BT Mesh Soc Module 825X-LA Series Datasheet V1.0 BT Mesh Soc Module E-mail：sales@eardatek.com EDK-Q4-YFB-036 A/0 Earda Technologies Co.
Module：825X-LA Series Contents 1 General Specifications---------------------------------------------------------- 3 - 2 Features ------------------------------------------------------------------------- 3 - 3 System Block Diagram --------------------------------------------------------- 4 - 4 PHY Specification --------------------------------------------------------------- 4 - 5 Other Specifications ------------------------------------------------------------ 6 - 6 DC Specifications ------------
Module：825X-LA Series 1 General Specifications 825X-LA Series is Bluetooth LE Soc solution with internal flash. It combines the radio frequency, digital processing, protocols stack software, profiles for Bluetooth Low Energy (up to Bluetooth 5) and Genie Mesh into a single Soc.
Module：825X-LA Series 3 System Block Diagram Fig 1 825X-LA Series System Block Diagram 4 PHY Specification Table 1 825X-LA Series Bluetooth RF Parameters Protocol BT5.0 Interface UART Frequency 2402 MHz ~ 2480MHz Data rate BLE 1Mbps,±250KHz deviation Waiting for your suggestion at anytime. - 4- E-mail：sales@eardatek.
Module：825X-LA Series Table 2 RX Performance Item Sym. Min. Typ. Max.
Module：825X-LA Series 5 Other Specifications Table 4 other Specifications Operating Temperature -40~85℃ (EWN-8250FET1LA/ EWN-8258FET1LA) -40~105℃ (EWN-8250FGT1LA /EWN-8258FAT1LA) Module: -40~85℃ (EWN-8250FET1LA/ EWN-8258FET1LA) Storage Temperature -40~105℃ (EWN-8250FGT1LA /EWN-8258FAT1LA) Package: -20℃~+70℃ Operating Humidity RH 95%(Non-Condensing) Storage Humidity RH 95%(Non-Condensing) Humidity level Level 3 6 DC Specifications Table 5 DC Specifications Item Sym. Min. Typ. Max.
Module：825X-LA Series 7 Module configurations Module (hole - hole) Size (Unit: mm): 14.50(±0.2) *10.0(±0.2)*1.65(±0.2) Module Size (Unit: mm): 14.50(±0.2) *10.15(±0.3)*1.65(±0.2) Fig 2 825X-LA Series Top View Module Size Waiting for your suggestion at anytime. - 7- E-mail：sales@eardatek.
Module：825X-LA Series 8 Pin Definition Fig 3 Top view Table 6 the hardware Pin definition of the module Table 6 825X-LA Series Pin definition PIN Definition IC Pin 1 Ant / BT 2 GND / Module power reference 3 ADC PB1 SAR ADC input /UART_TX / GPIO PB[1] 4 SWS PA7 Single wire slave 5 UART_TX PD7 7816_TRX(UART_TX) / SPI clock (I2C_SCK) / GPIO PD[7] 6 UART_RX PA0 UART_RX /PWM0 inverting output / GPIO PA[0] 7 Int_A PC0 GPIO PC[0]/ I2C serial data / PWM4 inverting output / UART_RTS
Module：825X-LA Series Notes: 1. Download Interface use SWS test point on bottom view. 2. Only SWS interface can be used for debugging firmware. 9 Module Photos Fig 4 Top View Fig 5 Bottom View 10 Key material list Type Crystal Model Table 7 EWN-8250FET1LA Key material list 24MHz 12pF 20ppm Inductance 10uH Footprint QTY. 3225 1PCS 0805 1PCS QFN32 1PCS TLSR8250F512GT32/ IC TLSR8250F512ET32/ TLSR8258F1KET32/ TLSR8258F1KAT32 Waiting for your suggestion at anytime.
Module：825X-LA Series 11Package Information Carrier dimension: （Unit : mm） FIG 6 Carrier size Reel dimension： D=38cm 1900PCS Modules Per Reel FIG 7 Reel Waiting for your suggestion at anytime. FIG 8 Reel figure - 10 - E-mail：sales@eardatek.
Module：825X-LA Series 12Reference design 12.1 Power supply requirement The module power supply voltage is DC+3.3V. The power supply design needs to consider the output current and power interference. The power supply current design needs to reserve 50mA. To avoid the +3.3V power supply from interfering with other circuits on the motherboard, it is recommended to supply to the module using the regulator circuit alone. the recommended DC-DC circuit structure shown in the figure below. A 4.
Module：825X-LA Series 12.2 RF circuit Due to the SMD package, the RF port impedance must be offset after the module is soldered to the motherboard. In order to achieve the best performance, it is recommended to add a PItype matching network to the motherboard, as shown below (C11, R21, C6). The value of the PI type matching network needs to be debugged according to the actual motherboard to match RF port impedance to 50 Ohm.
Module：825X-LA Series 3. The PI-type matching circuit for adjusting the impedance of the module is placed close to the module. The PI type matching circuit for matching the antenna is placed close to the antenna. FIG 12 The PI type matching circuit Layout FIG 13 The RF line Layout Waiting for your suggestion at anytime. - 13 - E-mail：sales@eardatek.
Module：825X-LA Series 12.3 Motherboard interference avoidance Motherboard interference comes from: high-speed data interface (HDMI), the Operating frequency of main chip, DDR, DC-DC power supply. The method of avoiding interference according to the characteristics of various signals is also different. The main methods of interference avoidance include: 1. keeping away from the source of interference; 2. Adding shields to avoid interference leakage; 3. Reasonable layout to eliminate interference. 12.3.
Module：825X-LA Series Fig 14 HDIM and USB interference 12.3.2 The main chip interferes with DDR Because the main chips operate at about 800MHz or DDR2 operate at 667MHz, 3x frequency of 800MHz and 4x frequency of 667MHz are near 2.4GHz band. It must to place BT modules and antennas far away from the main chip and DDR. It is strongly recommended that the main chip be isolated from the DDR by a shield. As shown in the figure below.
Module：825X-LA Series 12.4 Recommended secondary reflux temperature curve T he number of reflux shall not exceed 2 times, and the tin feeding height of the half hole of the module shall be no less than 1/4. The lead-free reflux curve requirements of BT module products are shown in figure 16： Fig 16 Furnace temperature curve Note: 1. The maximum furnace temperature of the module is 260℃, don't exceed this temperature. 2. The gold plating thickness of the module pad is 2u".
Module：825X-LA Series 13WARNING Federal Communication Commission Statement (FCC, U.S.) This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.
Module：825X-LA Series OEM integration instructions: This device is intended only for OEM integrators under the following conditions: The transmitter module may not be co-located with any other transmitter or antenna. The module shall be only used with the external antenna(s) that has been originally tested and certified with this module. As long as the conditions above are met, further transmitter test will not be required.
Module：825X-LA Series Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01 2.2 List of applicable FCC/IC rules FCC Part 15 Subpart C 15.247 & 15.207 & 15.209& RSS GEN&RSS 247 2.3 Specific operational use conditions The module is a BLE module with BLE 2.4G function. Operation Frequency: 2402~2480MHz Number of Channel: 40 Modulation: GFSK Type: Copper tube Antenna Gain: 0 dBi Max. The module can be used for mobile or applications with a maximum 0dBi antenna.
Module：825X-LA Series 2.7 Antennas Antenna Specification are as follows: Type: Copper tube Antenna Gain: 0dBi This device is intended only for host manufacturers under the following conditions: The transmitter module may not be co-located with any other transmitter or antenna; The module shall be only used with the internal antenna(s) that has been originally tested and certified with this module. The antenna must be either permanently attached or employ a ‘unique’ antenna coupler.
Module：825X-LA Series This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canada’s licence-exempt RSS(s). Operation is subject to the following two conditions: (1) This device may not cause interference. (2) This device must accept any interference, including interference that may cause undesired operation of the device.
Module：825X-LA Series 14Revision History Revision Release Date V1.0 2021-8-30 Summary First release Waiting for your suggestion at anytime. Revised by RUAN - 22 - E-mail：sales@eardatek.
