The following section describes the system architecture of Inter-Processor Communication on a WWAN M.2 module when connected to a Microsoft Windows® based Host OS Windows® 7, Windows® 8.x. The software components of a WWAN M.2 module running Windows® 7 and Windows® 8 are depicted in Figure 12 and Figure 13 respectively. In the Windows® 7 architecture: The Windows® 7 driver interfaces with the WWAN M.
Figure 12 Windows 7 Software Architecture
Figure 13 Windows 8 Software Architecture
In order to support both Windows® 8 and Windows® 7 (for corporate legacy applications), with a single modem architecture, IMC will provide a kernel level driver implementing the Mobile Broadband Interface Model. The driver is WHQL certified for Windows® 7.
The following section describes the system architecture of Inter-Processor Communication on a M.2 module when connected to a Linux based Host OS (Android, Chrome, and Ubuntu).
logical channels. Each logical channel corresponds to a dedicated Packet Data Network (PDN) connection. There is no TCP/IP stack on the modem side in the data path from IPC over PBM to C-PS handling IP address based routing. The central packet buffer manager (PBM) provides a common packet buffer used between IPC and PS. No copy operation of data is necessary between cellular PS and IPC.
The USB 2.0 HS stack is used for communication with a PC in device role. Additional details on the USB interface can be found in Section 3.1, Interprocessor Interface. The USB feature may be configured by the UTA_USB API. The user may define different use cases, such as support of different numbers of CDC-ACM or CDC-NCM channels.
1st - 4th NCM channel: data channel for PDN connection: Channel ID: USBHS/NCM/0-3 The host computer can set the modem into USB sleep (L1) state (to save battery power) whenever the link is idle. To return from sleep state the host computer performs L1Resume. This can also be triggered by the modem using L1-Remote- Wake-up. The sleep (L1) state is introduced by “USB 2.
Figure 15 Android Software Architecture A preliminary view of the software components of a WWAN M.2 module running the Chrome operating system is shown in Figure 16. The architecture is still in development; however, it is expected that: Intel Intrinsic Radio Interface Layer (RIL) will be used and supported via a USB CDC-MBIM driver. All Intel features will be supported via MBIM commands.
Table 24 Operating Environment Item Description Form Factor Operating Temperature Card Type 3042 The module full operating temperature in compliance with 3GPP specification shall be -10 °C to +55 °C – Normal +55 °C to +70 °C – Extreme Extreme is the surrounding air temperature of the module inside the platform when the card is fully operating at worst case condition.
The M.2 modules utilize a single regulated power rail of 3.3 V provided by the host platform. There is no other VDDIO like pin and the M.2 module is responsible for generating its own I/O voltage source using the 3.3 V power rail. This 3.
Table 27 DC Specification for 3.3V Logic Signaling Symbol Parameter Condition Min Max Unit +3.3V Supply Voltage - 3.135 3.465 V VIH VIL Input High Voltage Input Low Voltage - 2.0 -0.5 3.6 0.8 V V IOL Output Low Current for Open-drain Signals Not applicable to LED# and DAS/DSS# pins Output Low Current for Open-drain Signals Applies to the LED# pins 0.4 V 4 - mA 0.
This section lists the power consumption targets. Typical target values at Vsys = 3.3 V Table 29 LTE Power Consumption M.2 Power Consumption (*) Transmit Power LTE Use Case Band 10 dBm 23 dBm LTE UTP, Cat. 3, 20 MHz, 100 RB - (APAC SKU only) LTE UTP, Cat. 3, 20 MHz, 100 RB - (APAC SKU only) LTE UTP, Cat. 3, 10 MHz, 50 RB - (APAC SKU only) LTE UTP, Cat. 3, 20 MHz, 100 RB - (APAC SKU only) LTE UTP, Cat.
UMTS FTP, Cat 14, QAM64 Band 1 771 mW Band 1 813 mW - 6 mW (M.2 DC-HSDPA+) UMTS FTP, Cat 14, QAM64 (M.2 HSDPA+) Standby Power UMTS Stand-by current, DRX7, 16NB cells UMTS Stand-by current, DRX7, 16NB cells (HN930) - 6.
The M.2 Data Card has shielding and noise filtering in place to ensure that the WWAN module does not impact the operation of the host system. The M.2 Data Card must also be able to tolerate platform noise caused by high order clock harmonics from the host processor and associated support circuitry.
The M.2 Data Card includes a digital thermal sensor in order to monitor the temperature of the WWAN Card. The firmware will support the extraction of temperature information from the module and the configuration of auxiliary trip points.
Table 34 Conducted Transmit Power – LTE HDPA+ / LTE LN930 Parameter Condition Requirement Conducted Transmit Power1 E-UTRA class 3 23 dBm + 0.5/- 1 db Condition Requirement E_UTRA class 3 22.5 dBm + 0.5 /- 1 db LN930-AP (APAC SKU only) Parameter 1 Conducted Transmit Power 2 Conducted transmit power as measured at the WWAN M.2 RF main antenna connector.
Table 36 Rx Sensitivity - UMTS HDPA+ / LTE LN930 Band Condition Min Rx Sensitivity Limit (dBm) 1 BER<0.1% -107 2 BER<0.1% -106 4 BER<0.1% -107 5 BER<0.1% -107 8 BER<0.1% -107 LN930-AP (APAC SKU only) Band Condition Min Rx Sensitivity Limit (dBm) 1 BER<0.1% -106 6 BER<0.1% -106 8 BER<0.1% -103 11 BER<0.1% -106 19 BER<0.1% -106 GSM not supported for LN930-AP Main and Diversity ports are measured separately.
LN930-AP (APAC SKU only) EARFCN LTE Band Duplex Modulation Bandwidth (Hz) Min Rx Sensitivit y Limit (dBm) Low Channel Middle Channel High Channel 1 3 8 9 11 18 19 21 26 FDD FDD FDD FDD FDD FDD FDD FDD FDD QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK 10 10 10 10 10 10 10 10 10 -96 -96 -96 -96 -96 -97 -97 -96 -97 50 1250 3525 3850 4800 5900 6050 6500 8740 320 1678 3625 3975 4850 5925 6075 6525 8865 550 1900 3750 4099 4899 5950 61
The following tables provide antenna guidance for the platform designer.
RF Band Center Frequency 018 XVIII (18) 019 XIX (19) 020 XX (20) 850 MHz 850 MHz 800 MHz 021 XXI (21) 025 XXV (25) 026 XXVI (26) 027 XXVII (27) 028 XXVIII (28) GPS GLONASS Uplink (UL) UE Tx 815 MHz to 830 MHz 830 MHz to 845 MHz 832 MHz to 862 MHz Downlink (DL) UE Rx 860 MHz to 875 MHz 875 MHz to 890 MHz 791 MHz to 821 MHz 1495.9 MHz to 1510.9 MHz 1500 MHz 1447.9 MHz to 1462.
M.2 module complies with the following listed test standards: 3GPP TS 31.121 USIM 3GPP TS 31.124USAT 3GPP TS51.010-1, 2G PS & RF & RRM 3GPP TS 51.010-4 2G SIMTK 3GPP TS34.121-1 3G RF & RRM 3GPP TS34.123-1 3G PS 3DPP TS36.124 LTE Radiated Emission 3GPP TS36.521-1 LTE RF 3GPP TS 36.521-3 LTE RRM 3GPP TS36.523-1 LTE PS ETSI TS 102 230 UICC OMA ETS SUPL v1.0 LBS SUPL OMA ETS SUPL v2.
The mechanical dimensions of WWAN Card Type 3042 are shown in Figure 17 and Figure 17. The WWAN card is 30 mm x 42 mm. The height is 1.5 mm from the top of the PCB to the top of the outside shield. There are a total of 75 pins; however 8 pins are lost to support the slot+. All components are mounted on the Top side.
Figure 18 WWAN Card 3042 Slot Key Details
Figure 19 illustrates a typical land pattern for a top-mount connector with the key removed.
Figure 20 illustrates a typical mid-plane (in-line) land pattern with slot key removed.
Figure 21 illustrates the locations for the main Rx/Tx antenna and the Diversity/GPS antenna. Figure 21 Antenna Connector Location Table 41 Antenna Interface 0 TBD 1 Diversity/ GPS 2 TBD 3 TBD 4 WWAN Main Tx/Rx 5 TBD Antenna Connector Assignment For M.2 Modules positions 1 and 4 are used. The other antenna connectors are not mounted on the module.
READ CAREFULLY Be sure the use of this product is allowed in the country and in the environment required. The use of this product may be dangerous and has to be avoided in the following areas: Where it can interfere with other electronic devices in environments such as hospitals, airports, aircrafts, etc. Where there is risk of explosion such as gasoline stations, oil refineries, etc.
The following chapters are related to the M.2 module on the EVK carrier board. The LN930 products portfolio has been evaluated against the essential requirements of the 1999/5/EC Directive. Bulgarian Czech Danish Dutch English Estonian German Greek Telit Communications S.p.A. , 2G/3G module 1999/5/ Telit Communications S.p.A. tímto prohlašuje, že tento 2G/3G module .
Norwegian Telit Communications S.p.A. erklærer herved at utstyret 2G/3G module er i samsvar med de grunnleggende krav og øvrige relevante krav i direktiv 1999/5/EF. Polish 2G/3G module jest zgodny z iami Dyrektywy 1999/5/EC Portuguese Telit Communications S.p.A. declara que este 2G/3G module está conforme com os requisitos essenciais e outras disposições da Directiva 1999/5/CE. Slovak Telit Communications S.p.A.
The conformity assessment procedure referred to in Article 10 and detailed in Annex IV of Directive 1999/5/EC has been followed with the involvement of the following Notified Body: Thus, the following marking is included in the product: The full declaration of conformity can be found on the following address: http://www.telit.com/ There is no restriction for the commercialization in all the countries of the European Union.
In all cases assessment of the final product must be met against the Essential requirements of the R&TTE Directive Articles 3.1(a) and (b), safety and EMC respectively, as well as any relevant Article 3.3 requirements. 1. The Dipole antenna (gain: GPRS/EGPRS/WCDMA/LTE: 2dBi) was verified in the conformity testing, and for compliance the antenna shall not be modified.
Telit has not approved any changes or modifications to this device by the user. Any changes or modifications could void the user’s authority to operate the equipment. Telit n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en soit la nature. Tout changement ou modification peuvent annuler le droit d’utilisation de l’appareil par l’utilisateur.
and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.
Revision 0 1 Date 2013-05-20 2013-07-09 2 3 2013-07-29 2013-08-26 4 5 2013-09-09 2013-09-15 6 2013-11-20 7 2014-04-10 Changes First issue • Update setting for Pin 21 on the host interface. This signal is not connected. • Updated pin names of pins 1, 21, 69, and 75 in Table 4 and Table 19 to simply reflect HW Configuration use. • Updated Table 24 to indicate configuration pins 1, 69, and 75 are tied to GND.
8 2014-06-24 9 2014-11-18 10 2014-12-21 Correction in Section 11.3, fixed typo in sentence: For WWAN M.2 Modules, only positions 1 and 4 are used. Updated table to only indicate minimum RX sensitivity limit. Updated Section Conducted Transmit Power section.
Added new table, Table 39.