ESP32MINI1U Datasheet Containing UltraLowPower SoC with SingleCore CPU Supporting 2.4 GHz WiFi, Bluetooth, and Bluetooth LE Pre-release v0.5 Espressif Systems Copyright © 2021 www.espressif.
About This Document This document provides specifications for the ESP32-MINI-1U module. Document Updates Please always refer to the latest version on https://www.espressif.com/en/support/download/documents. Revision History For revision history of this document, please refer to the last page. Documentation Change Notification Espressif provides email notifications to keep customers updated on changes to technical documentation. Please subscribe at www.espressif.com/en/subscribe.
1 Module Overview 1 Module Overview 1.1 Features • Class-1, class-2, and class-3 transmitter MCU • AFH • ESP32-U4WDH embedded, Xtensa® single-core 32-bit LX6 microprocessor, up to 160 MHz • CVSD and SBC • 448 KB ROM Hardware • 520 KB SRAM • Interfaces: SD card, UART, SPI, SDIO, I2C, LED • 16 KB SRAM in RTC PWM, motor PWM, I2S, infrared remote controller, pulse counter, GPIO, touch sensor, ADC, DAC, WiFi Two-Wire Automotive Interface (TWAI® , compatible with ISO11898-1) • 802.
1 Module Overview 1.3 Applications • Generic Low-power IoT Sensor Hub • Smart Building • Generic Low-power IoT Data Loggers • Industrial Automation • Cameras for Video Streaming • Smart Agriculture • Over-the-top (OTT) Devices • Audio Applications • USB Devices • Health Care Applications • Speech Recognition • Wi-Fi-enabled Toys • Image Recognition • Mesh Network • Wearable Electronics • Home Automation • Retail & Catering Applications Espressif Systems 4 ESP32-MINI-1U Datasheet v0.
Contents Contents 1 Module Overview 3 1.1 Features 3 1.2 Description 3 1.3 Applications 4 2 Block Diagram 9 3 Pin Definitions 10 3.1 Pin Layout 10 3.2 Pin Description 10 3.3 Strapping Pins 12 4 Electrical Characteristics 14 4.1 Absolute Maximum Ratings 14 4.2 Recommended Operating Conditions 14 4.3 DC Characteristics (3.3 V, 25 °C) 14 4.4 Current Consumption Characteristics 15 4.5 Wi-Fi RF Characteristics 16 4.5.1 Wi-Fi RF Standards 16 4.5.
Contents 9 MAC Addresses and eFuse 28 10 Learning Resources 29 10.1 Must-Read Documents 29 10.2 Must-Have Resources 29 Revision History Espressif Systems 30 6 ESP32-MINI-1U Datasheet v0.
List of Tables List of Tables 1 Pin Definitions 10 2 Strapping Pins 12 3 Absolute Maximum Ratings 14 4 Recommended Operating Conditions 14 5 DC Characteristics (3.
List of Figures List of Figures 1 ESP32-MINI-1U Block Diagram 2 Pin Layout (Top View) 10 3 ESP32-MINI-1U Schematics 22 4 Peripheral Schematics 23 5 Physical Dimensions 24 6 Recommended PCB Land Pattern 25 7 U.FL Connector Dimensions 26 8 Reflow Profile 27 Espressif Systems 9 8 ESP32-MINI-1U Datasheet v0.
3 Pin Definitions 3 Pin Definitions 3.1 Pin Layout The pin diagram below shows the approximate location of pins on the module. For the actual diagram drawn to GND GND GND GND GND GND GND GND GND GND GND GND GND GND Pin 54 Pin 53 Pin 52 Pin 51 Pin 50 Pin 49 Pin 48 Pin 47 Pin 46 Pin 45 Pin 44 Pin 43 Pin 42 Pin 41 scale, please refer to Section 7.1 Physical Dimensions.
3 Pin Definitions Table 1 – cont’d from previous page Name No. Type Function High: enables the chip EN 8 I Low: the chip powers off Note: do not leave the pin floating I34 9 I GPIO34, ADC1_CH6, RTC_GPIO4 I35 10 I GPIO35, ADC1_CH7, RTC_GPIO5 IO32 11 I/O GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4, TOUCH9, RTC_GPIO9 IO33 12 I/O GPIO33, XTAL_32K_N (32.
3 Pin Definitions 3.3 Strapping Pins ESP32 has five strapping pins, which can be seen in Chapter 5 Schematics: • MTDI = IO12 • GPIO0 = BOOT/IO0 • GPIO2 = IO2 • MTDO = IO15 • GPIO5 = IO5 Software can read the values of these five bits from register ”GPIO_STRAPPING”.
3 Pin Definitions Note: • FE: falling-edge, RE: rising-edge • Firmware can configure register bits to change the settings of ”Voltage of Internal LDO (VDD_SDIO)”and ”Timing of SDIO Slave”, after booting. • The module integrates a 3.3 V SPI flash, so the pin MTDI cannot be set to 1 when the module is powered up. Espressif Systems 13 ESP32-MINI-1U Datasheet v0.
4 Electrical Characteristics 4 Electrical Characteristics 4.1 Absolute Maximum Ratings Stresses beyond the absolute maximum ratings listed in the table below may cause permanent damage to the device. These are stress ratings only, and do not refer to the functional operation of the device that should follow the recommended operating conditions. Table 3: Absolute Maximum Ratings Symbol Parameter Min Max Unit VDD33 Power supply voltage –0.3 3.
4 Electrical Characteristics Symbol Parameter Min Typ Max Unit - 28 - mA Low-level sink current (VDD1 = 3.3 V, VOL = 0.495 V, IOL output drive strength set to the maximum) RP U Resistance of internal pull-up resistor - 45 - kΩ RP D Resistance of internal pull-down resistor - 45 - kΩ - - 0.6 VIL_nRST Low-level input voltage of CHIP_PU to power off the chip V Note: 1. Please see Appendix IO_MUX of ESP32 Series Datasheet for IO’s power domain.
4 Electrical Characteristics Table 7: Current Consumption Depending on Work Modes Work mode Description The CPU is Modem-sleep 1, 2 powered on 3 Current consumption (Typ) 160 MHz 27 ~ 34 mA Normal speed: 80 MHz 20 ~ 25 mA Light-sleep — 0.
4 Electrical Characteristics Table 9: Transmitter Characteristics Parameter TX Power Rate Typ 11b, 1 Mbps 15 11b, 11 Mbps 11g, 6 Mbps 15 15 11g, 54 Mbps 15 11n, HT20, MCS0 15 11n, HT20, MCS7 15 11n, HT40, MCS0 15 11n, HT40, MCS7 15 Unit dBm 4.5.3 Receiver Characteristics Table 10: Receiver Characteristics Parameter Rate Typ Unit RX Sensitivity 1 Mbps –97 dBm 2 Mbps –94 5.
4 Electrical Characteristics Parameter Rate RX Maximum Input Level 11b, 1 Mbps 5 11b, 11 Mbps 5 11g, 6 Mbps 0 11g, 54 Mbps –8 Adjacent Channel Rejection Typ 11n, HT20, MCS0 0 11n, HT20, MCS7 –8 11n, HT40, MCS0 0 11n, HT40, MCS7 –8 11b, 11 Mbps 35 11g, 6 Mbps 27 11g, 54 Mbps 13 11n, HT20, MCS0 27 11n, HT20, MCS7 12 11n, HT40, MCS0 16 11n, HT40, MCS7 7 Unit dBm dB 4.6 Bluetooth Radio 4.6.
4 Electrical Characteristics Parameter Conditions Min Typ Max Gain control step - - 3 - RF power control range - –12 - +9 dBm +20 dB bandwidth - - 0.9 - MHz F = F0 ± 2 MHz - –55 - dBm F = F0 ± 3 MHz - –55 - dBm F = F0 ± > 3 MHz - –59 - dBm ∆ f 1avg - - - 155 kHz ∆ f 2max - 127 - - kHz ∆ f 2avg /∆ f 1avg - - 0.92 - - ICFT - - –7 - kHz Drift rate - - 0.
4 Electrical Characteristics 4.6.4 Transmitter –Enhanced Data Rate Table 14: Transmitter Characteristics –Enhanced Data Rate Parameter Conditions Min Typ Max RF transmit power (see note under Table 12) - - 0 - dBm Gain control step - - 3 - dB RF power control range - –12 - +9 π/4 DQPSK max w0 - - –0.72 - kHz π/4 DQPSK max wi - - –6 - kHz π/4 DQPSK max |wi + w0| - - –7.42 - kHz 8DPSK max w0 - - 0.7 - kHz 8DPSK max wi - - –9.
4 Electrical Characteristics 4.7.2 Transmitter Table 16: Transmitter Characteristics –Bluetooth LE Parameter Conditions Min Typ Max RF transmit power (see note under Table 12) - - 0 - dBm Gain control step - - 3 - dB RF power control range - –12 - +9 dBm F = F0 ± 2 MHz - –55 - dBm F = F0 ± 3 MHz - –57 - dBm F = F0 ± > 3 MHz - –59 - dBm ∆ f 1avg - - - 265 kHz ∆ f 2max - 210 - - kHz ∆ f 2avg /∆ f 1avg - - +0.
8 Product Handling 8 Product Handling 8.1 Storage Conditions The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric environment of < 40 °C and /90%RH. The module is rated at the moisture sensitivity level (MSL) of 3. After unpacking, the module must be soldered within 168 hours with the factory conditions 25±5 °C and /60%RH. If the above conditions are not met, the module needs to be baked. 8.
9 MAC Addresses and eFuse 9 MAC Addresses and eFuse The eFuse in ESP32 has been burnt into 48-bit mac_address.
10 Learning Resources 10 Learning Resources 10.1 MustRead Documents Please familiarize yourself with the following documents: • ESP32 Hardware Resources The zip files include the schematics, PCB layout, Gerber and BOM list of ESP32 modules and development boards. • ESP32 Hardware Design Guidelines The guidelines outline recommended design practices when developing standalone or add-on systems based on the ESP32 series of products, including the ESP32 chip, the ESP32 modules and development boards.
Revision History Revision History Date Version Release notes 2021-05-25 V0.5 Pre-release Espressif Systems 30 ESP32-MINI-1U Datasheet v0.
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