Specifications

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E-mail：sales@eardatek.com Earda Technologies Co.,Ltd

EDK-Q4-YFB-036 A/0

EWN-8852BER3BB-HF

S P E C I F I CAT I O N V 1 . 0

IEEE 802.11ax/ac/a/b/g/n 2T2R WLAN with PCIE Interface

+ Bluetooth 5 with HS-UART Interface Module

Wi-Fi Module

Summary of content (24 pages)

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Wi-Fi Module EWN-8852BER3BB-HF S PECIF ICAT I ON V1 . 0 IEEE 802.11ax/ac/a/b/g/n 2T2R WLAN with PCIE Interface + Bluetooth 5 with HS-UART Interface Module E-mail：sales@eardatek.com EDK-Q4-YFB-036 A/0 Earda Technologies Co.
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Module：EWN-8852BER3BB-HF Contents 1 General Specifications ------------------------------------------------- - 3 - 2 Features --------------------------------------------------------------- - 3 2.1 WLAN -------------------------------------------------------------------- - 3 - 2.
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Module：EWN-8852BER3BB-HF 1 General Specifications The module provides a complete solution for a high-performance integrated wireless and Bluetooth device. It supports 2-stream 802.11ax solutions with Multi-user MIMO (Multiple- Input, Multiple-Output) with Wire LAN (WLAN) PCI Express network interface controller with Bluetooth 5 HS-UART interface controller. The module complies with IEEE 802.11 ax/ac/b/g/n/ 2T2R MIMO standard, and Provides up to 1201Mbps for IEEE802.11ax MIMO OFDM. 2 Features 2.
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Module：EWN-8852BER3BB-HF  Support S3/S4 AES/TKIP group key update  FTM support distance measurement  Support Network List Offload  Supports TCP/UDP/IP checksum offload  DSSS with DBPSK and DQPSK, CCK modulation with long and short preamble  OFDM with BPSK, QPSK, 16QAM, 64QAM and 256 QAM modulation. Convolutional Coding Rate: 1/2, 2/3, 3/4 and 5/6 2.2 Bluetooth  Complies with HS-UART with configurable baud rate for Bluetooth  Supports Bluetooth 5 Systems (BT 5.
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Module：EWN-8852BER3BB-HF 4 PHY Specification 4.1 Wi-Fi Specification Table 1 EWN-8852BER3BB-HF Wi-Fi RF Parameters Protocol IEEE 802.11b/g/n/a/ac/ax Interface PCIE1.1 Modulation BPSK/QPSK/16QAM/64QAM/256QAM/1024QAM/DBPSK/DQPSK/CCK 2.4GHz band CH1~CH14/2400 -2483.5MHz 5GHz Band CH36~CH48/5150-5250MHz CH52~CH64/5250-5350MHz Frequency CH100~CH140/5470-5725MHz CH149~CH165/5725-5850MHz 2.4G&5G Band Refer to Channel Plan Domain Code Bandwidth 20/40/80 MHz Maximum PHY data rate up to 286.
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Module：EWN-8852BER3BB-HF 5G Transmit Power 802.11n (2.4G HT20 MCS7): ≤-30dB 802.11n (2.4G HT40 MCS7): ≤-30dB 802.11ax (2.4G HE20 MCS11): ≤-36dB 802.11ax (2.4G HE40 MCS11): ≤-36dB 802.11a(5G 54Mbps): 16±2dBm 802.11n (5G HT20 MCS7): 15±2dBm 802.11n (5G HT40 MCS7): 15±2dBm 802.11ac (5G VHT20 MCS8): 14±2dBm 802.11ac (5G VHT40 MCS9): 13±2dBm 802.11ac (5G VHT80 MCS9): 13±2dBm 802.11ax (5G HE20 MCS10): 13±2dBm 802.11ax (5G HE20 MCS11): 13±2dBm 802.11ax (5G HE40 MCS10): 13±2dBm 802.
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Module：EWN-8852BER3BB-HF 5G Receive Sensitivity @ PER<10% 802.11g (2.4G 24Mbps): -79dBm (Max.) -86dBm (Typ.) 802.11g (2.4G 54Mbps): -70dBm (Max.) -77dBm (Typ.) 802.11n (2.4G HT20 MCS0): -87dBm (Max.) -94dBm (Typ.) 802.11n (2.4G HT20 MCS4): -75dBm (Max.) -81dBm (Typ.) 802.11n (2.4G HT20 MCS7): -69dBm (Max.) -74dBm (Typ.) 802.11n (2.4G HT40 MCS0): -84dBm (Max.) -91dBm (Typ.) 802.11n (2.4G HT40 MCS4): -72dBm (Max.) -76dBm (Typ.) 802.11n (2.4G HT40 MCS7): -66dBm (Max.) -71dBm (Typ.
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Module：EWN-8852BER3BB-HF 802.11ax (5G HE40 MCS11): -53dBm (Max.) -55dBm (Typ.) 802.11ax (5G HE80 MCS10): -53dBm (Max.) -55dBm (Typ.) 802.11ax (5G HE80 MCS11): -51dBm (Max.) -53dBm (Typ.) 4.2 BT Specification Table 2 EWN-8852BER3BB-HF Bluetooth RF Parameters Protocol BTv2.1+EDR/BTv3.0/BTv3.0+HS/BT v4.2/BT v5.0 Interface UART Frequency Modulation 2400 MHz ~ 2483.
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Module：EWN-8852BER3BB-HF 5 Other Specifications Table 3 Other Specification Ambient Operating Temperature 0℃~+70℃ Module: -20℃~+125℃ Storage Temperature Package: -20℃~+70℃ Operating Humidity RH 95%(Non-Condensing) Storage Humidity RH 95%(Non-Condensing) Humidity level Level 3 Security WEP 64/128bit,WPA,WPA2,WPA3,TKIP,AES Other characteristics: QoS-WMM, WMM-PS Operation System Linux/Android/Win ESD(IEC61000-4-2) ≥±800V(Contact) @ RF Port 6 DC Characteristics Table 4 Power Supply Characteri
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Module：EWN-8852BER3BB-HF 7 Module configurations Module Dimension (L*W*T)： 15.2±0.2mm*13.2±0.2mm*2.15±0.2mm。 2.15±0.2 FIG2 EWN-8852BER3BB-HF Module Dimension Recommended Footprint : FIG 3 EWN-8852BER3BB-HF Module Dimension Waiting for your suggestion at anytime. - 10 - E-mail：sales@eardatek.
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Module：EWN-8852BER3BB-HF 8 Pin Definition FIG 4 TOP VIEW See table 5 for the module hardware pin definition. Table 5 EWN-8852BER3BB-HF Pin Description Power Pin Definition Description 1 GND Ground - - 2 RF_WL_S1 Wi-Fi Path S1 ANT I/O port - - 3 GND Ground - - 4 GND Ground - - Waiting for your suggestion at anytime. Supply - 11 - Power level E-mail：sales@eardatek.
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Module：EWN-8852BER3BB-HF Power Pin Definition Description 5 GND Ground - - 6 GND Ground - - 7 GND Ground - - 8 GND Ground - - 9 RF_WL_S0 Wi-Fi Path S0 ANT I/O port - - 10 GND Ground - - 11 GND Ground - - 12 PERSTn PCIE reset, active low VDD_3.3V DC 3.3V±0.3V 13 NC No connect - - 14 NC No connect - - 15 WL_DIS_N Shut down the WLAN when is pulled low VDDIO Depend On VDDIO 16 WAKEn VDD_3.3V DC 3.3V±0.
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Module：EWN-8852BER3BB-HF Pin Definition Power Description Power level Supply (100MHz±300ppm) 36 VDD_3.3V 37 CLKREQn 38 BT_DIS_N 39 GND 40 UART_TXD 41 UART_RXD 42 UART_RTS 43 Main power voltage source input Main power DC 3.3V±0.3V VDD_3.3V DC 3.3V±0.
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Module：EWN-8852BER3BB-HF 10 Module Photos FIG 5 TOP VIEW FIG 6 TOP VIEW (Remove shielding Case) FIG 7 BOTTOM VIEW Waiting for your suggestion at anytime. - 14 - E-mail：sales@eardatek.
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Module：EWN-8852BER3BB-HF 11 Package Information Carrier dimension: （Unit : mm） Module PIN1 Direction of feed FIG 8 Carrier size Reel dimension： D=38cm 1400PCS Modules Per Reel FIG 9 Reel Waiting for your suggestion at anytime. FIG 10 Reel figure - 15 - E-mail：sales@eardatek.
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Module：EWN-8852BER3BB-HF 12 Reference design 12.1 Power supply requirement The module power supply voltage is DC+3.3V, and the maximum module current is 2000mA. The power supply design needs to consider the output current and power interference. To avoid the +3.3V power supply from interfering with other circuits on the motherboard, it is recommended to supply to the module using the regulator circuit alone. the recommended DC-DC circuit structure shown in the figure below. A 4.
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Module：EWN-8852BER3BB-HF 12.2 PCIE Interface The PCIE interface has 3 differential pairs. The impedance of HSOP/HSON and HSIP /HSIN is 85ohm, The impedance of RFECLK+/RFECLK- is 100ohm, It must be designed as difference line and Surround the data line with ground copper. 12.3 RF circuit Due to the SMD package, the RF port impedance must be offset after the module is soldered to the motherboard.
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Module：EWN-8852BER3BB-HF distance from RF routing layer to GND of the next layer. There are RF lines Layout principles : 1. RF line layout needs to match 50 ohms. The line width can be calculated by professional software. (Note: If it is a multi-layer board, The board thickness should calculate the distance from the RF trace layer to the next ground layer.) 2. The RF line must be surrounded by ground copper and ground holes. 3.
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Module：EWN-8852BER3BB-HF 12.4 Motherboard interference avoidance Motherboard interference comes from: high-speed data interface (HDMI), the Operating frequency of main chip, DDR, DC-DC power supply. The method of avoiding interference according to the characteristics of various signals is also different. The main methods of interference avoidance include : 1. keeping away from the source of interference; 2. Adding shields to avoid interference leakage; 3. Reasonable layout to eliminate interference. 12.4.
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Module：EWN-8852BER3BB-HF FIG 16 HDIM and USB interference 12.4.2 The main chip interferes with DDR Because the main chips operate at about 800MHz or DDR2 operate at 667MHz, 3x frequency of 800MHz and 4x frequency of 667MHz are near 2.4GHz band. It must to place Wi-Fi modules and antennas far away from the main chip and DDR. It is strongly recommended that the main chip be isolated from the DDR by a shield. As shown in the figure below.
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Module：EWN-8852BER3BB-HF 12.5 Recommended secondary reflux temperature curve The number of reflux shall not exceed 2 times, and the tin feeding height of the half hole of the module shall be no less than 1/4. The lead-free reflux curve requirements of Wi-Fi module products are shown in figure 18： FIG 18 Furnace temperature curve NOTE: 1.The maximum furnace temperature of the module is 260℃, don’t exceed this temperature. 2.The gold plating thickness of the module pad is 2u”.
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Module：EWN-8852BER3BB-HF 13 Revision History Revision Release Date V1.0 2022-06-28 Summary First release Waiting for your suggestion at anytime. Revised By Xiongbiao Liu - 22 - E-mail：sales@eardatek.
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FCC Statement This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) thi s device may not cause harmful interference, and (2) this device must accept any interference received, incl uding interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user’ s authority to operate the equipment.
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Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01 2.2 List of applicable FCC rules CFR 47 FCC PART 15 SUBPART C has been investigated. It is applicable to the modular transmitter 2.3 Specific operational use conditions This module is stand-alone modular.