L850-GL Hardware User Manual Version：1.0.
Copyright Copyright © 2017 Fibocom Wireless Inc. All rights reserved. Without the prior written permission of the copyright holder, any company or individual is prohibited to excerpt, copy any part of or the entire document, or distribute the document in any form. Notice The document is subject to update from time to time owing to the product version upgrade or other reasons. Unless otherwise specified, the document only serves as the user guide.
Applicability Table No. Product model Description 1 L850-GL-00 NA 2 L850-GL-01 NA 3 L850-GL-03 NA 4 L850-GL-05 NA 5 L850-GL-10 NA Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
Contents 1 Foreword ............................................................................................................................................ 7 1.1 Introduction .......................................................................................................................... 7 1.2 Reference Standard ............................................................................................................. 7 1.3 Related Documents ......................................
3.4.2 USB Interface ............................................................................................................. 33 3.4.2.1 USB Interface Definition ...................................................................................... 33 3.4.2.2 USB2.0 Interface Application ............................................................................... 33 3.4.2.3 USB3.0 Interface Application ............................................................................... 34 3.
5.4 M.2 Connector ................................................................................................................... 51 5.5 Storage .............................................................................................................................. 52 5.5.1 5.6 Storage Life ................................................................................................................ 52 Packing .........................................................................
1 Foreword 1.1 Introduction The document describes the electrical characteristics, RF performance, dimensions and application environment, etc. of L850-GL (hereinafter referred to as L850). With the assistance of the document and other instructions, the developers can quickly understand the hardware functions of L850 modules and develop products. 1.2 Reference Standard The design of the product complies with the following standards: 3GPP TS 34.121-1 V8.11.
2 Overview 2.1 Introduction L850 is a highly integrated 4G WWAN module which uses M.2 form factor interface. It supports LTE FDD/LTE TDD/WCDMA systems and can be applied to most cellular networks of mobile carrier in the world. 2.
Specification PCIe 1.0 X1 USB 2.0 USB 3.0(Base on Linux) W_Disable# Body Sar LED Clock Tunable antenna I2S(Reserved) I2C(Reserved) Software Protocol Stack IPV4/IPV6 AT commands 3GPP TS 27.007 and 27.005 Firmware update PCIe Multiple carrier Other feature Windows MBIM support Windows update AGNSS Note: When temperature goes beyond normal operating temperature range of -10°C~+55°C, RF performance of module may be slightly off 3GPP specifications.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.
This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter, except tested built-in radios. Cet appareil et son antenne ne doivent pas être situés ou fonctionner en conjonction avec une autre antenne ou un autre émetteur, exception faites des radios intégrées qui ont été testées. The County Code Selection feature is disabled for products marketed in the US/ Canada.
fibocom.com 2.
2.5 Application Framework The peripheral applications for L850 module are shown in Figure 2-1: Div ANT Main ANT Module Power Supply ON/OFF# RESET# SIM PCIe USB2.0 SIM Card Control USB3.0 EINT Indicator Host application Figure2-1 Application Framework 2.6 Hardware Block Diagram The hardware block diagram in Figure 2-2 shows the main hardware functions of L850 module, including base band and RF functions.
Figure 2-2 Hardware Block Diagram Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
3 Application Interface 3.1 M.2 Interface The L850 module applies standard M.2 Key-B interface, with a total of 75 pins. 3.1.1Pin Map Figure 3-1 Pin Map Note: Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
Pin “Notch” represents the gap of the gold fingers. 3.1.2 Pin Definition The pin definition is as follows: Pin Pin Name I/O Reset Value Pin Description Type NC, L850 M.2 module is configured as 1 CONFIG_3 O NC the WWAN – PCIe, USB3.0 interface type 2 +3.3V 3 GND 4 +3.3V 5 GND 6 FULL_CARD_ POWER_OFF# PI PI I PU Power input Power Supply GND Power Supply Power input Power Supply GND Power Supply Power enable, Module power on input, CMOS internal pull up 3.3/1.
Pin Pin Name I/O Reset Value 22 I2S_RX I PD 23 WOWWAN# O PD 24 I2S_TX O PD 25 DPR I PU 26 W_DISABLE2# I PU 27 GND 28 I2S_WA O 29 USB3.0_TX- O 30 UIM_RESET O 31 USB3.0_TX+ O 32 UIM_CLK O 33 GND 34 UIM_DATA I/O 35 USB3.0_RX- I USB3.0 receive data minus 36 UIM_PWR O SIM power supply, 3V/1.8V 37 USB3.0_RX+ I USB3.
Pin Pin Name I/O Reset Value Pin Description Type 46 SYSCLK O PD 26M clock output 1.8V 47 PERn0 I 48 TX_BLANKING O 49 PERp0 I PCIe RX Differential signals Negative PD PA Blanking Timer, Reserved CMOS 1.8V PCIe RX Differential signals Positive Asserted to reset module PCIe interface default. If module went into core dump, it 50 PERST# I T will reset whole module, not only PCIe CMOS 3.3V interface.
Pin Pin Name I/O Reset Value Pin Description Type coexistence protocol. COEX_EXT_FTA, Reserved 61 ANTCTL1 O - Tunable ANT CTRL1 CMOS 1.8V Wireless Coexistence between WWAN 62 COEX_RXD I T and WiFi/BT modules, based on BT-SIG coexistence protocol. UART receive CMOS 1.8V signal(WWAN module side), Reserved 63 ANTCTL2 O - Tunable ANT CTRL2 CMOS 1.8V Wireless Coexistence between WWAN 64 COEX_TXD O T and WiFi/BT modules, based on BT-SIG coexistence protocol. UART transmit CMOS 1.
PU: Pull-Up T: Tristate OD: Open Drain PP: Push-Pull PI: Power Input PO: Power Output Note: The unused pins can be left floating. 3.2 Power Supply The power interface of L850 module as shown in the following table: DC Parameter（V） Pin Pin Name I/O Pin Description Minimum Typical Maximum Value Value Value 2, 4, 70, 72, 74 +3.3V PI Power supply input 3.135 3.3 4.4 36 PO USIM power supply - 1.
The filter capacitor design for power supply as shown in the following table: Recommended capacitance Application Description Reduce power fluctuations of the module in operation, requiring capacitors with low ESR.
Parameters Minimum Typical Maximum Unit 1.8V logic level 1.71 1.8 1.89 V VIH 1.3 1.8 1.89 V VIL -0.3 0 0.3 V The L850module 3.3V logic level definition as shown in the following table: Parameters Minimum Typical Maximum Unit 3.3V logic level 3.135 3.3 3.465 V VIH 2.3 3.3 3.465 V VIL -0.3 0 0.3 V 3.2.3 Power Consumption In the condition of 3.
Parameter Mode Condition Average Current(mA) LTE TDD LTE FDD Data call Band 4 @+23dBm 770 LTE FDD Data call Band 5 @+23dBm 600 LTE FDD Data call Band 7 @+23dBm 860 LTE FDD Data call Band 8 @+23dBm 580 LTE FDD Data call Band 11 @+23dBm 850 LTE FDD Data call Band 12 @+23dBm 650 LTE FDD Data call Band 13 @+23dBm 660 LTE FDD Data call Band 17 @+23dBm 670 LTE FDD Data call Band 18 @+23dBm 620 LTE FDD Data call Band 19 @+23dBm 580 LTE FDD Data call Band 20 @+23dBm 650 LTE FDD Data call
Condition 3CA Combination (LTE FDD 3CA, Full RB) Average Current(mA) 3+7+20, 3+7+28 Band 4 @+22dBm 930 4+5+30, 4+12+30, 4+29+30 Band 5 @+22dBm 710 Band 7 @+22dBm 950 Band 8 @+22dBm 650 4+4+5, 4+4+13 Band 11 @+22dBm 1000 5+66+66, 13+66+66, 66+66+2, 66+66+66 Band 12 @+22dBm 790 Band 13 @+22dBm 700 Band 19 @+22dBm 690 Band 20 @+22dBm 730 Band 21 @+22dBm 890 Band 28 @+22dBm 670 Band 30 @+21dBm 910 Band 66 @+22dBm 820 5+66+2, 13+66+2 2+2+5, 2+2+13 3+3+7, 3+7+7, 3+3+20 7+7+28, 3
Pin Pin Name I/O Reset Value Functions Type module, not only PCIe interface. Active low, internal pull up(10KΩ) Note： RESET# and PERST# need to be controlled by independent GPIO, and not shared with other devices on the host. 3.3.1 Module Start-Up 3.3.1.1 Start-up Circuit The FULL_CARD_POWER_OFF# pin needs an external 3.3V or 1.8V pull up for booting up. The VDD_1V8 should be provided from the external circuit.
Index Minimum Typical Notes tpr - - ton1 10ms 30ms If the RESET# has a residual voltage, then 30ms is necessary ton2 10ms 30ms PERST# should de-asserted after FULL_CARD_POWER_OFF# +3.3V power supply rises time. If power supply always ready, there is no tpr 3.3.
3.3.3 Module Reset The L850 module can reset to its initial status by pulling down the RESET# signal for more than 10ms (30msis recommended), and module will restart after RESET# signal is released. When customer executes RESET# function, the PMU remains its power inside the module.
+3.3V FULL_CARD_POWER_OFF# tres1 tres1 RESET# tres2 PERST# typical 10s Module State Activation PMU RESET Restart Activation Figure 3-9 Reset control timing2nd Index Minimum Typical tres1 10ms 30ms Notes RESET# should asserted time PERST# should asserted after RESET#. tres2 0ms 30ms PERST# is not required for modem restart, thus this pin can be remains high during restart Note: RESET# is a sensitive signal, it’s recommended to add a filter capacitor close to the module.
3.4 PCIe & USB L850 module supports PCIe and USB interface for data request. PCIe & USB interface functions are as below table: Interface System PCIe Win10 Priority Description Priority: PCIe>USB. High If PCIe and USB ports connected both with PC, module will initial PCIe first, then disable USB port It must disconnect PCIe port, only keep USB connecting. USB Android/Linux Low If keep PCIe and USB connecting both, it needs disable PCIe by BIOS/UEFI of PC 3.4.
Pin# Pin Name I/O Reset Value Description Type Asserted by device to request a PCIe reference clock be available (active clock 52 CLKREQ# O state) in order to transmit data. It also used by T L1 PM Sub states mechanism, asserted by CMOS 3.3V either host or device to initiate an L1 exit. Active low, internal pull up(10KΩ) Asserted to wake up system and reactivate PCIe link from L2 to L0, it depends on system 54 PEWAKE# O L whether supports wake up functionality. CMOS 3.
It shall avoid the discontinuous reference ground, such as segment and space; When the differential signal lines go through different layers, the via hole of grounding signal should be in close to that of signal, and generally, each pair of signals require 1-3 grounding signal via holes and the lines shall never cross the segment of plane; Try to avoid bended lines and avoid introducing common-mode noise in the system, which will influence the signal integrity and EMI of difference pair.
Figure 3-13 Length Match Design of PCIe Difference Pair 3.4.2USB Interface The L850 module supports USB2.0 which is compatible with USB High-Speed (480 Mbit/s) and USB Full-Speed (12 Mbit/s).It supports USB3.0 using for LTE cat9 high speed data throughput at the same time. For the USB timing and electrical specification of L850 module, please refer to Universal Serial Bus Specification 2.0” and “Universal Serial Bus Specification 3.0”.
Figure 3-14 Reference Circuit for USB 2.0 Interface Since the module supports USB 2.0 High-Speed, it is required to use TVS diodes with equivalent capacitance of 1pF or smaller ones on the USB_D-/D+ differential signal lines, it is recommended to use 0.5pF TVS diodes.
angle routing should be avoided. The two pairs differential signal lines should be routed on the layer that is adjacent to the ground layer, and wrapped with GND vertically and horizontally. 3.5 USIM Interface The L850 module has a built-in USIM card interface, which supports 1.8V and 3V SIM cards. 3.5.1 USIM Pins The USIM pins description as shown in the following table: Pin Pin Name I/O Reset Value Description Type 36 UIM_PWR PO - USIM power supply 1.
Figure 3-16Reference Circuit for N.C. SIM Card Slot The principles of the N.C.SIM card slot are described as follows: When the SIM card is detached, it connects the short circuit between CD and SW pins, and drives the SIM_DETECT pin low. When the SIM card is inserted, it connects an open circuit between CD and SW pins, and drives the SIM_DETECT pin high. 3.5.2.2 N.O. SIM Card Slot The reference circuit design for N.O.
3.5.3 USIM Hot-Plugging The L850 module supports the SIM card hot-plugging function, which determines whether the SIM card is inserted or detached by detecting the SIM_DETECT pin state of the SIM card slot. The SIM card hot-plugging function can be configured by “AT+MSMPD” command, and the description for AT command as shown in the following table: AT Command Hot-plugging Detection Function Description Default value, the SIM card hot-plugging detection function is AT+MSMPD=1 Enable enabled.
interference. If it is difficult for the layout, the whole SIM signal lines should be wrapped with GND as a group at least. The filter capacitors and ESD devices for SIM card signals should be placed near to the SIM card slot, and the ESD devices with 22~33pF capacitance should be used. 3.
3.7 Interrupt Control The L850 module provides four interrupt signals, and the pin definition is as follows: Pin Pin Name I/O Reset Value Pin Description Type 8 W_DISABLE1# I PD Enable/Disable RF network CMOS 3.3V 25 DPR I PU Body SAR detection CMOS 1.8V 26 W_DISABLE2# I PU 44 GNSS_IRQ I PD GNSS Disable signal, Reserved GNSS Interrupt Request, Reserved CMOS 1.8V CMOS 1.8V 3.7.
3.8 Clock Interface The L850 module supports a clock interface, it can output 26MHz clock. Pin Pin Name I/O 46 SYSCLK O Reset Value Pin Description 26M clock output, default disabled can be used for external GPS, etc Type 1.8V 3.9 ANT Tunable Interface The module supports ANT Tunable interfaces with two different control modes, i.e. MIPI interface and 3bit GPO interface.
Pin Pin Name I/O Reset Value Pin Description 69 CONFIG_1 O L Internally connected to GND 75 CONFIG_2 O L Internally connected to GND Type The M.2 module configuration as the following table: Config_0 Config_1 Config_2 Config_3 Module Type and Main Port (pin21) (pin69) (pin75) (pin1) Host Interface Configuration GND GND GND NC WWAN–USB3.1, PCIe 0 Gen1 Please refer to PCI Express M.2 Specification Rev1.1” for more details. 3.
4 Radio Frequency 4.1 RF Interface 4.1.1 RF Interface Functionality The L850 module supports two RF connectors used for external antenna connection. As the Figure 4-1 shows, “M” is for Main antenna, used to receive and transmit RF signals; “D/G” is for Diversity antenna, used to receive the diversity RF signals. Figure 4-1 RF connectors 4.1.2RF Connector Characteristic Rated Condition Environment Condition Frequency Range DC to 6GHz Temperature Range Characteristic Impedance 50Ω –40°C to +85°C 4.
Figure 4-2 RF connector dimensions Figure 4-3 0.81mm coaxial antenna dimensions Figure 4-4 Schematic diagram of 0.81mm coaxial antenna connected to the RF connector Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
4.
Operating Band Description Mode Tx (MHz) Rx (MHz) BeiDou - - / 1561.098±2.046 4.3 Transmitting Power The transmitting power for each band of the L850 module as shown in the following table: Mode WCDMA LTE FDD Band 3GPP Requirement(dBm) Tx Power(dBm) Note Band 1 24+1.7/-3.7 23.5±1 - Band 2 24+1.7/-3.7 23.5±1 - Band 4 24+1.7/-3.7 23.5±1 - Band 5 24+1.7/-3.7 23.5±1 - Band 8 24+1.7/-3.7 23.5±1 - Band 1 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 2 23±2.
Mode LTE TDD Band 3GPP Requirement(dBm) Tx Power(dBm) Note Band 66 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 38 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 39 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 40 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 41 23±2.7 23±1 10MHz Bandwidth, 1 RB 4.4 Receiver Sensitivity The receiver sensitivity for each band of the L850 module as shown in the following table: Mode WCDMA LTE FDD Band 3GPP Requirement (dBm) Rx Sensitivity(dBm) Typical Note Band 1 -106.
Mode Band LTE TDD 3GPP Requirement (dBm) Rx Sensitivity(dBm) Typical Note Band 20 -93.3 -102.5 10MHz Bandwidth Band 21 -96.3 -99 10MHz Bandwidth Band 26 -93.8 -103 10MHz Bandwidth Band 28 -94.8 -103 10MHz Bandwidth Band 29 -93.3 -101 10MHz Bandwidth Band 30 -95.3 -99.5 10MHz Bandwidth Band 66 -95.8 -101.5 10MHz Bandwidth Band 38 -96.3 -101 10MHz Bandwidth Band 39 -96.3 -101.5 10MHz Bandwidth Band 40 -96.3 -100.5 10MHz Bandwidth Band 41 -94.
Description Condition GLONASS BeiDou AGNSS GPS Sensitivity GLONASS BeiDou Test Result Warm start 34s / -130dBm Hot Start 2s / -130dBm Cold start 31s / -130dBm Warm start 22s / -130dBm Hot Start 3s / -130dBm Cold start 148s / -130dBm Warm start 148s / -130dBm Hot Start 3s / -130dBm Cold start TBD Tracking -160dBm Acquisition -149dBm Tracking -160dBm Acquisition -146dBm Tracking -160dBm Acquisition -141dBm Note: Please note that GPS current is tested with RF disabled.
L850 module Main antenna requirements LTE band 2(1900): 140 MHz LTE Band 3(1800): 170 MHz LTE band 4(1700): 445 MHz LTE band 5(850): 70 MHz LTE band 7(2600): 190 MHz LTE Band 8(900): 80 MHz LTE Band 11(1500): 68 MHz LTE Band 12(700): 47 MHz LTE Band 13(700): 41 MHz LTE Band 17(700): 42 MHz LTE Band 18(800): 80 MHz LTE Band 19(800): 80 MHz LTE band 20(800): 71 MHz LTE band 21(1500): 63 MHz LTE band 26(850): 80 MHz LTE band 28(700): 100 MHz LTE band 29(700): 12 MHz LTE band 30(2300): 55 MHz LTE band 66(1700):
5 Structure Specification 5.1 Product Appearance The product appearance for L850 module is shown in Figure5-1: Figure 5-1 Module Appearance 5.2 Dimension of Structure The structural dimension of the L850 module is shown in Figure 5-2: Figure 5-2 Dimension of Structure Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
5.3 M.2 Interface Model The L850 M.2 module adopts 75-pin gold finger as external interface, where 67 pins are signal pins and 8 pins are notch pins as shown in Figure 3-1. For module dimension, please refer to 5.2 Dimension of Structure. Based on the M.2 interface definition, L850 module adopts Type 3042-S3-B interface (30x42mm, the component maximum height on t top layer is 1.5mm, PCB thickness is 0.8mm, and KEY ID is B). 5.4 M.2 Connector The L850 module connects to AP via M.
Figure 5-3 M.2 Dimension of Structure 5.5 Storage 5.5.1 Storage Life Storage Conditions (recommended): Temperature is 23 ± 5 , relative humidity is less than RH 60%. Storage period: Under the recommended storage conditions, the storage life is 12 months. 5.6 Packing The L850 module uses the tray sealed packing, combined with the outer packing method using the hard cartoon box, so that the storage, transportation and the usage of modules can be protected to the greatest extent.
in each case. Tray packaging process is shown in Figure 5-4: Figure 5-4 Tray Packaging Process 5.6.2 Tray size The pallet size is 330*175*6.0mm, as shown in Figure 5-5: Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
Figure 5-5Tray Size (Unit: mm) ITEM DIM(Unit: mm) L 330.0±0.5 W 175.0±0.5 H 6.0±0.3 T 0.5±0.1 A0 43±0.3 B0 33.0±0.3 A1 294.0±0.3 B1 159.0±0.3 C 20.0±0.5 D 9.0±0.5 E 24.5±0.5 F 187.5±0.2 G 105.0±0.2 J 9.0±0.2 Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
