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L860-GL Hardware User Manual

Version：1.0.2

Update date：July 19rd, 2018

FIBOCOM

Summary of content (54 pages)

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M O L860-GL Hardware User Manual Version：1.0.
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Copyright Copyright © 2018 Fibocom Wireless Inc. All rights reserved. Without the prior written permission of the copyright holder, any company or individual is prohibited to excerpt, copy any part of or the entire document, or distribute the document in any form. Notice changes or modifications not expressly approved by the party responsible responsible for compliance could void the user user’ s M authority to operate the equipment.
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This device is intended only for OEM integrators under the following conditions: 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and the Max allowed antenna gain is as following table showed: Antenna Gain（dBi） 5 WCDMA BAND IV 5 WCDMA BAND V 3 LTE BAND 2 5 LTE BAND 4 5 LTE BAND 5 3 LTE BAND 7 5 LTE BAND 12 3 O WCDMA BAND II LTE BAND 13 3 4 LTE BAND 14 3 LTE BAND 26（814-824） LTE BAND 26（824-849） FI BO LTE BAND 30 C LTE BAND 17 LTE BAND 25
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valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users.
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Trademark The trademark is registered and owned by Fibocom Wireless Inc. Version Record Version Update date Remark V1.0.0 2018-01-25 Draft version V1.0.1 2018-03-09 1. Modify pin definition and description. 1. Modify module timing 2018-07-19 2. Change tray package type 3. Modify CA Combinations M V1.0.2 4. And add RF performance parameters and power consumption No.
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Contents 3 1.1 Introduction................................ ................................................................................................................................ .......................................... 8 1.2 Reference Standard ................................................................................................ ................................ .............................................................. 8 1.3 Related Documents ...............................
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USIM Interface ................................................................................................ ................................ .................................................................. 32 3.5 3.5.1 USIM1 Pins ................................................................................................ ................................ ............................................................... 32 3.5.2 USIM2 Pins ..........................................................
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Storage ................................................................................................................................ ................................ ............................................... 51 5.5 5.5.1 Storage Life ................................................................................................ ................................ ............................................................... 51 Packing .............................................................
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1 Foreword 1.1 Introduction The document describes the electrical characteristics, RF performance, dimensions and application environment, etc. of L860-GL GL (hereinafter referred to as L860). With the assistance of the document and other instr instructions, the 1.2 Reference Standard The design of the product complies with the following standards:  3GPP TS 34.121-1 V8.11.0: User Equipment (UE) conformance specification; Radio transmission and 3GPP TS 34.122 V11.13.
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2 Overview 2.1 Introduction L860 is a highly integrated 4G WWAN module which uses M.2 form factor interface. It supports LTE FDD/LTE TDD/WCDMA systems and can be applied to most cellular networks of mobile carrier in the world. M 2.
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Specification USB 3.0(Reserved) W_Disable# Body Sar LED Tunable antenna I2S(Reserved) Protocol Stack IPV4/IPV6 AT commands 3GPP TS 27.007 and 27.005 M Software O Firmware update PCIe Multiple carrier Windows MBIM support Other feature AGNSS Note: C Windows update FI BO When temperature goes beyond normal operating temperature range of -10°C~+55°C, 10°C~+55°C, RF performance of module may be slightly off 3GPP specifications.
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DL CA Combinations Inter-band 2 intra-band(non-contiguous) contiguous) plus inter-band O 3CA FI BO C 2 intra-band(contiguous) band(contiguous) plus inter-band Intra-band(non-contiguous) Intra-band(contiguous) M Intra-band(non-contiguous) Intra-band(contiguous) 30+66 41+42, 46 46+66 1, 2, 3, 4, 7, 25, 41, 66 1, 2, 3, 5, 7, 40, 41, 42, 66 1+3+5, 1+3+7, 1+3+8, 1+3+19, 1+3+20, 1+3+28, 1+3+38, 1+5+7, 1+7+8, 1+7+20, 1+7+28, 1+41+42 2+4+5, 2+4+12, 2+4+13, 2+5+30, 2+12+30, 2+29+30, 2+5+66, 2+13+66, 2+14+
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DL CA Combinations 2 intra-band(contiguous) band(contiguous) plus 3 inter-band 1+3+3+7+20, 1+3+7+7+28, 2+5+5+30+66 2+5+5+66+66 3 intra-band(contiguous) band(contiguous) plus 2 intra-band(non-contiguous) 2+2+46+46+46 3 intra-band(contiguous) band(contiguous) plus 2 inter-band 2+5+46+46+46, 2+13+46+46+46, 2+46+46+46+46, 2+46+46+46+66, 3+28+40+40+40, 4+46+46+46+46, 5+46+46+46+66, 13+46+46+46+66, 46+46+46+46+66 3 intra-band(contiguous) band(contiguous) plus 2 intra-band(non-contiguous) 46+46+46+66+66 In
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 GSM/UMTS/LTE FDD controller/Power supply  NAND/internal LPDDR4 RAM  Application interface RF Transceiver  RF Power/PA  RF Front end  RF Filter  Antenna Connector FI BO C O  M RF contains the followings: Figure 2-2 Hardware Block Diagram 2.
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3 Application Interface 3.1 M.2 Interface The L860 module applies standard M.2 Key-B Key interface, with a total of 75 pins. FI BO C O M 3.1.1 Pin Map Figure 3-1 Pin Map Note: Pin “Notch” represents the gap of the gold fingers. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
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3.1.2 Pin Definition The pin definition is as follows: Pin Pin Name I/O Reset Value 1 CONFIG_3 O NC 2 +3.3V PI - Power input Power Supply 3 GND - - GND Power Supply 4 +3.3V PI - Power input Power Supply 5 GND - - GND I PU 7 USB D+ I/O 8 W_DISABLE1# I 9 USB D- I/O 10 LED1# OD T 11 GND - - WWAN – PCIe, USB3.0 interface type Power Supply Power enable, Module power on input, CMOS internal pull up 3.3/1.8V USB Data Plus PD M POWER_OFF# NC, L860 M.
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Pin Pin Name I/O Reset Value Pin Description Type 25 DPR I PD Body SAR Detect, active low 26 W_DISABLE2# I PD GNSS disable, active low, Reserved 27 GND - - GND Power Supply 28 I2S_WA O PD I2S Word alignment/select, Reserved CMOS 1.8V 29 USB3.0_TX- O 30 UIM_RESET O 31 USB3.0_TX+ O 32 UIM_CLK O L SIM clock Signal 33 GND - - GND 34 UIM_DATA I/O L SIM data input/output 35 USB3.0_RX- I USB3.
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Pin Pin Name I/O Reset Value Pin Description Type will reset whole module, not only PCIe interface. Active low, internal pull up(10KΩ) 51 GND - - GND Power Supply Asserted by device to request a PCIe reference clock be available (active clock state) in order to transmit data. It also used CLKREQ# O PU by L1 PM Sub states mechanism, asserted CMOS 3.3V M 52 by either host or device to initiate an L1 exit.
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Pin Pin Name I/O Reset Value Pin Description Type 63 ANTCTL2 O PD Tunable ANT CTRL2 CMOS 1.8V Wireless Coexistence between WWAN and 64 COEX_TXD O WiFi/BT modules, based on BT-SIG T coexistence protocol. UART transmit CMOS 1.8V signal(WWAN module side), Reserved 65 ANTCTL3 O PD 66 SIM1_DETECT I PD 67 RESET# I PU Tunable ANT CTRL3 CMOS 1.8V active high WWAN reset input, internal pull up(10KΩ), active low CMOS 1.8V M SIM1 Detect, internal pull up(390KΩ), CMOS 1.
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3.2 Power Supply The power interface of L860 module as shown in the following table: DC Parameter Parameter（V） Pin Pin Name I/O Pin Description Minimum Typical Maximum Value Value Value +3.3V PI Power supply input 3.135 3.3 4.8 36 UIM_PWR PO USIM power supply - 1.8V/3V - 48 UIM2_PWR PO USIM power supply - M 2, 4, 70, 72, 74 1.8V/3V - L860 module uses PCIe interface, according to the PCIe specification, the PCIe Vmain should be used as the +3.3V O power source, not the Vaux.
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The filter capacitor design for power supply as shown in the following table: Recommended capacitance Application Description Reduce power fluctuations of the module in operation, requiring capacitors with low ESR. 220uF x 2 Voltage-stabilizing stabilizing capacitors  LDO or DC/DC power supply requires the capacitor of no less than 440uF  The capacitor for battery power supply can be and digital signals 700/800, 850/900 MHz frequency 39pF, 33pF band 18pF, 10pF, 8.
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Parameters Minimum Typical Maximum Unit 1.8V logic level 1.71 1.8 1.89 V VIH 1.3 1.8 1.89 V VIL -0.3 0.3 0 0.3 V The L860 module 3.3V logic level definition as shown in the following table: Typical 3.3V logic level 3.135 3.3 VIH 2.3 3.3 VIL -0.3 0.3 0 3.2.3 Power Consumption Maximum Unit M Minimum 3.465 V 3.465 V 0.3 V O Parameters In the condition of 3.
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Parameter Mode Condition Average Current(mA) 890 LTE FDD Data call Band 5 @+23dBm 700 LTE FDD Data call Band 7 @+23dBm 890 LTE FDD Data call Band 8 @+23dBm 725 LTE FDD Data call Band 12 @+23dBm 610 M LTE FDD Data call Band 4 @+23dBm 750 LTE FDD Data call Band 14 @+23dBm 750 LTE FDD Data call Band 17 @+23dBm 625 O LTE FDD Data call Band 13 @+23dBm 690 LTE FDD Data call Band 19 @+23dBm 700 LTE FDD Data call Band 20 @+23dBm 635 C LTE FDD Data call Band 18 @+23dBm 860 LTE FDD Data c
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In 5CA mode, the L860 power consumption as shown in the following table:： table: Condition Average 5CA Combination (LTE FDD 5CA, Full RB) Current(mA) TBD Band 2 @+22dBm TBD Band 3 @+22dBm TBD 46+46+46+46+66 Band 5 @+22dBm TBD 1+3+3+7+20, 1+3+7+7+28, 2+5+5+30+66 Band 7 @+22dBm TBD Band 13 @+22dBm TBD Band 20 @+22dBm TBD 1+3+3+7+7, 3+3+7+7+28, 2+46+46+46+46, 2+5+5+66+66, 2+2+46+46+46 M Band 1 @+22dBm 2+46+46+46+66, 3+28+40+40+40, 4+46+46+46+46, O 2+5+46+46+46, 2+13+46+46+46, 2+46+46+46
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Pin Pin Name I/O Reset Value Functions Type PCIe interface. Active low, internal pull up(10KΩ) Note： RESET# and PERST# need to be controlled by independent GPIO, and not shared with other devices on the host. 3.3.1 Module Start-Up M 3.3.1.1 Start-up Circuit The FULL_CARD_POWER_OFF# pin needs an external 3.3V or 1.8V pull up for booting up.
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Index Minimum Typical tpr 0ms - ton1 100ms 200ms If the RESET# has a residual voltage, then 100ms is necessary ton2 100ms 400ms PERST# should de-asserted asserted after FULL_CARD_POWER_OFF# The delay time of power supply rising from 0V up to 3.135V. If power supply always ready, it can be ignored Module Shutdown Module can be shut down by following control: M 3.3.
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3.3.3 Module Reset The L860 module can reset to its initial status by pulling down the RESET# signal for more than 10ms (30msis recommended), and module will restart after RESET# signal is released. When customer executes RESET# O M function, the PMU remains its power inside the module.
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Index Minimum Typical tres1 10ms 30ms Notes RESET# should asserted time M Figure 3- 9 Reset control timing2nd 0ms tres2 30ms O PERST# should asserted after RESET#. PERST# is not required for modem restart, thus this pin can be remains Note: C high during restart RESET# is a sensitive signal, it’s recommended to add a filter capacitor close to the module. In case of PCB layout, the RESET# signal lines should keep away from the RF interference and protected by GND.
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3.4 PCIe & USB L860 module supports PCIe and USB interface for data request. PCIe & USB interface functions are as below table: Interface System Priority Description Priority: PCIe>USB. PCIe Win10 High If PCIe and USB ports connected both with PC, module will initial PCIe first, then disable USB port Android/Linux Low M It must disconnect PCIe port, only keep USB connecting. USB If keep PCIe and USB connecting both, it needs disable PCIe by BIOS/UEFI of PC O 3.4.
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Pin# Pin Name I/O Reset Value Description Type Active low, internal pull up(10KΩ) Asserted by device to request a PCIe reference clock be available (active clock state) in order to 52 CLKREQ# O transmit data. It also used by L1 PM Sub states L mechanism, asserted by either host or device to CMOS 3.3V initiate an L1 exit.
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 It shall avoid the discontinuous reference ground, such as segment and space;  When the differential signal lines go through different layers, the via hole of grounding signal should be in close to that of signal, and generally, each pair of signals require 1-3 1 3 grounding signal via holes and the lines shall never cross the segment of plane;  Try to avoid bended lines and avoid introducing common-mode common mode noise in the system, which will influence the signal integrity and EMI of differenc
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Figure 3-13 3 13 Length Match Design of PCIe Difference Pair 3.4.2 USB Interface The L860 module supports USB2.0 which is compatible with USB High-Speed Speed (480 Mbit/s) and USB Full Full-Speed (12 Mbit/s).For the USB timing and electrical specification of L860 module, please refer to Universal Serial Bus Specification 2.0”. When module inserted PC, USB can enumerate three ACM and three NCM ports in Android/Linux system, the 3.4.2.
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should be avoided.  USB_D- and USB_D+ signal lines should be routed on the layer that is adjacent to the ground layer, and wrapped with GND vertically and horizontally. 3.5 USIM Interface The L860 module has dual built-in in USIM card interface, which supports 1.8V and 3V SIM cards. The USIM1 pins ins description as shown in the following table: M 3.5.1 USIM1 Pins Pin Name I/O Reset Value Description 36 UIM_PWR PO - USIM power supply 1.8V/3V 30 UIM_RESET O L USIM reset 1.
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3.5.3 USIM Interface Circuit 3.5.3.1 N.C. SIM Card Slot O M The reference circuit design for N.C. (Normally Closed) SIM card slot is shown in Figure 33-15: Figure 3-15 3 Reference Circuit for N.C. SIM Card Slot The principles of the N.C.SIM card slot are described as follows: When the SIM card is detached, it connects the short circuit between CD and SW pins, and drives the SIM_DETECT pin low.
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SIM_DETECT pin low.  When the SIM card is inserted, it connects the short circuit between CD and SW pins, and drives the SIM_DETECT pin high. 3.5.4 USIM Hot-Plugging Plugging The L860 module supports the SIM card hot-plugging hot function, which determines whether the SIM card is inserted or detached by detecting the SIM_DETECT pin state of the SIM card slot.
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 The SIM card slot with a metal shielding housing can improve the anti-interference interference ability.  The trace length between the SIM card slot and the module should not exceed 100mm, or it could reduce the signal quality.  The UIM_CLK and UIM_DATA signal lines should be isolated by GND to avoid crosstalk interference. If it is difficult for the layout, the whole SIM signal lines should be wrapped with GND as a group at least.
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driving current. 3.7 Interrupt Control The L860 module provides four interrupt signals, and the pin definition is as follows: Pin Pin Name I/O Reset Value Pin Description Type 8 W_DISABLE1# I PD Enable/Disable RF network CMOS 3.3/1.8V 25 DPR I PD Body SAR detection CMOS 3.3/1.8V 26 W_DISABLE2# I PD 68 ANT_CONFIG I PD Reserved M GNSS Disable signal Host antenna configuration detection CMOS 1.8V O Reserved CMOS 3.3/1.8V 3.7.
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3.7.3 ANT_CONFIG--TBD TBD L860 module can be configured to support dual antennas or 4 antennas by detecting the ANT_CONFIG pin. ANT_CONFIG is an input port which is pulled high internal in default. When ANT_CONFIG is high level, then module supports dual antennas (Main & D/G ANT). When module detects detects low level of ANT_CONFIG, then module will be configured to support 4 antennas.
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module: Pin Name I/O Reset Value Pin Description Type 1 CONFIG_3 O - NC 21 CONFIG_0 O - NC 69 CONFIG_1 O L Internally connected to GND 75 CONFIG_2 O - NC M Pin The M.2 module configuration as the following table: Config_0 Config_1 Config_2 Config_3 Module Type and (pin21) (pin69) (pin75) (pin1) Main Host Interface NC GND NC NC O Port Configuration WWAN - PCIe Gen2, USB3.0 Vender defined 3.10 Other Interfaces C Please refer to PCI Express M.
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4 Radio Frequency 4.1 RF Interface 4.1.1 RF Interface Functionality The L860 module supports four RF connectors used for external antenna connection. As the Figure 44-1 shows, “M” is for Main antenna, used to receive and transmit RF signals; “D/G” is for Diversity antenna, used to receive the FI BO C O M diversity RF signals. “M1” and “M2” are used for support 4x4 MIMO data transfer. Figure 4-1 RF connectors 4.1.
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M FI BO C O Figure 4-2 RF connector dimensions Figure 4-3 4 0.81mm coaxial antenna dimensions Figure 4-4 Schematic chematic diagram of 0.81mm coaxial antenna connected to the RF connector Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
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4.
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Operating Band Description Mode Tx (MHz) Rx (MHz) Band 42 3500MHZ LTE TDD Band 46 5200MHZ LTE TDD N/A 5150 – 5925 GPS L1 - - / 1575.42±1.023 GLONASS L1 - - / 1602.5625±4 BeiDou - - / 1561.098±2.046 M 3400 – 3600 4.3 Transmitting Power The transmitting power for each band of the L860 module as shown in the following table: Tx Power(dBm) Note Band 1 24+1.7/--3.7 23.5±1 - Band 2 24+1.7/--3.7 23.5±1 - Band 4 24+1.7/--3.7 23.5±1 - Band 5 24+1.7/--3.7 23.
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Tx Power(dBm) Note Band 21 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 25 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 26 23±2.7 23+2/-1 10MHz Bandwidth, 1 RB Band 28 23+2.7/--3.2 23±1 10MHz Bandwidth, 1 RB Band 30 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 66 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 38 23±2.7 23±1 Band 39 23±2.7 23±1 Band 40 23±2.7 23±1 Band 41 23±2.7 24.0±0.5 Band 42 23+2.7/--3.2 4.
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3GPP Requirement (dBm) Rx Sensitivity(dBm) Typical Note Band 8 -93.3 -102.5 10MHz Bandwidth Band 12 -93.3 -103.2 10MHz Bandwidth Band 13 -93.3 -103.1 10MHz Bandwidth Band 14 -93.3 -102.4 10MHz Bandwidth Band 17 -93.3 -103.5 10MHz Bandwidth Band 18 -96.3 -103.1 10MHz Bandwidth Band 19 -96.3 -103.2 10MHz Bandwidth Band 20 -93.3 -102.7 10MHz Bandwidth Band 21 -96.3 -101.4 10MHz Bandwidth Band 25 -92.8 TBD 10MHz Bandwidth Band 26 -93.8 -103.
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is shown in below table: LTE FDD Band Middle/High Bands 3GPP Requirement (dBm) Band 1 Middle Band TBD TBD 10MHz Bandwidth Band 2 Middle Band TBD TBD 10MHz Bandwidth Band 3 Middle Band TBD TBD 10MHz Bandwidth Band 4 Middle Band TBD TBD 10MHz Bandwidth Band 66 Middle Band TBD TBD 10MHz Bandwidth Band 7 High Band TBD Band 30 High Band TBD Band 40 High Band TBD Band 41 High Band TBD Note: Note TBD 10MHz Bandwidth TBD 10MHz Bandwidth TBD 10MHz Bandwidth O LTE TD
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BeiDou AGNSS Test Result Warm start TBD Hot Start TBD Cold start TBD Warm start TBD Hot Start TBD Cold start TBD Warm start TBD Hot Start TBD Cold start TBD Tracking GPS Acquisition Tracking Sensitivity GLONASS TBD TBD TBD C Acquisition M GLONASS Condition O Description TBD Tracking TBD Acquisition TBD FI BO BeiDou Note: Please note that GPS current is tested with RF disabled. 4.
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140MHz LTE Band 3(1800): 170 MHz LTE band 4(1700): 445MHz LTE band 5(850): 70 MHz LTE band 7(2600): 190 MHz LTE Band 8(900): 80 MHz LTE Band 12(700): 47 MHz LTE Band 13(700): 41 MHz LTE Band 14(700): 40 MHz LTE Band 17(700): 42 MHz LTE Band 18(800): 80 MHz LTE Band 19(800): LTE band 20(800): O LTE band 2(1900): M L860 module Main antenna requirements 80 MHz 71 MHz LTE band 21(1500): 63 MHz C LTE band 25(1900): 145 MHz 80 MHz LTE band 28(700): 100 MHz LTE band 29(700): 12 MH
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L860 module Main antenna requirements (SWR) Note: ANT on B30 suggestion: Peak gain<0dBi, for FCC EIRP requirement, Efficient>50% for carrier TRP FI BO C O M requirement. If integrator doesn't follow the instruction, Fibocom doesn't take the responsibility. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
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5 Structure Specification 5.1 Product Appearance The product appearance for L860 module is shown in Figure5-1: TBD Figure 5-1 Module Appearance FI BO C O The structural dimension of the L860 module is shown in Figure 5-2: 5 M 5.2 Dimension of Structure Figure 5-2 Dimension of Structure Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
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5.3 M.2 Interface Model The L860 M.2 module adopts 75-pin pin gold finger as external interface, where 67 pins are signal pins and 8 pins are notch pins as shown in Figure 3-1. 1. For module dimension, please refer to 5.2 Dimension of Structure Structure. Based on the M.2 interface definition, L860 860 module adopts Type 3042-S3-B 3042 B interface (30x42mm, the component maximum FI BO C O M height on t top layer is 1.5mm, PCB thickness is 0.8mm, and KEY ID is B). 5.4 M.
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M O 5.5 Storage 5.5.1 Storage Life C Figure 5-3 M.2 Dimension of Structure FI BO Storage Conditions (recommended): Temperature is 23 ± 5 ℃,, relative humidity is less than RH 60%. Storage period:: Under the recommended storage conditions, the storage life is 12 months. 5.6 Packing The L860 module uses the tray sealed packing, combined with the outer packing method using the hard cartoon box, so that the storage, transportation and the usage of modules can be protected to the greatest extent.
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5.6.2 Tray size C O M The pallet size is 315*170*6.5mm, .5mm, as shown in Figure 5-5: 5 FI BO Figure 5-5 Tray Size (Unit: mm) ITEM DIM(Unit: mm) L 315.0±2.0 W 170.0±2.0 H 6.5±0.3 T 0.8±0.1 A 43.0±0.3 B 31.0±0.3 C 79.0±0.2 D 60.0±0.2 E 180.0±0.2 F 60.0±0.2 G 40.0±0.2 Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.