ESP32-S2-WROOM & ESP32-S2-WROOM-I User Manual Prerelease version 0.5 Espressif Systems Copyright © 2020 www.espressif.
About This Document This document provides the specifications for the ESP32-S2-WROOM and ESP32-S2-WROOM-I module. Document Updates Please always refer to the latest version on https://www.espressif.com/en/support/download/documents. Revision History For revision history of this document, please refer to the last page. Documentation Change Notification Espressif provides email notifications to keep customers updated on changes to technical documentation. Please subscribe at www.espressif.com/en/subscribe.
1. Module Overview 1. Module Overview 1.1 Features MCU Hardware • Interfaces: GPIO, SPI, LCD, UART, I2 C, I2 S, Cam- • ESP32-S2 embedded, Xtensa® single-core 32-bit era interface, IR, pulse counter, LED PWM, USB LX7 microprocessor, up to 240 MHz OTG 1.1, ADC, DAC, touch sensor, temperature • 128 KB ROM sensor • 40 MHz crystal oscillator • 320 KB SRAM • 4 MB SPI flash • 16 KB SRAM in RTC • Operating voltage/Power supply: 3.0 ~ 3.
1. Module Overview At the core of this module is ESP32-S2 *, an Xtensa® 32-bit LX7 CPU that operates at up to 240 MHz. The chip has a low-power co-processor that can be used instead of the CPU to save power while performing tasks that do not require much computing power, such as monitoring of peripherals. ESP32-S2 integrates a rich set of peripherals, ranging from SPI, I²S, UART, I²C, LED PWM, LCD, Camera interface, ADC, DAC, touch sensor, temperature sensor, as well as up to 43 GPIOs.
2. Pin Definitions 2. Pin Definitions 2.
2. Pin Definitions Table 2: Pin Definitions Name No.
2. Pin Definitions Name No. Type Function High: on, enables the chip. EN 41 I Low: off, the chip powers off. Note: Do not leave the EN pin floating. GND 42 P Ground Notice: For peripheral pin configurations, please refer to ESP32-S2 User Manual. 2.3 Strapping Pins ESP32-S2 has three strapping pins: GPIO0, GPIO45, GPIO46.
2.4.Pin Definitions Note: 1. Firmware can configure register bits to change the settings of ”VDD_SPI Voltage”. 2. Internal pull-up resistor (R1) for IO45 is not populated in the module, as the flash in the module works at 3.3 V by default (output by VDD_SPI). Please make sure IO45 will not be pulled high when the module is powered up by external circuit. 3. ROM code can be printed over TXD0 (by default) or DAC_1 (IO17), depending on the eFuse bit. 4.
3. Electrical Characteristics 3. Electrical Characteristics 3.1 Absolute Maximum Ratings Table 4: Absolute Maximum Ratings Min Max Power supply voltage –0.3 3.6 V Storage temperature –40 85 °C Symbol Parameter VDD33 TST ORE Unit 3.2 Recommended Operating Conditions Table 5: Recommended Operating Conditions Symbol Parameter Min Typ Max VDD33 Power supply voltage 3.0 3.3 3.6 V IV DD Current delivered by external power supply 0.
4. Electrical Characteristics 4.1 Current Consumption Characteristics With the use of advanced power-management technologies, the module can switch between different power modes. For details on different power modes, please refer to Section RTC and Low-Power Management in ESP32S2 User Manual. Table 7: Current Consumption Depending on RF Modes Work mode Description TX Active (RF working) RX Average Peak 802.11b, 20 MHz, 1 Mbps, @ 22.31dBm 190 mA 310 mA 802.11g, 20 MHz, 54 Mbps, @ 25.
5. Electrical Characteristics 5.5 Wi-Fi RF Characteristics 5.5.1 Wi-Fi RF Standards Table 9: Wi-Fi RF Standards Name Description Center frequency range of operating channel 2412 ~ 2462 MHz note1 Wi-Fi wireless standard IEEE 802.11b/g/n 11b: 1, 2, 5.5 and 11 Mbps 20 MHz Data rate 11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps 11n: MCS0-7, 72.2 Mbps (Max) 40 MHz 11n: MCS0-7, 150 Mbps (Max) Antenna type PCB antenna, IPEX antenna 1.
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6. Physical Dimensions and PCB Land Pattern 6. Physical Dimensions and PCB Land Pattern 6.1 Physical Dimensions Unit: mm Tolerance: +/-0.1 mm 3.30±0.15 1.00 4.00 0.90 0.85 0.85 0.45 0.9 1 1.50 15.45 0.90 1.50 0.50 15.84 2.25 0.50 1.00 19.30 23.10 4.00 2,25 10.19 0.1 10.44 31.00±0.15 0.80 8.35 6.30 18.00±0.15 0.45 Top View Side View Bottom View Figure 6: Physical Dimensions Espressif Systems 12 ESP32-S2-WROOM & ESP32-S2-WROOM-I User Manual V0.
6. Physical Dimensions and PCB Land Pattern 6.2 Recommended PCB Land Pattern Unit: mm Via for thermal pad Copper 42x1.50 Antenna Area 1 42 42x0.90 4.10 0.40 1.50 0.40 15.45 0.50 0.50 1.10 4.10 31.00 1.10 7.81 1.00 6.30 18.00 17 26 1.50 2.25 Figure 7: Recommended PCB Land Pattern Espressif Systems 13 ESP32-S2-WROOM & ESP32-S2-WROOM-I User Manual V0.
6. Physical Dimensions and PCB Land Pattern 6.3 U.FL Connector Dimensions Unit: mm Figure 8: U.FL Connector Dimensions Espressif Systems 14 ESP32-S2-WROOM & ESP32-S2-WROOM-I User Manual V0.
7. Product Handling 7. Product Handling 7.1 Storage Condition The products sealed in Moisture Barrier Bag (MBB) should be stored in a noncondensing atmospheric environment of < 40 °C/90%RH. The module is rated at moisture sensitivity level (MSL) 3. After unpacking, the module must be soldered within 168 hours with factory conditions 25±5 °C/60%RH. The module needs to be baked if the above conditions are not met. 7.
8. MAC Addresses and eFuse 8. MAC Addresses and eFuse The eFuse in ESP32-S2 has been burnt into 48-bit mac_address. The actual addresses the chip uses in station and AP modes correspond to mac_address in the following way: • Station mode: mac_address • AP mode: mac_address + 1 There are seven blocks in eFuse for users to use. Each block is 256 bits in size and has independent write/read disable controller.
9. Antenna Specifications 9. 9.1 Antenna Specifications PCB Antenna Model: ESP ANT B Assembly: PTH Gain: 0 Espressif Systems 17 ESP32-S2-WROOM & ESP32-S2-WROOM-I User Manual V0.
9. Antenna Specifications Dimensions: Pattern Plots: Espressif Systems 18 ESP32-S2-WROOM & ESP32-S2-WROOM-I User Manual V0.
9. Antenna Specifications Espressif Systems 19 ESP32-S2-WROOM & ESP32-S2-WROOM-I User Manual V0.
9. Antenna Specifications 9.2 IPEX Antenna Specifications: Gain: Espressif Systems 20 ESP32-S2-WROOM & ESP32-S2-WROOM-I User Manual V0.
9. Antenna Specifications Directivity Diagram: Dimensions: Espressif Systems 30 ESP32-S2-WROOM & ESP32-S2-WROOM-I Datasheet V0.
10. Learning Resources 10. Learning Resources 10.1 Must-Read Documents The following link provides documents related to ESP32-S2. • ESP32-S2 User Manual This document provides an introduction to the specifications of the ESP32-S2 hardware, including overview, pin definitions, functional description, peripheral interface, electrical characteristics, etc. • ESP-IDF Programming Guide It hosts extensive documentation for ESP-IDF ranging from hardware guides to API reference.
Revision History Revision History Date Version Release notes 2020-03-10 V0.5 Preliminary release Espressif Systems 23 ESP32-S2-WROOM & ESP32-S2-WROOM-I User Manual V0.
OEM Guidance 1. Applicable FCC rules This module is granted by Single Modular Approval. It complies to the requirements of FCC part 15C, section 15.247 rules. 2. The specific operational use conditions This module can be used in IoT devices. The input voltage to the module is nominally 3.3V-3.6 V DC. The operational ambient temperature of the module is -30 to 85 degree C. Only the embedded PCB antenna is allowed. Any other external antenna is prohibited. 3. Limited module procedures N/A 4.
built into a host as a portable usage, the additional RF exposure evaluation may be required as specified by 2.1093. 6. Antenna Antenna type: PCB antenna/Dipole Antenna; Peak gain: 3.40dBi /2.33dBi 7. Label and compliance information An exterior label on OEM’s end product can use wording such as the following: “Contains Transmitter Module FCC ID: 2AC7Z-ESP32S2WROOM” or “Contains FCC ID: 2AC7Z-ESP32S2WROOM.” 8.
The host integrator installing this module into their product must ensure that the final composite product complies with the FCC requirements by a technical assessment or evaluation to the FCC rules, including the transmitter operation and should refer to guidance in KDB 996369. For host products with certified modular transmitter, the frequency range of investigation of the composite system is specified by rule in Sections 15.
