User's Manual Part 1

ManualsBrandsELITEGROUP COMPUTER SYSTEMS ManualsElectronicsDATA CARD





Summary of content (50 pages)

PAGE 1
 
PAGE 2
         
PAGE 3
  SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Notice While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be entirely reliable. However, no responsibility is assumed for inaccuracies or omissions.
PAGE 4
  Usage and Disclosure Restrictions License Agreements The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement. Copyrighted Materials Software and documentation are copyrighted materials. Making unauthorized copies is prohibited by law.
PAGE 5
  Contents         
PAGE 6
         
PAGE 7
          
PAGE 8
         
PAGE 9
   Figure 1 M.2 HSPA+ Block Diagram................................................................................................................ 18 Figure 2 M.2 APAC LTE Module Block Diagram............................................................................................ 19 Figure 3 M.2 LTE Module Block Diagram........................................................................................................
PAGE 10
   Table 1 M.2 Module - General Feature.............................................................................................................. 14 Table 2. M.2 Module - RF Band Support ......................................................................................................... 15 Table 3. M.2 Module - Data Services ..............................................................................................................
PAGE 11
    This document is a technical specification for Telit’s next generation form factor M.2 module family. The next generation form factor M.2 module family is a natural transition from the PCI Express Mini Card and Half Mini Card to a smaller form factor size. The M.2 Card Type 3042 offers single sided component mounting, 75 pins (8 dedicated for key), in a compact size (30 mm x 42 mm). A range of 2G/3G/4G (LTE) M.
PAGE 12
  http://www.telit.com To register for product news and announcements or for product questions contact Telit Technical Support Center (TTSC). Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements. Telit appreciates feedback from the users of our information.
PAGE 13
    This section will provide an overview of the standard features of a M.2 Card, information on the various SKUs of 2G/3G/4G (LTE) M.2 modules along with a respective functional block diagram of each SKU.   There are five different M.2 modules available in the M.
PAGE 14
  Table 1 M.2 Module - General Feature Mechanical M.2 Card Type 3042 Slot B 30 mm x 42 mm Pin count: 75 (67 usable, 8 slot) Operating Voltage 3.3 V +/- 5% Operating Temperature - x x x x x x x x x x x x x x x – Normal – Extended Application Interface (75 pin card) M.
PAGE 15
  Table 2. M.2 Module - RF Band Support M.2 Module 2110 MHz 2170 MHz 002 II 1850 MHz 1910 MHz 1930 MHz 1990 MHz x 1710 MHz 1785 MHz 1805 MHz 1880 MHz x 1710 MHz 1755 MHz 2110 MHz 2155 MHz 824 MHz 849 MHz 869 MHz 894 MHz 830 MHz 840 MHz 875 MHz 885 MHz 2500 MHz 2570 MHz 2620 MHz 2690 MHz 880 MHz 915 MHz 925 MHz 960 MHz 1749.9 MHz 1784.9 MHz 1844.9 MHz 1879.9 MHz 010 X 1710 MHz 1770 MHz 2110 MHz 2170 MHz 011 XI 1427.
PAGE 16
  013 XIII 777 MHz 787 MHz 746 MHz 756 MHz 014 XIV 788 MHz 798 MHz 758 MHz 768 MHz 017 XVII 704 MHz 716 MHz 7734 MHz 746 MHz 815 MHz -830 MHz 860 MHz -875 MHz 830 MHz 845 MHz 875 MHz 890 MHz 832 MHz 862 MHz 791 MHz 821 MHz 1447.9 MHz 1462.9 MHz 1495.9 MHz 1510.9 MHz 022 XXII 3410 MHz 3490 MHz 3510 MHz 3590 MHz 023 XXIII 2000 MHz 2020 MHz 2180 MHz 2200 MHz 024 XXIV 1626.5 MHz 1660.
PAGE 17
  029 XXIX 1850 MHz 1910 MHz or 1710 MHz 1755 MHz 716 MHz 728 MHz 001 I 1920 MHz 1980 MHz 2110 MHz 2170 MHz Table 3. M.2 Module - Data Services LN930 LN930-AP M.2 module HN930 Data Service GPRS Class 33: DL 85.6 kbps, UL 85.6 kbps x - x EDGE Class 33: DL 236.8 kbps, UL 236.8 kbps x - x WCDMA: DL 384 kbps, UL 384 kbps HSPA+: DL 21 Mbps, UL 5.7 Mbps HSPA+: DL 42 Mbps, UL 5.
PAGE 18
  Figure 1 M.
PAGE 19
    The M.2 APAC LTE module is another Intel design based on the XMM™7160 modem platform. The module has a targeted area of operation in the Asia Pacific rim and offers 3G and LTE datacard functionality, 2G Functionality is not supported. The M.2 APC LTE module includes support at the 75 pin application interface for M.2 Control, USB 2.0 HS, GNSS, USIM and Antenna Tuning. A block diagram of the M.
PAGE 20
    The M.2 LTE module is based on Intel’s XMM™7160 modem platform. The M.2 LTE module is a triple-mode (2G, 3G, and 4G) 3GPP release 9 modem providing datacard functionality. The M.2 LTE module includes support at the 75 pin application interface for M.2 Control, USB 2.0 HS, GNSS, USIM and Antenna Tuning. A block diagram of the M.2 LTE module is shown in Figure 3. Figure 3 M.
PAGE 21
  TM SMARTi 4G PMB5740 Diversity Receiver RD_H1 RD_H1X RD_H3 RD_H3X VBAT RD_M1 RD_M1X RD_M2 RD_M2X SD2_1V8 RD_L1 RD_L1X RD_L2 RD_L2X RD_L4 RD_L4X RD_L3 RD_L3X Diversity Switch & Filter Module B7 Div Filter VBAT B7 B1/B4 Diversity Antenna B2/B25 B3 B5/B26 B13/B17 B8 RFE_RFFE_VIO RFE_RFFE_SDATA B20 RFE_RFFE_SCLK B20 Div Filter REF OSC AFC_DAC Combined Receiver Main Switch & Duplexer Module XO_SUP XO RX_H2 RX_H2X B7 RX_H3 RX_H3X
PAGE 22
  Figure 5 PCI Express M.2 Module Interface A complete description of all interface signals available at the host interface is listed in Table 4. Some features, such as GNSS and Antenna Tuning, are not available on every M.2 module. On those modules, the signals at the application interface are not connected on the M.2 module. Table 4 M.
PAGE 23
  10 LED#1 O 11 GND P Open Drain, active low signal used for add-in card to provide status Ground 12 SLOT KEY 13 SLOT KEY 14 SLOT KEY 15 SLOT KEY 16 SLOT KEY 17 SLOT KEY 18 SLOT KEY 19 SLOT KEY 3.3 V - 20 AUDIO0 IO PCM Clock (I2S_CLK) 1.8 V 21 CONFIG_0 O Configuration Status. Presently not connected on WWAN M.2 module. - 22 AUDIO1 I PCM In (I2S_RX) 1.8 V 23 WAKE_WWAN# O Wake On WWAN Use by M.
PAGE 24
  41 N/C - Not connected internally on M.2 I2C Data – GNSS Support 42 I2C_SDA IO 43 N/C - 44 I2C_IRQ I 45 GND P 46 SYSCLK O 26 MHz reference Clock output for external GNSS module 1.8 V 47 N/C - - 48 TX_BLANKING O 49 N/C - 50 N/C - 51 GND P Not connected internally on M.2 GNSS Blanking Signal used to indicate 2G Tx burst and LTE band 13 Tx burst. Not connected internally on M.2 Not connected internally on M.
PAGE 25
  69 CONFIG_1 O Configuration Status - WWAN M.2 Connects to GND internally 70 3.3V P WWAN Supply Pin 3.3 V - 71 GND P Ground - 72 3.3V P WWAN Supply Pin 3.3 V - 73 GND P Ground - 74 3.3V P WWAN Supply Pin 3.3 V - 75 CONFIG_2 O Configuration Status - WWAN M.
PAGE 26
    This section provides details on the various interfaces available M.2 modules.   There are two interfaces on the M.2 host interface that support interprocessor communications (ICP); however, for the WWAN M.2 modules covered by the Product Description only the USB 2.0 High-speed port will be supported.
PAGE 27
  Table 5 USB HS Interprocessor Communications Interface Signal Name Description Pin USB_D+ USB Data Plus 7 Direction (WWAN) I, O USB_D– USB Data Minus 9 I, O Voltage Level Per USB 2.
PAGE 28
    The USB Super-speed IC (USB SSIC) solution is not supported by the WWAN M.2 modules presented in this Product Description. It is set aside for future development. These signals should be left un-connected on the host.
PAGE 29
    The USIM interface is compatible with the ISO 7816-3 IC Card standard on the issues required by the GSM 11.12 and GSM 11.18 standard. Both 1.8 V and 3 V SIM Cards are supported. A few comments on the SIM_DETECT signal 1. An external pull-up resistor is connected to SIM_DETECT on the WWAN M.2 module. 2. When a SIM is inserted, SIM_DETECT will be high. 3. When a SIM is removed or not present, SIM_DETECT will be low. 4.
PAGE 30
  o The pull-up current cannot be increased to speed up rise time, because the pull-up current must not exceed 1 mA including any crosstalk. o Pull-up current is defined by the 4.7 k pull-up resistor (to USIM_PWR) on the WWAN M.2 module, plus 200 µA from the baseband chip is approximately 0.8 mA. Place a decoupling capacitor close to the SIM card socket.   Some M.
PAGE 31
  Figure 6 GNSS Connections and Interface A description of the signals between the X-GOLD™ baseband and the CG1960 interface are defined in Table 8.
PAGE 32
  Table 8 X-GOLD™ Baseband to GNSS Interface Signals Signal VBAT 1.8V UART Description Battery Supply 1.8 V Supply provided from X-GOLD™ Baseband The data and control I/F between the X-GOLD™ baseband and the GNSS device is over a 4 wire UART interface which include CTS/RTS handshaking.
PAGE 33
    The host processor has two signals that can be used to power on and reset the modem. Powering off the modem is accomplished through an AT command. Table 10 Power-on & Reset Signals Signal Name Description FULL_CARD_POWER_ON_OFF Modem power on: For Tablet based designs only; this signal is used for power on-off control of X-GOLD™ Baseband IC.WWAN M.2 module Logic Low: M.2 Off Logic High: WWAN M.
PAGE 34
  Signal W_DISABLE# is provided to allow users to disable, via a system-provided switch, the add-in card’s radio operation in order to meet public safety regulations or when otherwise desired. Implementation of this signal is required for systems and all add—in cards that implement radio frequency capabilities. The W_DISABLE1 signal is an active low signal that when driven low by the system shall disable radio operation.
PAGE 35
  Table 12 Host Radio Disable Interface (W_DISABLE#) Requirement Radio disable duration Detailed Description On reception of a HW or SW disable signal, the WWAN module will initiate within one second the mandatory cellular procedures (which are dependent on current state) for disconnecting from the cellular network.
PAGE 36
  Table 13 LED#1 Signal Signal Name Detailed Description Pin LED#1 LED Status Indicator 10 Direction (WWAN) O (OD) Voltage Level 3.3 V Figure 7 is an example of how an LED indicator is typically connected in a platform/system using 3.3 V. The series resistor can be adjusted to obtain the desired brightness. Figure 7 Typical LED Connection The indication protocol for the LED is shown in Table 14.
PAGE 37
  Table 15 Wake on WWAN Signal Signal Name Detailed Description Pin WAKE_WWAN# Used by M.2 module to wake the host. Active Low, Open Drain output 23 Direction (WWAN) O (OD) Voltage Level 3.0 V   With the arrival of Tablets and Ultrabook™ platforms where the antenna is in the base of the unit, there is a significant issue passing Specific Absorption rate (SAR) requirements for certification. The WWAN M.
PAGE 38
  Table 16 DPR#/ SAR Support Signal Signal Name Detailed Description Pin DPR# Dynamic Power reduction. 25 Direction (WWAN) I   Voltage Level 1.
PAGE 39
    In notebook platforms, since the WWAN antennas are usually located on the top of the lid, there is a long RF mini-coax cable that can be up to 60 cm long between the antenna and WWAN module, it is preferred to use switches/tunable components directly on the antenna for antenna band switching/tuning to improve efficiency. On select WWAN M.
PAGE 40
    As more and more radios are added to PC Ultrabook™ and tablet platforms, the sources RF interference increases significantly as multiple radios will have overlapping transmissions and receptions. This problem will increase further as overlapping bands continue to be rolled out; WIFI, BT, WWAN will all use overlapping band from 2300 MHz to 2600 MHz.
PAGE 41
  NRT mechanisms are not sufficient to guarantee seamless co-running of LTE and connectivity systems (WLAN, BT, and GNSS). Inter-system Synchronization For the cases where co-running of LTE and connectivity systems cannot be achieved, a Real Time (RT) coexistence controller is implemented in the LTE Layer-1 subsystem. The RT coexistence controller is in control of the RT coexistence interface, which is exposed to the connectivity chip.
PAGE 42
  COEX1 IDC_LteFrameSync - Synchronous signal indicating LTE frame start. Indicates LTE frame start to BT/WLAN device. Can be used by BT to synch up periodic activity with LTE timing 64 O 1.8 V   The M.2 modules require the host to provide the 3.3 V power source. The voltage source is expected to be available during the system’s stand-by/suspend state to support wake event processing on the communications card.
PAGE 43
    There are 4 configuration pins on the M.2 module to assist the host identifying the presence of an Add-In card in the socket. On the M.2 module, pins CONFIG_0..3 are configured as shown in Table 20. All configuration pins can be read and decoded by the host platform to recognize the indicated module configuration and host interface supported. On the host side, each of the CONFIG_0..
PAGE 44
  AUDIO2 PCM Out (I2S_ TX) 24 O 1.8 V AUDIO3 PCM Sync (I2S_WA0) 28 IO 1.
PAGE 45
    The M.2 has several No Connect pins. The pins are not connected on the M.2 module. Table 22 No Connect Pins Pins Description 38, 41, 43, 47, 49, 50, 52, 53, 54, 55, 56, 58, 68 No Connect Pins 12, 13, 14, 15, 16, 17, 18, 19 Slot key   The M.
PAGE 46
  Figure 10 RF Antenna – Coaxial Connector Location   
PAGE 47
    Intel Mobile Communications provides a carrier development board to facilitate system test and verification of the M.2 module. In addition, a set of comprehensive tools to enable rapid integration and customization of the M.2 software is provided. The hardware and software tools for M.2 development are summarized below.   The M.
PAGE 48
  Figure 11 M.2 Carrier Board   Intel Mobile Communications provides a utility program called FlashTool for downloading a binary image into the Flash memory of the M.2 module. The USB-HS port or USIF on the platform is used for connection to a PC via a USB cable for flashing. FlashTool is a Win32/64 application built on top of the dynamic link library, Download.DLL.
PAGE 49
  PhoneTool is a development tool built on top of the so-called “production test dll, DWDIO.dll”. PhoneTool can be used to fine tune the parameters of: Audio configuration and settings (if enabled on M.2 module) NV (Non-Volatile) memory RF power ramp Security data IMEI SIM Real Time Clock It also includes interfaces for: AT Terminal for sending and receiving AT commands. DWDIO interface for manual access to the production test dll DWDIO.dll.
PAGE 50
  Proven Single-Ended BER for faster BER < 4 sec/per channel for 3G fast verification (BER, RSSI, TX, ILPC) Tester supported: R&S CMU200, CMW500, and Agilent 8960   M.2 modules are marketed for use on Tablet, Ultrabook, and Laptop devices. OEM vendors routinely offer multiple hardware configurations for the same base model, with different processor speed, drive type, or display type, etc.