H330 HSPA+ Module Hardware User Manual Version: V1.0.
Confiden ntial Matterial This docum ment containss information n highly con nfidential to Shenzhen S G G&T Industria al Developm ment Co., Ltd d (Fibocom). Fibocom offfers this info ormation as a service to its custome ers, to suppo ort applicatio on and g efforts that use the pro oducts desig gned by Fibo ocom. The in nformation p provided is based b upon engineering requirementts specifically provided to Fibocom by the custo omers. All sp pecificationss supplied herein are subject to change.
C Contents s 1 2 3 4 5 Preface e ................................................................................................................................................. 5 1.1 S Scope ........................................................................................................................................ 5 1.2 S Standards .................................................................................................................................. 5 Introduction .........
5.5 5.6 5.7 5.8 5.9 6 7 U UART ....................................................................................................................................... 31 1 5.5 5.1 UART T Interface ............................................................................................................. 31 1 5.5 5.2 UART T Design ................................................................................................................ 32 2 U USIM ...........................................
1 Prefa ace 1.1 Sco ope This manua al provides th he electrical, mechanica al and enviro onmental requirements for properly y integrating the H330 HSPA+ modu ule in a host application. al gives a complete set of o hardware features an nd functions that may be e provided by H330. The e This manua availability of o any featurre or function, which is described d in this manual, depends o on the hardw ware revision n and softwarre version off a specific H330 H HAPA+ + module. 1.2 Stan ndards 3GPP TS T 27.
2 Intro oduction n 2.1 Prod duct Des scription n H330 is a high integrity 3G WCDMA A wireless module, m LGA A package, 120 1 pin. It ca an support S/EDGE GSM850/900/D DCS1800/PC CS1900MHz z and UMTS S/HSDPA/HS SUPA/HSPA A+ GSM/GPRS 850/900/190 00/2100MHzz. 2.2 Prod duct Spe ecificatio on Product Features F Supporte ed Bands： • 4 Band UMTS/HSPA U A (WCDMA//FDD) 850/900 0/1900/2100 0 MHz • 4 Band GSM G 850/900 0/1800/1900 0 MHz Data： • UMTS/HSDPA/HSUPA 3GPP re elease 7 • HSUPA 5.
• Storage Temperaturre：-40℃ ~ +85℃ Performa ance Operating g Voltage • Voltage: 3.6 ~ 4.
• MUX Over UART1 • Multiple Profiles over USB • SPI Supp port • I2C Supp port • I2S Supp port Data Feattures • Embedde ed TCP/IP and a UDP/IP protocol sta ack HSPA+ • Max uplin nk 5.
• Analog and a Digital Audio A • Voice co oders EFR/H HR/FR/AMR Audio Co ontrol • Broad ga ain control • Echo sup ppression • Noise su uppression • Side tone e Character Set • IRA • GSM • UCS2 • HEX Control/S Status Indic cations • GPIO’s • A/D • RTC AT Comm mand Set • G&T proprietary AT commands • GSM 07..05 • GSM 07..
• RoHS • CE • RRB 2.
3 Mech hanical 3.
3.
4 Hard dware Sc cope 4.
4.2 Pin Definitio on 4.2.1 Pin n Map 4.2.2 Pin n Descriptiion Notice: H33 30 logic elecctrical level iss1.8V.
46 V VIO O Digital po ower supply 1.8V. 47 V VRTC I/O Real time e clock powe er ,1.71V ~ 1.
V VSPK I Audio co odec speake er part powerr supply, con nnect to VBAT 11 I2 2S2_CLK1 O I2S2 cloc ck 24 I2 2S2_CLK0 O I2S2 cloc ck 25 I2 2S2_WA0 O I2S2 worrd alignmentt select 26 I2 2S2_TX O I2S2 tran nsmit line 27 I2 2S2_RX I I2S2 rece eive line 31 U USB_DP I/O USB data a line + 32 U USB_DM I/O USB data a line - 33 U USB_ID — USB ID line 34 V VUSB I USB pow wer supply 92 U USB_TEST — USB TES ST line 28 I2 2C_SDA I/O I2C data line 29 I2 2C_SCL O I2C clock k
45 U UART2_TXD D O UART2 Transmitted T Data 44 U UART2_RXD D I UART2 Received R Da ata ADC 50 A ADC2 Analog digital d converter 2（No ssupport） 51 A ADC1 Analog digital d converter 1（No ssupport） EINT 56 W WAKE_UP I Wake up p signal, low activity. 57 E EINT2 I External interrupt, low w activity.
105 N NC 106 N NC 107 N NC 108 N NC 78 N NC 79 N NC 80 N NC 81 N NC 82 N NC 83 N NC 84 N NC 85 N NC 87 N NC 88 N NC 94 N NC 95 N NC 96 N NC 101 N NC GND 2 G GND 12 G GND 21 G GND 30 G GND 43 G GND 58 G GND 63 G GND H330 HSPA+ Module Hardw ware User Ma anual Page 18 of 44 4
65 G GND 66 G GND 68 G GND 69 G GND 70 G GND 72 G GND 93 G GND 97 G GND 98 G GND 99 G GND 100 G GND 102 G GND 103 G GND 104 G GND 109 G GND 110 G GND 111 G GND 112 G GND 113 G GND 114 G GND 115 G GND 116 G GND 117 G GND 118 G GND 119 G GND 120 G GND H330 HSPA+ Module Hardw ware User Ma anual Page 19 of 44 4
5 Hard dware Interface 5.1 Pow wer Interfface 5.1.1 VBA AT The H330 power p supplyy must be a single exterrnal DC volta age source of 3.6V to 4.2V. The pow wer supply must be ablle to sustain n the voltage e level during g a GSM tra ansmit burst current serg ge, which may reach 2.0A. ment below:: It is requirem Parametter M Min. Rec commend Max. Unit VBAT 3 3.6 3.8 4.2 V Special care e must be ta aken when designing d the e power sup pply of the H330.
Recommended Capacito or 1000uF Usage Desc cription GSM Tra ansmit current s serge 10nF, 10 00nF Digital sw witching noisse Minim mizes powe er supply lossses during transmit burstts. Use maximum possible value. Filterrs digital log gic noises frrom clocks and data sourc ces. 8.2pF, 10pF 1800/190 00 MHz GSM M Filterrs transmisssion EMI. b bands 33pF, 39 9pF 850/900 MHz GSM bands Filterrs transmisssion EMI. 5.1.
15 4 45.0 0 150.9 5 6 68.6 10 4 47.1 15 4 44.6 5 5 565.1 10 2 213.6 15 105.4 19 9 91.3 5 5 583.4 10 2 217.7 15 105.5 19 9 911.0 0 3 353.5 5 167.6 10 9 95.3 15 8 86.3 0 3 373.7 5 174.4 10 100.4 15 9 91.6 8 4 488.7 14 142.4 19 9 90.9 8 5 504.7 14 146.
DCS180 00 PCL PCS190 00 PCL 19 9 91.2 2 4 498.4 9 104.6 15 9 91.0 2 4 496.9 9 113.1 15 9 98.4 5 1556.4 10 3 350.2 15 120.5 19 9 91.3 5 1595.4 10 3 358.8 15 9 90.9 19 9 97.9 0 9 952.9 5 2 270.6 10 115.1 15 9 92.4 0 9 957.2 5 2 278.1 10 110.6 15 9 92.4 24dBm 4 455.7 0dBm 142.0 -24dBm 135.
-50dBm 133.7 24dBm 5 512.5 0dBm 146.3 -24dBm 137.2 -50dBm 135.6 24dBm 5 564.2 0dBm 117.1 -24dBm 105.4 -50dBm 103.4 24dBm 4 431.9 0dBm 142.3 -24dBm 135.8 -50dBm 134.1 Band2 (1 1900) Band1 (2 2100) Band8 (9 900) 5.1.3 VIO O The H330 in ncorporates a regulated d voltage outtput VIO. Th he regulator provides a 1 1.8V output for use by the custome er applicatio on. It can be used as a in ndicator.
VRTC In nput Voltage e (RTC is working) w VRTC In nput Currentt (RTC is working) w 0.5 1.8 1.89 V 1.5 uA A VRTC refere ence design n is below: Notes： d resistor. R8 is limited VRTC consumption currrent is less than 2uA. ermine the re eserved time. C9 can dete 5.2 On/O Off/Rese et 5.2.1 Pin n Descriptiion H330 has 3 control sign nals to on, off o ,reset mod dule. on is below: Pin definitio Pin n# Pin Name Electrrical Level Description 48 POWER_OFF CMOS S 1.
5.2.2 Pow wer on When the H330 H is powe ered off, the e PMU opera ates at low power p mode, with only th he RTC time er active. H330 will po ower on aga ain when the e POWER_O ON signal is falling edge e. Asserting the POWER R_ON signal low for a minimum of 10 00 milliseco onds will turrn H330 on Parrameter Pullse width Condition Min. Typiical 100 300 M Max Unit ms Control timing is below:: Recommand Design: 5.2.3 Pow wer off When set s POWER R_OFF to low w level, H330 will be pow wer down.
Parrameter Pullse width Condition Min. Typiical M Max Unit 100 300 3 3000 ms Control timing is below:: Recommand Design: 5.2.4 Res set The RESET T_N input sig gnal would be b reset the H330 imme ediately. Whe en the RESET_N signa al is low, the H330 is reset without th he work net logging out. Important: or the system. When de esign it need d be protecte ed totally.
Parrameter Condition Pullse width Min. Typiical M Max Unit 100 300 3 3000 ms ： Control timing is below： Recommand Design： 5.3 Indicator Sig gnal 5.3.
5.3.2 Indicator Des scription 5.3.2.1 LP PG LPG workin ng state desccription is be elow: State W Work mode • NO SIM ca ard • SIM Error g network • Registering 60 00ms High, 600ms Low w • Register network failurre (always) • IDLE mode e 75 5ms High, 3S 3 Low • Calling Lo ow • Data comm municating 75 5ms High, 75ms 7 Low • Calling Sle eep H High Notice：Hig gh level is 1..8V. 5.3.2.2 MI SM Module Mode SMI Working W mod de Sleep Mode e 2.5S High; H 100ms Low Other Mode e Low 5.3.2.
5.3.2.4 Otther Pin Name Electriical Level Description VTRX 1.8V RF Transceiver PM MU work indicator VPA 0-4.3V It workss in Tx mode e, when the low power iit is about 0.65V V, when the max. m power it is about 4..3V, other mode m it is 0V V Notice: They are in ndicator sign nal, it cannott be used for other, it ca an be set NC C. 5.4 USB B Interfac ce 5.4.
T101 and T102 should be low capa acitor TVS, it is below 1 pF. VUSB is US SB power su upply, it is 2.5V ~ 5.25V. Notice: VUSB shou uld be conne ect to a level (2.5V ~ 5.2 25V) or USB B cannot be recognized. r USB_DP an nd USB_DM M are high sp peed lines, itt is 480 Mbp ps, It is PCB B Layout requirement be elow: Th he layout dessign of this circuit c on the e AP board should s comp ply with the USB 2.0 hig gh speed pro otocol, with differential d lining and im mpedance co ontrol to 90 ohm.
38 UART1_D DCD O UART1 Carrier De etect 39 UART1_C CTS I UART1 Clear to se end 40 UART1_R RTS O UART1 Request to o send 41 UART1_T TXD O UART1 Transmitte ed Data 42 UART1_R RXD I UART1 Received Data Pin# Pin Name e I/O Description 44 UART2_R RXD I UART2 2 Transmitte ed Data 45 UART2_T TXD O UART2 2 Received Data UART2 5.5.
Notice: T high level is i 1.8V. H330 UART If DTE is no ot suitable, need n add ele ectrical level translation.. When use itt, need care e about the signal s directiion. 5.6 USIM M H330 support s USIM M ,now don’t support hig gh speed SIM. 5.6.
Notice: p internal H3 330. USIM_IO is pulled up D can support SIM hot plug, p low is active a and SIM card is in nserted。 USIM_CD 5.6.3 USIIM Design n Notice The SIM intterface and signals s design is extrem mely importa ant for prope er operation of H330 and d the SIM card. There are several design guid delines that must m be follo owed to ach hieve a robusst and stable e design tha at equired stan ndards and regulations.
5.6.4 USIIM Hot Plu ug H330 suppo ort SIM hot plug. p 5.6.4.1 Ha ardware Design When SIM is i removed, USIM_CD is high; insert SIM ,USIM M_CD is low w。 In reference e design USIM_CD conn nect U3 Pin8 8（SW2）,P Pin7（SW1） connect GND. When no SIIM card, SW W2 is high; In nsert SIM, SW2 S connectt SW1,USIM M_CD is pulled down。 5.6.4.2 So oftware Des sign When set AT+MSMPD= AT =1, the SIM detected fea ature will be e actives. The SIM card is on site orr not will be detected witth SIM_CD pin.
21 AGND GND Audio o GND 22 VSPK I Audio o codec speaker part po ower supply, connect to VBAT 5.7.2 Aud dio Description The audio input an nd output cha annels are differential d in nterfaces. An nd have prefect perform mance at RF uppression. When W conne ect to the ha andset, need d external au udio amplifie er.
Gain Programm mable，step ps gain:2dB 32 0 Load resistance r 2.2 dB Kohm Audio channel c 2：A AUXO outpu ut characterristic： Param meters Test con nditions Out vo oltage No load Min Typ Max Unit 4 Vpp Load resistance r 8 ohm DC Bia as voltage 2 V 5.
5.8.1 I2S C 5.8.2 I2C Notice: I can be set s master mode m of slavver mode （1） I2S （2） It I support so ome audio sample rate (48KHz, ( 44.1KHz, 32KH Hz, 24 KHz, 22.5 KHz, 16 1 KHz, 12 K KHz, 11.025 5 KHz, 8 KHzz ). 5.9 Othe er Other are a not supp ported like GPIO、MIPI、 G 、MMC、DA AC now.
6 Electtrical an nd Environmenttal 6.1 Elec ctrical Ch haracteristic The table iss H330 electtrical characteristic： Min. Max. Un nit VBAT -0.2 4.2 V Digital Sign nal -0.2 1.9 V 6.2 Env vironmen ntal Charracteristic The table iss H330 envirronmental ch haracteristicc: C Condition Operationa al Temperatu ure Storage ure Temperatu H330 HSPA+ Module Hardw ware User Ma anual Min n. Max.
7 RF In nterface e H330 module m inclu udes main an ntenna and diversity anttenna. Main an ntenna：GS SM/WCDMA A Tx and Rx . Diversitty antenna：WCDMA diversity Rx . 7.1 Ope erational Band 7.1.
RF PCB Design 7.1.3 Lay yout Guide eline When desig gn RF, we ne eed connectt H330 modu ule RF pin to o antenna, we w recomme ended to use e micro-line The shorterr the better, insert i loss <0.2dB，and < d impedance e is 50ohm.。 。 It is recomm mended to mount m H330 module and d antenna co onnector to the t same sid de of layout . Add a π-typ pe circuit (tw wo parallel de evice ground d pin directly y to the main land) for a antenna mattching. 7.1.
standing wa ave ratio (VS SWR) is ano other expresssion of S11.. S11 relatess to the ante enna efficien ncy. S11 can n be measure ed with vecto or analyzer. S11 of the maste er antenna < –10 dB 3. Polarizzation The polariza ation of an antenna a is th he orientatio on of the elec ctric field ve ector that rottates with tim me in the direction of maximum ra adiation。 p n is recomm mended forr the antenn na：diversitty antenna different to o main The linear polarization antenna 。 4.
PCS1900 0>25dBm TIS (Tootal Isotropic Sensitivity): W850/W900<-102d dBm W2100<-10 03dBm; /W1900/W GSM850 0<-102dBm m GSM900 0<-102dBm m DCS1800 0/PCS1900 0<-102dBm m 7.2.2 Div versity anttenna desiign H330 diverssity antenna is optical, Iff need to support divers sity, must to increase the e diversity antenna. Diversity an ntenna desig gn methods and the maiin antenna, its efficiencyy indicators to allow the lower 3dB.
4. A label must be afffixed to the outside o of th he end produ uct into whicch the H330 Module is in ncorporated, evice contains FCC ID: ZMOH330. with a statement similarr to the following: For H330: This de 5. h the end pro oduct must clearly c indic cate the operrating requirrements and d conditions A user manual with e observed to t ensure co ompliance with w current FCC F RF exp posure guide elines.
