.1.3. Power Off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 5.2.2. Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 5.3. LED1# . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 5.4. (U)SIM Card Interface . . . . . . . . . . . . . . . . . . . . . . . .
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Contents 6.4. Receiving Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 6.5. GNSS Receiving Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 6.6. Antenna Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 6.7. PCB Routing Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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Contents Appendix A: Acronyms and Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 Copyright © Fibocom Wireless Inc.
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1. Foreword 1. Foreword 1.1. Document Description This document describes the electrical characteristics, RF performance, dimensions and application environment, etc. of the FM101-CG wireless module. With the assistance of this document and other related documents, application developers can quickly understand the hardware functions of the FM101-CG module and develop product hardware. 1.2.
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1. Foreword The mobile device does not guarantee that an effective connection can be made under any circumstances, for example, when there is no prepayment for the mobile device or (U)SIM is invalid. When you encounter the above situation in an emergency, please remember to use emergency calls, and ensure that your device is turned on and in an area with strong signal. Your mobile device receives and transmits RF signals when it is powered on.
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2. Product Overview 2. Product Overview 2.1. Product Introduction Fibocom FM101-CG module is designed based on Qualcomm SDX12 platform, supporting Cat 6 network level, and supporting CA network architecture. FM101-CG integrates Baseband, Memory, PMIC, Transceiver, PA and other core devices, supporting TDD-LTE. The maximum downlink rate supported in CA mode is 261 Mbps, and the maximum uplink rate is 30 Mbps. FM101-CG is designed with M.
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2. Product Overview Table 3. Modulation features System FM101-CG Support 3GPP R12 LTE Support DL 64QAM, 16QAM and QPSK modulations Support UL 16QAM and QPSK modulation Support RF bandwidth 5 MHz to 20 MHz 2.2.2. Other Key Features Table 4. Other key features Item Power supply Processor Storage Supported systems Power class Satellite positioning Description DC: 3.135 V–4.4 V Typical voltage: 3.8 V Qualcomm SDX12, 14nm process, single-core ARM Cortex-A7, up to 1.
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2. Product Overview Item PCIe interface SIM interface 2 I C interface Physical characteristic Description PCIe Gen2 x 1Lane, the maximum transmission rate is 5GT/s, and RC mode is supported 2 groups of SIM card interfaces, supporting dual SIM single standby Support USIM: 1.8 V and 3 V 2 1 group I C with a maximum speed of 3.4 Mbps Dimensions: 30 mm × 42 mm × 2.3 mm Packaging: M.
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2. Product Overview 2.3. Supported CA Combinations Table 5. CA combinations supported by FM101-CG Combination FM101-CG 2DLCA B42C B48C 2.4. Functional Block Diagram Functional block diagram shows the main hardware functions of the FM101-CG module, including the baseband and RF functions. Baseband section • CPU • PMIC • LPDDR2 • NAND • USB, PCIe, (U)SIM, PCM/I2S, I2C • LTE TDD controller RF section • RF Transceiver • RF PA • RF Switch • RF filter • Antenna Copyright © Fibocom Wireless Inc.
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2. Product Overview Figure 1. Functional block diagram 2.5. Evaluation Board Fibocom provides EVB-M.2 evaluation board to facilitate module debug and testing. For how to use it, see FIBOCOM EVB-M2 User Guide. Copyright © Fibocom Wireless Inc.
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3. Pin Definition 3. Pin Definition 3.1. Pin Distribution The FM101-CG module uses M.2 packaging and have 75 pins in total. The following figure shows the pin mapping. Figure 2. Pin mapping Copyright © Fibocom Wireless Inc.
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3. Pin Definition 3.2. Pin Function The FM101-CG module pin function is described in the following table. Table 6. M.2 pin function description Pin Number Pin Name I/O Reset Status Pin Description Type NC, WWAN-PCIe is configured for FM101-CG module, USB_SS 1 2 CONFIG_3 VCC DO PI NC * interface type M.
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3. Pin Definition Pin Reset Pin Name I/O 11 GND -- -- Ground 12 Notch * * Notch groove * 13 Notch * * Notch groove * 14 Notch * * Notch groove * 15 Notch * * Notch groove * 16 Notch * * Notch groove * 17 Notch * * Notch groove * 18 Notch * * Notch groove * 19 Notch * * Notch groove * 20 I2S_SCK DO PD I S serial clock, reserved Number Status Pin Description 2 Type Power supply CMOS 1.
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3. Pin Definition Pin Number 26 27 Pin Name W_DISABLE2 # GND I/O DI -- Reset Status PU -- Pin Description Type GNSS positioning is disabled, CMOS active low, reserved 3.3V/1.8V Ground 29 I2S_WA USB_SS_TX_ M DO PD DO * 30 UIM1_RESET DO L 31 USB_SS_TX_P AO * 32 UIM1_CLK DO L CMOS channels, reserved 1.
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3. Pin Definition Pin Number 39 Pin Name I/O GND -- Reset Status -- Pin Description Ground Type Power supply SIM card 2 detection, and 40 SIM2_DETEC T external pull-up and pull-down DI * are required. A card is available at high level by default, CMOS 1.
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3. Pin Definition Pin Number Pin Name I/O Reset Status Pin Description Type PCIe clock request signal, active 52 CLKREQ# DIO T low, open drain output, an CMOS external pull-up resistor needs 3.3V/1.
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3. Pin Definition Pin Number 63 64 65 Pin Name I/O GRFC5* DO COEX_UART_ TXD* GRFC4* DO Reset Status PD -- Pin Description Type Tuned antenna control bit 2, CMOS reserved 1.8V LTE and WLAN share a serial CMOS port transmission signal line, 1.8V reserved DO PD Tuned antenna control bit, * reserved SIM card 1 detection, external 66 UIM1_DETEC T DI PU pull-up and pull-down are CMOS required. A card is available at 1.8V high level by default 67 RESET_N DI PU Module reset.
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3. Pin Definition Pin Number 74 Pin Name I/O VCC PI Reset Status * Pin Description Power input Type Power supply NC, WWAN-PCIe is configured for FM101-CG module, USB_SS 75  CONFIG_2 DO NC interface type M.2 module -- Pins marked with * are reserved functions or under development. Unused pins remain floating. Table 7.
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4. Electrical Characteristics 4. Electrical Characteristics 4.1. Limit Voltage Range The limit voltage includes the absolute limit voltage and the operating limit voltage. The absolute limit voltage is the maximum voltage that the module can bear, beyond which the module may be damaged. The operating limit voltage is the normal operating voltage range of the module, beyond which the module will have an abnormal performance. 4.1.1.
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4. Electrical Characteristics Table 10. Recommended operating voltage (power supply) Parameter I/O Minimum Value (V) Typical Value Maximum Value (V) VBAT PI 3.135 3.8 4.4 USIM1_VDD PO 1.75/2.8 1.8/2.85 1.85/2.928 USIM2_VDD PO 1.75/2.8 1.8/2.85 1.85/2.928 4.2. Power Consumption The power consumption of FM101-CG module measured under 3.8 V power supply is described in the following table. For AT commands used for USB sleep and wakeup, see Fibocom_FM101_AT Commands User Manual. Table 11.
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4. Electrical Characteristics Table 12. 2CA power consumption 2CA Typical Combination Transmitting Band@FRB@Data Transmission Status Typical Current (mA) 42C B42+B42 @+21dBm TBD 48C B48+B48 @+21dBm TBD Copyright © Fibocom Wireless Inc.
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5. Functional Interface 5. Functional Interface 5.1. Power Supply The following table describes the power interface of FM101-CG module. Table 13. Power interface Pin Name I/O Pin Number VBAT PI 2,4, 70, 72, 74 GND G 3, 5, 11, 27, 33, 39, 45, 51, 57, 71, 73 Description Module power supply, 3.135V–4.4V, 3.8V is recommended GND, all GND pins must be grounded Power Input The FM101-CG module is powered on through the VBAT pin. The following figure shows the recommended power supply design. Figure 3.
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5. Functional Interface The filter capacitor design of power supply is shown in the following table. Table 14. Power supply filter capacitor design Recommended Capacitor Application Description To reduce the power supply fluctuation when the module works, it is required to 330uF x 2 Voltage stabilizing adopt low ESR capacitor, which is not less capacitor than 440uF, and the driving capacity of VBAT power supply current is not less than 2.0 A.
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5. Functional Interface 5.2. Control Interface The module has three control signals for power on/off and reset of the module. The pins are defined in the following table. Table 15. Control signal Pin Name I/O Pin Number Description In the power-on state, pull down RESET_N for 0.5s RESET_N DI 67 to 3s, and then release it. The module is reset. The chip is internally pulled up. Module on/off signal, pull up to power on, and pull FULL_CARD_ POWER_OFF DI 6 #(3.3V/1.8V) down to power off.
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5. Functional Interface Figure 5. AP controls the power-on circuit of the module 5.2.1.2. Power-on Sequence The following figure shows the power-on sequence. Figure 6. Power-on sequence (FCPO#) Before pulling the FCPO# pin high, ensure that the VBAT voltage is stable.  It is recommended that the time interval between powering on VBAT and pulling low or high the power-on control pin is not less than 40ms. The power-on control is automatically pulled up inside the module. 5.2.1.3.
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5. Functional Interface recommended power-off sequence is shown in the following figure. Figure 7. Recommended power-off sequence 5.2.2. Reset FM101-CG module can be reset by hardware and software. Table 16. Reset methods Reset Method Action Hardware reset Pull down the RESET_N pin for 0.5s or more, and then release Software reset Send the AT+CFUN=15 command Figure 8. OC drive reset reference circuit Copyright © Fibocom Wireless Inc.
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5. Functional Interface S1 RESET_N TVS Close to S1 Figure 9. Button reset reference circuit Figure 10. Reset sequence It is recommended to wait at least 20 seconds between two reset  operations. The RESET pin can be internally pulled up, without external pull-up. Keep the pin floating when it is not used. 5.3. LED1# The LED1# signal is used to indicate the operating status of the module, as described in the table below. Copyright © Fibocom Wireless Inc.
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5. Functional Interface Table 17. Network status indication Module Operating Mode LED1# Signal RF function is enabled Low level (LED on) RF function is disabled High level (LED off) The LED driver circuit is shown in the following figure. Figure 11. Reference circuit of network status indicators 5.4. (U)SIM Card Interface FM101-CG module has built-in (U)SIM card interface, and supports 1.8 V and 3.0 V (U)SIM cards. 5.4.1.
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5. Functional Interface Pin Number Pin Name I/O Reset Status Description Type USIM2 detection Active high by default. And high level 40 SIM2_DETECT DI -- indicates a SIM card is inserted; and low level 1.8V indicates a SIM card is removed. 42 UIM2_DATA DIO L USIM1 data 1.8V/3V 44 UIM2_CLK DO L USIM1 clock 1.8V/3V 46 UIM2_RESET DO L USIM1 reset 1.8V/3V 48 UIM2_PWR PO -- USIM1 power supply 1.8V/3V USIM1 detection Active high by default.
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5. Functional Interface Card connector VDD DAT VDD-EXT-1V8 CLK RST 20K 47K 47K VPP CD USIM1_CLK USIM1_RST USIM1_DET GND NC NC NC USIM1_VDD USIM1_DATA 33pF 0.1uF Module 22R 22R 22R 1K Card connector 20K USIM2_VDD RST 1K VPP CD GND NC 0.1uF USIM2_DET CLK 22R NC USIM2_RST DAT 22R NC USIM2_CLK VDD 22R 33pF USIM2_DATA Figure 12. (U)SIM card slot with card detection signal 5.4.3. (U)SIM Card Hot Plug The FM101-CG series module supports the (U)SIM card hot plug function.
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5. Functional Interface AT Command AT+MSMPD=0 Function (U)SIM card hot plug detection is disabled Remark Effective after restart 5.4.4. (U)SIM Design Requirements (U)SIM circuit design must meet EMC standards and ESD requirements, and at the same time, EMS capability must be improved to ensure that the (U)SIM can work stably.
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5. Functional Interface 5.5. USB Interface FM101-CG module supports USB 3.0 (5 Gb/s) ultra-high-speed data transmission, and is also compatible with USB high-speed (480 Mb/s) for download, debugging, data transmission and other functions. USB pin definition is shown in the following table. Table 20. USB pin definition Pin Name I/O Pin Number Description USB_DP AIO 7 USB 2.0 differential data signal (+) USB_DM AIO 9 USB 2.0 differential data signal (–) USB_SS_TX_M AO 29 USB 3.
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5. Functional Interface 5.5.2. USB Routing Rules 5.5.2.1. USB 2.0 Routing Rules Since the module supports USB 2.0 High-Speed, TVS Junction capacitance on the USB_D+/D– differential signal line must be less than 1 pF, and a 0.5 pF TVS is recommended. USB_D– and USB_D+ are high speed differential signal lines with the maximum transmission rate of 480 Mbit/s. The following rules must be strictly followed in PCB layout: • USB_D– and USB_D+ signal lines should have the differential impedance of 90Ω±10Ω.
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5. Functional Interface difference should be controlled less than 0.15 mm, avoiding right-angle traces. • Traces between differential pairs must be parallel with equal length, and the length difference should be controlled less than 10 mm, avoiding right-angle traces. • The two pairs differential signal lines should be routed on the layer that is closest to the ground layer, and protected with GND all around. 2 5.6.
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5. Functional Interface Table 22.
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5. Functional Interface Figure 14. Reference circuit of the PCM interface external Codec chip 5.8. PCIe Interface FM101-CG module supports a group of PCIe GEN 2.0 x 1 lanes. Table 23.
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5. Functional Interface 5.8.1. PCIe Routing Rules FM101-CG module supports PCIe 2.0 x1, including three differential pairs: transmitting pair TXP/N, receiving pair RXP/N and clock pair CLKP/N. PCIe can achieve the maximum transmission rate of 5GT/s. The following rules must be strictly followed in PCB layout: • The differential signal pairs are required to be parallel traces with equal length, and the difference in length is less than 0.15 mm.
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5. Functional Interface Figure 15. PCIe routing requirements • The difference in length of two data lines in differential pair should be within 0.15 mm, and the length match must be met for all parts. When the length match is conducted for the differential lines, the designed position of correct match should be close to that of incorrect match, as shown in the following figure.
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5. Functional Interface Figure 17. PCIe application circuit 5.9. Flight Mode Control Interface W_DISABLE_N pin is described in the following table. Table 24. W_DISABLE_N pin description Pin Name I/O Pin Number W_DISABLE_N DI 26 Description Module flight mode control (internal pulled up by default) FM101-CG module supports two ways as described in the following table to enter flight mode: Copyright © Fibocom Wireless Inc.
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5. Functional Interface Table 25. Ways for module to enter flight mode Send AT+GTFMODE=1 to turn on the hardware control flight 1 Hardware GPIO interface control mode function; pulled up or float the pin The module is in normal mode when W_DISABLE# pin is pulled up by default. When this pin is pulled down, the module enters flight mode. The module uses software to control the flight mode by 2 AT command default. When AT+GTFMODE=0: control run the AT+CFUN=0 command to enter flight mode.
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6. Radio Frequency 6. Radio Frequency 6.1. RF Interface 6.1.1. RF Interface Function The FM101-CG module supports three RF connectors used for external antenna connection. As shown in the following figure, "M" refers to the RF main antenna for receiving and transmitting RF signals; "D" refers to the diversity antenna for receiving diversity RF signals; "G" refers to GNSS antenna. 6.1.2.
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6. Radio Frequency 6.1.3. RF Connector Dimensions FM101-CG module adopts standard M.2 module RF connectors, the model name is 818004607 from ECT company, and the connector dimensions are 2 mm × 2 mm × 0.6 mm, as shown in the following figure. Figure 18. RF connector dimensions Figure 19. 0.81 mm coaxial cable matched RF connector dimensions Copyright © Fibocom Wireless Inc.
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6. Radio Frequency Figure 20. 0.81 mm coaxial cable snap-in RF connector dimensions 6.2. Operating Bands Table 27. Operating bands Band Mode Transmit (MHz) Receive (MHz) Band 42 LTE TDD 3400~3600 3400~3600 Band 43 LTE TDD 3600~3800 3600~3800 Band 48 LTE TDD 3550–3700 3550–3700 6.3. Transmitting Power The following table describes the RF output power of FM101-CG module. Table 28.
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6. Radio Frequency 6.4. Receiving Sensitivity Table 29. FM101-CG dual antenna receiving sensitivity Mode Main Set Sensitivity Diversity Sensitivity Typ (dBm) Typ (dBm) Band 42 -97 -98 Band 43 -97 -98 Band 48 -97 -98 Band LTE TDD 6.5. GNSS Receiving Performance The GNSS of FM101-CG module supports GPS/GLONASS/BDS/GALILEO, and the performance parameters of GNSS are shown in the following table. Table 30.
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6. Radio Frequency 6.6. Antenna Design Antenna indicators The antenna requirements for FM101-CG module are described in the following table. Table 31. Module Antenna Requirements FM101-CG module main antenna requirements VSWR: ≤ 2 Input power: > 28dBm LTE Input impedance: 50Ω Antenna gain: < 3.6dBi Antenna isolation: > 25dB Antenna correlation coefficient: < 0.
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6. Radio Frequency performance is closely related to this cabling. PCB parameters that will affect the cabling impedance include: • Trace width and thickness • Dielectric constant and thickness of media • Thickness of pad • Distance from ground line • Nearby traces 6.7.2. Impedance Design The RF impedance of the two antennas’ interface should to be controlled within 50Ω.
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6. Radio Frequency layer is on Lay 2 (GND layer). The stacking varies with PCB vendor, the following figure is taken as an example. Figure 22. Four layers (1+2+1) thickness Table 32. Four-layer board stacking thickness Layer Material Thickness (um) -- Solder Mask -- Lay 1 0.33OZ+Plating 25 -- PP 1080 65 Lay 2 0.5OZ+Plating 25 -- 0.510 mm (H/H OZ) 508 Lay 3 0.510 mm+Plating 25 -- PP 1080 65 Lay 4 0.
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6. Radio Frequency Figure 23. RF traces 50Ω impedance calculation: If the value of D1 exceeds 3 times of W1, it has weak effect on impedance. Figure 24. Impedance calculation for four-layer board top layer trace 6.8. Main Antenna Design 6.8.1. External Antenna The external antenna has good performance. The antenna is placed outside the complete machine, the antenna space is large, and the antenna performance is not easy to be Copyright © Fibocom Wireless Inc.
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6. Radio Frequency affected by the internal environment of the complete machine, so that the antenna does not need to be independently designed for each project. The compatibility is good. Most of the interfaces of such antennas are SMA interfaces. Figure 25. External antenna 6.8.2. Internal Antenna 6.8.2.1. Design Principle of Internal Antenna Placement • The antenna shall be arranged in the corners of the module. • Avoid placing metal elements near the antenna.
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6. Radio Frequency • RF ground shall be designed properly, PCB board and edge of ground shall be provided with "ground wall", and antenna led from RF module shall be made into microstrip line. • The antenna RF feeding point pad is a round rectangular pad with the size of 2 mm × 3 mm. All layers of PCB that include the pad and surrounding and that are equal to and greater than 0.8 mm are not covered with copper. • The center distance between RF and ground pad shall be between 4 mm and 5 mm. 6.8.2.2.
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6. Radio Frequency Figure 26. Location of the signal point and GND point of PIFA • Main board There is complete paving in the antenna projection area. Do not place any component in the antenna area. The recommended length of PCB board should be 90 mm to 110 mm. The antenna performance is better if the board length is 105 mm. • Structure of PIFA antenna ◦ Bracket The antenna consists of plastic bracket and metal sheet (radiator). Plastic bracket and metal sheet are fixed by hot melt method.
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6. Radio Frequency Figure 27. Pad design requirement • Requirements on height and area Operating Band Height Area GSM/DCS > 6mm > 15mm × 40mm GSM/DCS/PCS > 6.5mm > 17mm × 40mm > 8mm > 20mm × 45mm GSM850/GSM900/DCS1800/PC S1900  For details about LTE antenna design, refer to the area requirement of GSM antenna. Monopole antenna • Antenna structure There is one feeding point between the antenna and main board, which is module output.
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6. Radio Frequency Antenna ≥5.0mm PCB motherboard ≥9.0mm Figure 28. Antenna location • Main board There should be no paving or PCB in the antenna projection area. Do not place any component in the antenna area. The recommended length of PCB board should be 80 mm to 100 mm. The antenna performance is improved if the board length is 95mm. Antenna PCB motherboard Figure 29. Requirements for antenna projection area • Structure of monopole antenna For details, see Structure of PIFA antenna.
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6. Radio Frequency Operating Band GSM850/GSM900/DCS1800/PC S1900  Height Area > 6 mm > 40 mm × 10 mm For details about LTE antenna design, refer to the area requirement of GSM antenna. IFA antenna IFA antenna shares similarity with Monopole antenna and PIFA antenna. IFA antenna has two feeding branches, and allows ground under the antenna. The antenna has better stability than Monopole antenna, and the antenna space requirement is between Monopole antenna and PIFA antenna.
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6. Radio Frequency 6.8.3. Surrounding Environment Design of Internal Antenna 6.8.3.1. Handling of Speaker Connecting beads or inductors on speaker can reduce the impact on RF. 6.8.3.2. Handling of Metal Structural Parts All the metal structural parts must be grounded correctly and reliably, and the circuit part must be shielded. 6.8.3.3. Handling of Battery • The battery should be far away from antenna. ◦ Monopole antenna: The distance between battery and antenna is equal to or greater than 5 mm.
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6. Radio Frequency 6.8.3.4. Location of Large Components in Antenna Area Do not place large metal components such as oscillator, speaker, and receiver around the antenna; they may greatly affect the electrical performance of antenna. Do not spray the cover of the antenna with conductive paint; be cautious when you use plating. Figure 31. Location of large components 6.8.4.
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6. Radio Frequency • Poor speaker layout will affect antenna performance. • Poor battery layout will affect antenna performance. Factors that would affect receiving performance • If both the conductive performance of module and the radiated power of antenna meet requirement, then low sensitivity may be caused by main board design issue. • Poor coupling sensitivity is caused by poor circuit design of LCD, LDO, and DC/DC. • Device receiving performance is affected by VCXO or TVCXO harmonic of 19.
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6. Radio Frequency can resist against fading and improve throughput. • The customer is recommended to design the corresponding antenna according to the antenna requirements of each module antenna port. • The design method of diversity antenna and MIMO antenna is consistent with that of main antenna. It is recommended to control the difference of the efficiency of diversity antenna and MIMO antenna from that of main antenna by no more than 3dB.
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7. Thermal Design 7.
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8. Electrostatic Protection 8. Electrostatic Protection Although the ESD problem has been considered and ESD protection has been completed in the FM101-CG module design, the ESD problem may also occur in transportation and secondary development. Developers should consider ESD protection in the final product. In addition to ESD in packaging, customers should consider the recommended circuit of the interface design in the document during module application.
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9. Structural Specifications 9. Structural Specifications 9.1. Product Appearance The appearance of the FM101-CG module is shown in the following figure. Figure 32. Product appearance 9.2. Structural Dimensions The structural dimensions of the FM101-CG module is shown in the following figure. The unit is mm. Copyright © Fibocom Wireless Inc.
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9. Structural Specifications Figure 33. Structural dimensions 9.3. Package The FM101-CG module uses the tray sealed packing, combined with the outer packing method using the hard cartoon box, so that the module can be protected to the greatest extent in the processes of storage, transportation and usage.  The module is a precision electronic product, and may suffer permanent damage if no correct electrostatic protection measures are taken. Tray Package The FM101-CG module uses tray package.
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9. Structural Specifications Figure 34. Tray package Tray Size The tray size of FM101-CG module is 330 mm × 175 mm × 6.5 mm, as shown in the following figure. Figure 35. Tray size (unit: mm) 9.4. Storage Storage conditions (recommended): The temperature is 23℃ ± 5℃, and the relative humidity is less than RH 60%. Copyright © Fibocom Wireless Inc.
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9. Structural Specifications Storage period: Under the recommended storage conditions, the storage life is 12 months. Copyright © Fibocom Wireless Inc.
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Appendix A: Acronyms and Abbreviations Appendix A: Acronyms and Abbreviations bps Bits Per Second CA Carrier Aggregation DLCA Downlink Carrier Aggregation DRX Discontinuous Reception Imax Maximum Load Current LED Light Emitting Diode LTE Long Term Evolution ME Mobile Equipment MS Mobile Station MT Mobile Terminated PCB Printed Circuit Board PDU Protocol Data Unit RF Radio Frequency RMS Root Mean Square RTC Real Time Clock Copyright © Fibocom Wireless Inc.
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Appendix A: Acronyms and Abbreviations Rx Receive SMS Short Message Service TE Terminal Equipment TX Transmitting Direction TDD Time Division Duplexing UART Universal Asynchronous Receiver & Transmitter (U)SIM (Universal) Subscriber Identity Module Vmax Maximum Voltage Value Vnorm Normal Voltage Value Vmin Minimum Voltage Value VIHmax Maximum Input High Level Voltage Value VIHmin Minimum Input High Level Voltage Value VILmax Maximum Input Low Level Voltage Value VILmin Minimum In
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Appendix A: Acronyms and Abbreviations VOHmin Minimum Output High Level Voltage Value VOLmax Maximum Output Low Level Voltage Value VOLmin Minimum Output Low Level Voltage Value VSWR Voltage Standing Wave Ratio Copyright © Fibocom Wireless Inc.
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OEM/Integrators Installation Manual Important Notice to OEM integrators 1. This module is limited to OEM installation ONLY. 2. This module is limited to installation in mobile or fixed applications, according to Part 2.1091(b). 3. The separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations 4. For FCC Part 15.
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Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules.
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This device is intended only for OEM integrators under the following conditions: (For module device use) 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required.