Bluetooth LE Module EFBTLE16 Data S hee t Eugster / Frismag AG • Elektrohaushaltgeräte • Hauptsitz • Fehlwiesstrasse 14 • CH-8580 Amriswil
PURPOSE This document contains descriptions and specifications of the BLE Module EFBTLE16. 2 ABBREVATIONS DTM Direct Test Mode BLE Bluetooth Low Energy 3 REFERENCES [1] ZEM024-BTLE-PCB-008-A production data: SVN #373 [2] Needed_Technical_Information_for_Safety_Measurements_General.docx [3] Kingboard Lamina FR4 E123995.pdf [4] nRF51822 specifications, Nordic http://www.nordicsemi.com nRF51822-PS.pdf [5] Evaluation Board for BLE Module evaluation and testing: EVB 1.
4 RATINGS Supply voltage VDD: 2.65 – 3.6V Supply current: Max. 15mA Power consumption: Max. 54mW IO Voltage: Max VDD + 0.3V Operating temperature: -20 – 80°C For detailed specifications please refer to the nRF51822 specifications from Nordic [2]. 5 PRODUCT DESCRIPTION Bluetooth Version: 4.1 Band support: 2.4GHz, 40 Channels (2.402MHz – 2.480MHz) Typical conducted output power: 0dBm Radiated output Power (EIRP): -1.9 – 0.
6.1 BLOCK DIAGRAM 6.2 DIMENSIONS (TOP VIEW) 10 9 8 7 6 5 4 3 17.4 mm 12.2 mm 4 x 2.54mm 6.9 mm 1. SWDIO 2. SWCLK 3. GPIO1 4. COM_DISABLE 5. VDD 6. GND 7. RTS/CLK 8. CTS/CS 2 9. TXD/MISO 1 10. RXD/MOSI 2.54mm Image 1 Module dimension, top view with pinout (not to be scaled) 6.
7 RTS/CLK UART ready to send / SPI clock output/input 8 CTS/CS UART clear to send / SPI chip select input 9 TXD/MISO UART output / SPI Master input output 10 RXD/MOSI UART input / SPI Master output input Table 1 Pin description 6.3.1 POWER SUPPLY Decoupling capacitors between VDD and GND are not mandatory. 6.3.2 HOST INTERFACE Communication between BLE module and host can be established through UART or SPI by using TXD/MISO, RXD/MOSI, CTS/CS and RTS/CLK.
7 RF PERFORMANCE 7.1 ANTENNA DESIGN The EFBTLE16 comes with a microstrip PCB antenna. There is no option for using an external antenna or any antenna matching by the module integrator. The EFBTLE16 is FCC approved with only this antenna type. 7.2 ANTENNA MATCHING The antenna matching is performed on a standalone BLE Module with RF Shield mounted.
.3 RADIATION PATTERN The radiation pattern where recorded in an anechoic chamber to see the characteristic radiation pattern.
Min drill size: 0.25mm (9.8 mil) Solder resist: Top and bottom (green) Silk screen: white 9.2 MATERIAL For detailed material properties and manufacturer speficiations please check [2][3]. 9.3 PCB PRODUCTION 9.3.1 SIDEPLATING Please note, the 4 slots for soldering the RF shield must be plated. Therefore, these holes must be produced together with the vias (see Image 7). 9.3.2 PANEL CONNECTIONS Connections to the panel are only allowed on the upper and lower border of the module.
10 SHIELD SPECIFICATIONS The RF shield reduces RF emissions and immisions and helps to better place the assembled module on the target hardware. Product descriptions and information (such as FCC-ID e.g.) are printed on the shield. The shield is also required for FCC modular approvals. Image 8 RF shield 3D visualisation 10.1 TOP VIEW Image 9 RF shield top view 10.
.3 SIDE VIEW Image 11 RF shield side view 11 TEST BOARD For initial programming and testing, the Test Board [5] as shown below is used.
12 RF EXPOSURE This equipment complies with radiation exposure limits set forth for an uncontrolled environment. This equipment is in direct contact with the body of the user under normal operating conditions. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Cet équipement est conforme aux limites d'exposition aux radiations dans un environnement non contrôlé.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
.4 IC LABELING REQUIREMENTS The host device should be properly labeled to identify the module within the host device.
