ESP32-PICO-V3-ZERO User Manual Version 1.0 Espressif Systems Copyright © 2020 www.espressif.
About This Document This document provides the specifications for the ESP32-PICO-V3-ZERO module. Document Updates Please always refer to the latest version on https://www.espressif.com/en/support/download/documents. Revision History For revision history of this document, please refer to the last page. Documentation Change Notification Espressif provides email notifications to keep customers updated on changes to technical documentation. Please subscribe at www.espressif.com/en/subscribe.
1. Module Overview 1. Module Overview 1.1 Features • NZIF receiver with –97 dBm sensitivity MCU • ESP32 embedded, Xtensa® dual-core 32-bit LX6 microprocessor, up to 240 MHz • 448 KB ROM for booting and core functions • Class-1, class-2 and class-3 transmitter • AFH • CVSD and SBC • 520 KB SRAM for data and instructions • 16 KB SRAM in RTC Hardware • Interfaces: 3 × UART, I2 C, I2 S, SPI, SDIO, touch pin, EN pin, interrupt pin and other GPIOs Wi-Fi • 802.11b/g/n20/n40 • Bit rate: 802.
1. Module Overview 1.
3. Pin Definitions 2. Pin Definitions 2.
2. Pin Definitions Table 1: Pin Definitions Name No.
2. Pin Definitions 2.3 Strapping Pins ESP32 has five strapping pins: MTDI, GPIO0, GPIO2, MTDO, GPIO5. The pin-pin mapping between ESP32 and the module is as follows, which can be seen in Chapter 5 Schematics: • MTDI = IO12 • GPIO0 = BOOT/IO0 • GPIO2 = IO2 • MTDO = IO15 • GPIO5 = IO5 Software can read the values of these five bits from register ”GPIO_STRAPPING”.
2. Pin Definitions Note: • FE: falling-edge, RE: rising-edge. • Firmware can configure register bits to change the settings of ”Voltage of Internal LDO (VDD_SDIO)” and ”Timing of SDIO Slave”, after booting. • The operating voltage of ESP32-PICO-V3-ZERO’s integrated external SPI flash is 3.3 V. Therefore, the strapping pin MTDI should hold bit ”0” during the module power-on reset.
3. Electrical Characteristics 3. Electrical Characteristics 3.1 Absolute Maximum Ratings Stresses beyond the absolute maximum ratings listed in the table below may cause permanent damage to the device. These are stress ratings only, and do not refer to the functional operation of the device that should follow the recommended operating conditions. Table 3: Absolute Maximum Ratings Min Max Power supply voltage 3.0 3.
4. Electrical Characteristics Symbol Parameter High-level source current 1 (VDD = 3.3 V, IOH power domain 1, 2 VDD3P3_RTC VOH >= 2.64 V, output drive strength set to the maximum) VDD3P3_CPU power domain 1, 2 VDD_SDIO power domain 1, 3 Min Typ Max Unit - 40 - mA - 40 - mA - 20 - mA - 28 - mA Low-level sink current IOL (VDD1 = 3.3 V, VOL = 0.
4. Electrical Characteristics Table 7: Current Consumption Depending on Work Modes Work mode Modem-sleep Description The CPU is powered on 240 MHz 30 ~ 68 mA 160 MHz 27 ~ 44 mA Normal speed: 80 MHz 20 ~ 31 mA Light-sleep — 0.8 mA The ULP co-processor is powered on. 150 µA ULP sensor-monitored pattern Deep-sleep Power off Current consumption (Typ) 100 µA @1% duty RTC timer + RTC memory 10 µA RTC timer only 5 µA CHIP_PU is set to low level, the chip is powered off.
3. Electrical Characteristics 3.5.2 Transmitter Characteristics Table 9: Transmitter Characteristics Parameter TX Power note Condition Unit 802.11b: 24.41dBm 802.11g: 23.64dBm 802.11n20: 23.30dBm 802.11n40: 21.95dBm dBm Note: Target TX power is configurable based on device or certification requirements. 3.5.3 Receiver Characteristics Table 10: Receiver Characteristics Parameter Rate Typ Unit RX Sensitivity 1 Mbps –97 dBm 2 Mbps –94 5.
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4. Electrical Characteristics Parameter Conditions Min Typ Max Intermodulation - –36 - - Max Unit - Unit dBm 3.6.2 Transmitter Table 16: Transmitter Characteristics Parameter Conditions Min RF Frequency - 2402 Typ - Gain control step - - 3 RF power - 2480 MHz BT3.0:8.74dBm;BLE:6.08dBm dB dBm F = F0 ± 2 MHz - –55 - dBm F = F0 ± 3 MHz - –57 - dBm F = F0 ± > 3 MHz - –59 - dBm ∆ f 1avg - - - 265 kHz ∆ f 2max - 210 - - kHz ∆ f 2avg /∆ f 1avg - - +0.
4. Peripheral Schematics Note: To ensure the power supply to the ESP32 chip during power-up, it is advised to add an RC delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩ and C = 0.1 µF. However, specific parameters should be adjusted based on the power-up timing of the module and the power-up and reset sequence timing of the chip. For ESP32’s power-up and reset sequence timing diagram, please refer to Section Power Scheme in ESP32 User Manual.
5. Physical Dimensions and PCB Layout 5. Physical Dimensions and PCB Layout 5.1 Physical Dimensions ESP32-PICO-V3-ZERO Module Dimensions Unit: mm 0.8±0.1 23±0.15 16±0.15 13.8 14 2.3±0.
5. Physical Dimensions and PCB Layout 5.2 PCB Layout 5.2.1 Recommended PCB Land Pattern Unit: mm : Pad 16 Antenna Area 0.6 16 5 1.2 0.6 5 12.4 11.6 10.8 15.4 13.8 23 1.2 10.8 11.6 12.4 13.8 15.4 Figure 5: Recommended PCB Land Pattern 5.2.2 PCB Layout Guide To achieve the optimum RF performance on a device with on-board antenna, please follow the guidelines below.
6. Product Handling 6. Product Handling 6.1 Storage Condition The products sealed in Moisture Barrier Bag (MBB) should be stored in a noncondensing atmospheric environment of < 40 °C/90%RH. The module is rated at moisture sensitivity level (MSL) 3. After unpacking, the module must be soldered within 168 hours with factory conditions 25±5 °C/60%RH. The module needs to be baked if the above conditions are not met. 6.
7. MAC Addresses and eFuse 7. MAC Addresses and eFuse The eFuse in ESP32 has been burnt into 48-bit mac_address.
8. Learning Resources 8. Learning Resources 8.1 Must-Read Documents The following link provides documents related to ESP32. • ESP32 User Manual This document provides an introduction to the specifications of the ESP32 hardware, including overview, pin definitions, functional description, peripheral interface, electrical characteristics, etc. • ESP32 ECO V3 User Guide This document describes differences between V3 and previous ESP32 silicon wafer revisions.
11. Learning Resources • ESP32 Tools This is a webpage where users can download ESP32 Flash Download Tools and the zip file ”ESP32 Certification and Test”. • ESP-IDF This webpage links users to the official IoT development framework for ESP32. • ESP32 Resources This webpage provides the links to all available ESP32 documents, SDK and tools.
Revision History Revision History Date Version Release notes 2020-04-08 V1.0 First release. OEM Guidance 1. Applicable FCC rules This module is granted by Single Modular Approval. It complies to the requirements of FCC part 15C, section 15.247 rules. 2. The specific operational use conditions This module can be used in IoT devices. The input voltage to the module is nominally 3.0V-3.6 V DC. The operational ambient temperature of the module is –40 °C ~ 85 °C. Only the embedded PCB antenna is allowed.
6. Antenna Antenna type: PCB antenna Peak gain: 3dBi 7. Label and compliance information An exterior label on OEM’s end product can use wording such as the following: “Contains Transmitter Module FCC ID: 2AC7Z-ESP32PICOZERO” or “Contains FCC ID: 2AC7Z-ESP32PICOZERO” 8.
