L850-GL Hardware User Manual Version：V1.0.
Applicability Table No. Product model Description 1 L850-GL NA Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
Copyright Copyright © 2017Fibocom Wireless Inc. All rights reserved. Without the prior written permission of the copyright holder, any company or individual is prohibited to excerpt, copy any part of or the entire document, or distribute the document in any form. Notice The document is subject to update from time to time owing to the product version upgrade or other reasons. Unless otherwise specified, the document only serves as the user guide.
Contents 1 Foreword.......................................................................................................................................... 7 1.1 Introduction........................................................................................................................................... 7 1.2 Reference Standard............................................................................................................................ 7 1.3 Related Documents.......................
3.5.2 PCIe Interface Application..............................................................................................................29 3.6 USIMInterface.................................................................................................................................... 31 3.6.1 USIM Pins......................................................................................................................................... 31 3.6.2 USIM Interface Circuit.............................
5.5 Storage................................................................................................................................................ 49 5.5.1 Storage Life...................................................................................................................................... 49 5.6 Packing................................................................................................................................................49 5.6.1 Tray Package....................
1 Foreword 1.1 Introduction The document describes the electrical characteristics, RF performance, dimensions and application environment, etc. of L850-GL (hereinafter referred to as L850). With the assistance of the document and other instructions, the developers can quickly understand the hardware functions of L850 modules and develop products. 1.2 Reference Standard The design of the product complies with the following standards: 3GPP TS 34.121-1 V10.8.
2 Overview 2.1 Introduction L850 is a highly integrated 4G wireless communication module that adopts standard PCIe M.2 interface and supports LTE FDD/LTE TDD/WCDMA/ system. It is applicable to most broadband communication networks of the mobile operator across the world. 2.
USIM 3V/1.8V USB 2.0（just for debugging） PCIe 1.0 X1 W_Disable# BodySar Function Interface LED Clock Tunable antenna I2S(Reserved) I2C(Reserved) USB3.0(not supported yet) Software Protocol Stack IPV4/IPV6 AT commands 3GPP TS 27.007 and 27.005 Firmware update PCIe Multiple carrier Other feature Windows MBIM support Windows update AGNSS Note: For normal operating temperature, LTE FDD Band 4 and 13 can support the temperature ranging from -20℃ to +60℃. 2.3 Warnings 2.3.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. installation.
IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.
This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter, except tested built-in radios. Cet appareil et son antenne ne doivent pas être situés ou fonctionner en conjonction avec une autre antenne ou un autre émetteur, exception faites des radios intégrées qui ont été testées. The County Code Selection feature is disabled for products marketed in the US/ Canada.
L850-GL is in conformity with the relevant Union harmonization legislation: Radio Equipment directive: 2014 / 53 / EUwith reference to the following standards applied: Health (Article 3.1(a) of Directive 2014/53/EU) Applied Standard(s): EN 62311 : 2008 Safety (Article 3.1(a) of Directive 2014/53/EU) Applied Standard(s): EN 60950-1: 2006 + A11: 2009 + A1: 2010 + A12: 2011 + A2: 2013 Electromagnetic compatibility (Article 3.1 (b) of Directive 2014/53/EU) Applied Standard(s): Draft EN 301 489-1 V2.1.1 / -3 V2.
CA Combinations 1+3+7, 1+3+19, 1+3+20, 1+19+21 2+4+5, 2+4+13, 2+5+30, 2+12+30, 2+29+30 3+7+20, 3+7+28 Inter-band 4+5+30, 4+12+30, 4+29+30 5+66+2, 13+66+2 3CA 2+2+5, 2+2+13 2 contiguous plus inter-band 3+3+7, 3+7+7, 3+3+20 4+4+5, 4+4+13 5+66+66, 13+66+66, 66+66+2, 66+66+66 2.5 Application Framework The peripheralapplicationsfor L850 module are shown in Figure 2-1: Figure2-1 Application Framework Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
2.6 Hardware Framework The hardware framework in Figure 2-2 shows the main hardware functions of L850 module, including base band and RF functions. Baseband contains the followings: GSM/UMTS/LTE FDD controller/Power supply NAND/internal LPDDR2 RAM Application interface RF contains the followings: RF Transceiver RF Power/PA RF Front end RF Filter Antenna Figure 2-2 Hardware Framework 3 Application Interface 3.1 M.2Interface The L850 module applies standard M.
3.1.1 Pin Distribution Figure 3-1 Pin Distribution Note: Pin “Notch” represents the gap of the gold fingers. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
3.1.2 Pin Definition The pin definition is as follows: Pin Pin Name I/O Reset Value Pin Description Type NC,L850 M.2 module is configured as 1 CONFIG_3 O NC the WWAN – PCIe,USB3.0 interface type 2 +3.3V 3 GND 4 +3.3V 5 GND 6 FUL_CARD_ POWER_OFF# PI PI I PU Power input Power Supply GND Power Supply Power input Power Supply GND Power Supply Power on CMOS 3.3/1.8V USB Data Plus 0.
Pin Pin Name I/O Reset Value Pin Description Type Reserved 23 WOWWAN# O PD 24 I2S_TX O PD 25 DPR I PU 26 W_DISABLE2# I PU 27 GND 28 I2S_WA O 29 USB3.0‐Tx‐ O 30 UIM_RESET O 31 USB3.0‐Tx+ O 32 UIM_CLK O 33 GND 34 UIM_DATA I/O 35 USB3.0‐Rx‐ I 36 UIM_PWR O 37 USB3.0‐Rx+ I 38 NC NC 39 GND GND 40 GNSS_SCL O 41 PETn0 O 42 GNSS_SDA I/O 43 PETp0 O PD Wake up host I2S Serial transmit data, Reserved Body SAR Detect,active low CMOS 1.8V CMOS 1.
Pin Pin Name I/O Reset Value 44 GNSS_IRQ I PD 45 GND 46 SYSCLK O 47 PERn0 I 48 TX_BLANKING O 49 PERp0 I PD Pin Description GNSS Interrupt Request, Reserved Type CMOS 1.8V GND Power Supply 26M clock output 1.8V PCIe RX Differential signals Negative PD PA Blanking Timer CMOS 1.8V PCIe RX Differential signals Positive PE-Reset is a functional reset to the 50 PERST# I T Add-In card as defined by the PCIe Mini CMOS 3.
Pin Pin Name I/O Reset Value Pin Description Type ,Reserved 63 ANTCTL2 O Tunable ANT CTRL2 CMOS 1.8V Wireless Coexistence between WWAN 64 COEX1 O T and WiFi/BT modules, GNSS_EXT_FTA CMOS 1.8V ,Reserved 65 NC NC 66 SIM_DETECT I 67 RESET# I 68 NC PD SIM Detect,internal pull up(330KΩ), CMOS 1.8V active high WWAN reset input,internal pull up(10KΩ),active low CMOS 1.8V NC GND,L850 M.2 module is configured as 69 CONFIG_1 O GND the WWAN – PCIe,USB3.0 interface type 70 +3.
3.2 Power Supply The power interface of L850 module as shown in the following table: DC Parameter（V） Pin Pin Name I/O Pin Description 2,4,70,72,74 +3.3V PI Power supply input 36 UIM_PWR PO USIM power supply Minimum Typical Maximum Value Value Value 3.135 3.3 4.4 1.8V/3V L850 module uses PCIe interface, according to the PCIe specification, the PCIe Vmain should be used as the +3.3V power source, not the Vaux.
Recommended capacitance 39pF,33pF Application Description 700/800, 850/900 MHzfrequency band 1500/1700/1800/1900,2100/ 18pF,8.2pF,6.8pF 2300,2500/2600MHzfrequen cy band Filter out low frequency band RF interference Filter out medium/high frequency band RF interference The stable power supply can ensure the normal operation of L850 module;and the ripple of the power supply should be less than 300mV in design.
3.2.3 Power Consumption In the condition of 3.3V power supply, the L850 power consumption as shown in the following table: Average Parameter Mode Condition Ioff Power off Power supply,module power off 0.08 DRX=6 2.5 DRX=8 1.8 DRX=9 1.6 LTE FDD Paging cycle #64 frames (0.64 sec DRx cycle) 2.6 LTE TDD Paging cycle #64 frames (0.64 sec DRx cycle) 2.8 Radio Off AT+CFUN=4,Flight mode 1.2 WCDMA Data transfer Band 1 @+23.5dBm 680 WCDMA Data transfer Band 2 @+23.
Parameter Mode LTE TDD Average Condition Current(mA) LTE FDD Data transfer Band 21 @+23dBm TBD LTE FDD Data transfer Band 26 @+23dBm 540 LTE FDD Data transfer Band 28 @+23dBm 530 LTE FDD Data transfer Band 30 @+23dBm TBD LTE FDD Data transfer Band 66 @+23dBm 700 LTE TDD Data transfer Band 38 @+23dBm 450 LTE TDD Data transfer Band 39 @+23dBm 320 LTE TDD Data transfer Band 40 @+23dBm 420 LTE TDD Data transfer Band 41 @+23dBm 440 The power consumption of L850 in 3CA mode as shown in the
3.3 Control Signal The L850 module provides two control signals for power on/off and reset operations, the pin defined as shown in the following table: Pin Pin Name I/O 6 FUL_CARD_POWER_ OFF# Reset Value Functions Type Power on/off signal,internalpull-up I PU 3.3/1.8V High or floating: Power on Low : Power off 67 RESET# I Reset signal, internal 10KΩ 1.8V pull-up,active low 3.3.1 Module Start-Up 3.3.1.1 Start-upCircuit The FUL_CARD_POWER_OFF# pin needs an external 3.3V or 1.
Figure 3-5 Timing Control for Start-up Note: The VSD2_1V8 signal is the internal PMU 1.8V output voltage which is not connected to the M.2 interface. The above timing of VSD2_1V8 is only for reference. The RESET# is required to pull high with a ton1 delay after the +3.3V, because it takes some time tocharge thecapacitors for +3.3V power supply. If the +3.3V power supply is already stable before starting upthe module, the delay time can be ignored. 3.3.
Figure 3-6 Software Shutdown Timing Control After the software shutdown, the FUL_CARD_POWER_OFF # pin will remain high which prevents the module from restarting again. Toenable the next restart, the FUL_CARD_POWER_OFF#pin should be pulled low after shutting down. Note: The VSD2_1V8 signal is the internal PMU 1.8V output voltage which is not connected to the M.2 interface. The above timing of VSD2_1V8 is only for reference. 3.3.
Figure 3-10 Reset Timing Control Note: RESET# is a sensitive signal, it’s recommended to add a filter capacitor close to the module. In case of PCB layout, the RESET# signal lines should keep away from the RF interference and protected by GND. Also, the RESET# signal lines shall neither near the PCB edge nor route on the surface planes to avoid module from reset caused by ESD problems. 3.4 USB Interface The L850 module supports USB2.
3.5 PCIe Interface L850 module supports PCIe 1.0 interface and one data transmission channel. After L850 module is inserted into PC, PCIe interface can, work with the drive program, map an MBIM port and a GNSS port in Win10 system. While MBIM interface is used for initiating data service in Win10 system and GNSS interface for receiving GNSS data. 3.5.
Figure 3-9 Reference Circuit for PCIe Interface L850 module supports one PCIe 1.0 interface, including three difference pairs: transmit pair TXP/N, receiving pair RXP/N and clock pair CLKP/N. PCIe can achieve the maximum transmission rate of 2.
Figure 3-10 Requirement of PCIe Line The difference in length of two data lines in difference pair should be within 5mil, and the length match is required for all parts. When the length match is conducted for the differential lines, the designed position of correct match should be close to that of incorrect match, as shown in Figure 3-11.
Pin Pin Name I/O Reset Value Description Type 30 UIM_RESET O L USIM reset 1.8V/3V 32 UIM_CLK O L USIM clock 1.8V/3V 34 UIM_DATA I/O L USIM data,internal pull up(4.7KΩ) 1.8V/3V USIM card detect, internal 390K pull-up. 66 SIM_DETECT I PD Active high, and high level indicates 1.8V SIM card is inserted; and low level indicates SIM card is detached. 3.6.2 USIM Interface Circuit 3.6.2.1 N.C. SIMCard Slot The reference circuit design for N.C.
Figure 3-13 Reference Circuit for N.O. SIM Card Slot The principlesof theN.O.SIM card slot are described as follows: When the SIM card is detached, it connects an open circuit between CD and SW pins, and drives the SIM_DETECT pin low. When the SIM card is inserted, it connects the short circuit between CD and SW pins, and drives the SIM_DETECT pin high. 3.6.
network registration after reading the SIM card information. When the SIM_DETECT pin is low, the module determines that the SIM card is detachedand does not read the SIM card. Note: By default, SIM_DETECT is active-high, which can be switched to active-low by the AT command. Please refer to the AT CommandsManual for the AT command. 3.6.
3.7.1 LED#1Signal The LED#1 signal is used to indicate the operating status of the module, and the detailed description as shown in the following table: Module Status LED1# Signal RF function ON Low level (LED On) RF function OFF High level (LED Off) The LED driving circuit is as follows: Figure 3-14 LEDDriving Circuit Note: The resistance of LED current-limiting resistor is selected according to the driving voltage and the driving current. 3.7.
3.7.3 TX_BLANKING When the module operates in LTE TDD Band 39, TX_BLANKING outputs the pulse signal synchronous with TDD burst TX timing. As TDD TX may interfere the receiving of GPS signal, AP will disable GPS or stop GPS data receiving when detecting TX_BLANKING pulse signal, so as to avoid abnormal operation of GPS.
Note： The function of W_DISABLE1# can be customized, please refer to the software porting guide. 3.8.2 BODYSAR The L850 module supportsBody SARfunction by detecting the DPR pin. The voltage level of DPR is high by default, and when the SAR sensor detects the closing human body, the DPR signal will be pulled down. As the result, the module then lowers down its emission power to its default threshold value, thus reducing theRF radiation onthe human body.
Pin Pin Name I/O Reset Value Pin Description Type Bit0 61 ANTCTL1 O 63 ANTCTL2 O Tunable ANT control,GPO interface, bit1 Tunable ANT control,GPO interface, Bit2 CMOS 1.8V CMOS 1.8V 3.11Config Interface The L850 module provides four config pins for the configuration as the WWAN-PCIe, USB3.0 type M.
4 Radio Frequency 4.1 RF Interface 4.1.1 RF Interface Functionality The L850 module supports two RF connectors used for external antenna connection. As the Figure 4-1 shows, “M” is for Main antenna, used to receive and transmit RF signals; “D/G” is for Diversity antenna, used to receive the diversity RF signals. Figure 4-1 RF connectors 4.1.2 RFConnector Characteristic Rated Condition Environment Condition Frequency Range DC to 6GHz Temperature Range Characteristic Impedance 50Ω –40°C to +85°C 4.
Figure 4-2 RF connector dimensions Figure 4-3 0.81mm coaxial antenna dimensions Figure 4-4 Schematic diagram of 0.81mm coaxial antenna connected to the RF connector Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
4.
Operating Description Mode Band 40 IMT 2300MHz LTE TDD 2300 - 2400 Band 41 BRS/EBS 2500MHZ LTE TDD 2496 - 2690 Band Tx (MHz) GPS L1 GLONASS L1 BeiDou Rx (MHz) N/A 1575.42±1.023 N/A 1602.5625±4 N/A 1561.098±2.046 4.3 Transmitting Power The transmitting power foreach band of the L850 moduleas shown in the following table: Mode WCDMA LTE FDD Band Tx Power(dBm) Note Band 1 23.5±1 Band 2 23.5±1 Band 4 23.5±1 Band 5 23.5±1 Band 8 23.
Mode LTE TDD Band Tx Power(dBm) Note Band 21 23±1 10MHz Bandwidth, 1 RB Band 26 23±1 10MHz Bandwidth, 1 RB Band 28 23±1 10MHz Bandwidth, 1 RB Band 30 23±1 10MHz Bandwidth, 1 RB Band 66 23±1 10MHz Bandwidth, 1 RB Band 38 23±1 10MHz Bandwidth, 1 RB Band 39 23±1 10MHz Bandwidth, 1 RB Band 40 23±1 10MHz Bandwidth, 1 RB Band 41 23±1 10MHz Bandwidth, 1 RB 4.
Mode Band LTE TDD Rx Sensitivity(dBm) Typical Note Band 18 TBD 10MHz Bandwidth Band 19 TBD 10MHz Bandwidth Band 20 TBD 10MHz Bandwidth Band 21 TBD 10MHz Bandwidth Band 26 TBD 10MHz Bandwidth Band 28 TBD 10MHz Bandwidth Band 29 TBD 10MHz Bandwidth Band 30 TBD 10MHz Bandwidth Band 66 TBD 10MHz Bandwidth Band 38 TBD 10MHz Bandwidth Band 39 TBD 10MHz Bandwidth Band 40 TBD 10MHz Bandwidth Band 41 TBD 10MHz Bandwidth Note: The above values are measuredfor the dual anten
Description Condition Cold start TBD Warm start TBD Hot Start TBD AGNSS Cold start TBD GPS Open Sky TBD GLONASS Open Sky TBD BeiDou Open Sky TBD GPS/GLONASS/BeiDou TTFF Sensitivity Test Result Note: Please note that GPS current is tested with RF disabled. 4.
L850 module Main antenna requirements LTE Band 17(700): 42 MHz LTE Band 18(800): 80 MHz LTE Band 19(800): 80 MHz LTE band 20(800): 71 MHz LTE band 21(1500): 63 MHz LTE band 26(850): 80 MHz LTE band 28(700): 100 MHz LTE band 29(700): 12 MHz LTE band 30(2300): 55 MHz LTE band 66(1700): 490MHz LTE band 38(2600): 50 MHz LTE Band 39(1900): 40 MHz LTE band 40(2300): 100 MHz LTE band 41(2500): 194 MHz GPS: 2MHz Bandwidth(GNSS/BeiDou) GLONASS: 8MHz BeiDou: 4MHz Impedance 50Ohm Input
5 Structure Specification 5.1 Product Appearance The product appearance for L850 module is shown in Figure5-1: Figure 5-1 Module Appearance 5.2 Dimension of Structure The structuraldimensionof the L850 module is shown in Figure 5-2: Figure 5-2 Dimension of Structure Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
5.3 M.2 Interface Model The L850 M.2 module adopts 75-pin gold finger as external interface, where 67 pins are signal pins and 8 pins are notch pins as shown in Figure 3-1. For module dimension, please refer to chapter 5.2. Based on the M.2 interface definition, L850 module adopts Type 3042-S3-B interface (30x42mm, the component maximum height on t top layer is 1.5mm, PCB thickness is 0.8mm, and KEY ID is B). 5.4 M.2 Connector The L850 module connects to AP via M.2 connector, it is recommended to use M.
Figure 5-3 M.2 Dimension of Structure 5.5 Storage 5.5.1 Storage Life Storage Conditions (recommended): Temperature is 23 ± 5 ℃, relative humidity is RH 35-70%. Storage period (sealed vacuum packing): Under the recommended storage conditions, the storage life is 12 months. 5.6 Packing The L850 module uses the tray sealed vacuum packing, combined with the outer packing method using the hard cartoon box, so that the storage, transportation and the usage of modules can be protected to the greatest extent.
5.6.1 Tray Package The L850 module uses tray package,20 pcs are packed in each tray, with 5 trays in each box and 6 boxes in each case. Tray packaging process is shown in Figure 5-4: Figure 5-4 Tray Packaging Process Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
5.6.2 Tray size The pallet size is 330*175*6.0mm, as shown in Figure 5-5: ITEM L W H T A0 B0 DIM 330.0±0.5 175.0±0.5 6.0±0.3 0.5±0.1 43±0.3 33.0±0.3 ITEM A1 B1 C D E F DIM 294.0±0.3 159.0±0.3 20.0±0.5 9.0±0.5 24.5±0.5 187.5±0.2 ITEM G J DIM 105.0±0.2 9.0±0.2 Figure 5-5Tray Size (Unit: mm) Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
