BT Mesh Soc Module EWN-8250FGT1AA EWN-8258FAT1BA Datasheet V1.3 BT Mesh Soc Module E-mail：sales@eardatek.com EDK-Q4-YFB-036 A/0 Earda Technologies Co.
Module：EWN-8250FGT1AA EWN-8258FAT1BA Contents 1 General Specifications -------------------------------------------------------------------------- - 3 - 2 Features ---------------------------------------------------------------------------------------------- - 3 - 3 System Block Diagram ------------------------------------------------------------------------- - 4 - 4 PHY Specification -------------------------------------------------------------------------------- - 4 - 5 Other Specifications------
Module：EWN-8250FGT1AA EWN-8258FAT1BA 1 General Specifications EWN-8250FGT1AA/EWN-8258FAT1BA is Bluetooth LE Soc solution with internal flash. It combines the radio frequency, digital processing, protocols stack software ,profiles for Bluetooth Low Energy(up to Bluetooth 5) and Tmall Genie Mesh into a single Soc.
Module：EWN-8250FGT1AA EWN-8258FAT1BA 3 System Block Diagram Fig 1 System Block Diagram 4 PHY Specification Table 1 Bluetooth RF Parameters Protocol BT5.0 Interface UART Frequency 2380 MHz ~ 2500MHz （Programmable in 1MHz step） Data rate BLE 1Mbps,±250KHz deviation Waiting for your suggestion at anytime. -4- E-mail：sales@eardatek.
Module：EWN-8250FGT1AA EWN-8258FAT1BA Table 2 RX Performance Item Sym. Min. Typ. Max.
Module：EWN-8250FGT1AA EWN-8258FAT1BA 5 Other Specifications Table 4 other Specifications Operating Temperature Storage Temperature -40℃~+105℃ Module: -40℃~+105℃ Package: -20℃~+70℃ Operating Humidity RH 95%(Non-Condensing) Storage Humidity RH 95%(Non-Condensing) Humidity level Level 3 6 DC Specifications Table 5 DC Specifications Item Sym. Min. Typ. Max. Unit Condition VDD_3.3V VBAT 1.8 3.3 3.6 V 3.3V Supply Voltage RX current IRX - 5.3 - mA whole chip TX current ITX - 4.
Module：EWN-8250FGT1AA EWN-8258FAT1BA 7 Module configurations Module Size (Unit: mm): 24.5(±0.3) *15.0(±0.25)*2.4(±0.2) Fig 2 Module Size (Top view) Waiting for your suggestion at anytime. -7- E-mail：sales@eardatek.
Module：EWN-8250FGT1AA EWN-8258FAT1BA 8 Pin Definition Fig 3 Top view Table 6 the hardware Pin definition of the module Table 6 Pin definition PIN Definition IC Pin 1 VBAT / Supply power 1.8V-3.3V； 2 GND / Module power reference 3 PWM0 PC1 Waiting for your suggestion at anytime. Description PWM output for LED drive（Default control cold white light）； -8- E-mail：sales@eardatek.
Module：EWN-8250FGT1AA EWN-8258FAT1BA PIN Definition IC Pin Description General I/O port； PWM output for LED drive（Default control 4 PWM1 warm white light）； PC3 SAR ADC Input； General I/O port； PWM output for LED drive（Default control 5 PWM4 Red light）； PB4 SAR ADC Input； General I/O port； PWM output for LED drive（Default control 6 PWM5 PB5 Green light）； General I/O port； PWM output for LED drive（Default control 7 PWM2 PC4 Blue light）； General I/O port； 8 ADC PB6 9 UART_TX PB1 10
Module：EWN-8250FGT1AA EWN-8258FAT1BA 9 Module Photos FIG 4 Top View FIG 5 Bottom View 10 Key material list Table 7 Key material list Type Model Footprint QTY. Crystal 24MHz 12pF 20ppm 3225 1PCS Inductance 10uH 0805 1PCS QFN32 1PCS QFN32 1PCS IC IC TLSR8250F512GT32 (only for EWN-8250FGT1AA) TLSR8258F1KAT32 (only for EWN-8258FAT1BA) Waiting for your suggestion at anytime. - 10 - E-mail：sales@eardatek.
Module：EWN-8250FGT1AA EWN-8258FAT1BA 11 Package Information Module Place the module in the blister tray Stack the blister tray Put it into the carton Waiting for your suggestion at anytime. - 11 - E-mail：sales@eardatek.
Module：EWN-8250FGT1AA EWN-8258FAT1BA 12 Reference design 12.1 RF a) Under the antenna and in the two directions indicated by the arrow, avoid covering the ground, routing and placing metal components. It is better to directly hollow out the PCB in this area. Fig 6 Antenna b) It is recommended not to use any components within 30mm of the module antenna area, and the module baseboard should also avoid wiring and covering the ground as much as possible.
Module：EWN-8250FGT1AA EWN-8258FAT1BA 12.2 Power supply requirement The module power supply voltage is DC+3.3V. The power supply design needs to consider the output current and power interference. The power supply current design needs to reserve 50mA. To avoid the +3.3V power supply from interfering with other circuits on the motherboard, it is recommended to supply to the module using the regulator circuit alone. the recommended DC-DC circuit structure shown in the figure below. A 4.
Module：EWN-8250FGT1AA EWN-8258FAT1BA 12.3 Motherboard interference avoidance Motherboard interference comes from: high-speed data interface (HDMI), the Operating frequency of main chip, DDR, DC-DC power supply. The method of avoiding interference according to the characteristics of various signals is also different. The main methods of interference avoidance include: 1. keeping away from the source of interference; 2. Adding shields to avoid interference leakage; 3.
Module：EWN-8250FGT1AA EWN-8258FAT1BA Fig 9 HDIM and USB interference 12.3.2 The main chip interferes with DDR Because the main chips operate at about 800MHz or DDR2 operate at 667MHz, 3x frequency of 800MHz and 4x frequency of 667MHz are near 2.4GHz band. It must to place BT modules and antennas far away from the main chip and DDR. It is strongly recommended that the main chip be isolated from the DDR by a shield. As shown in the figure below.
Module：EWN-8250FGT1AA EWN-8258FAT1BA 12.4 Recommended secondary reflux temperature curve T he number of reflux shall not exceed 2 times, and the tin feeding height of the half hole of the module shall be no less than 1/4. The lead-free reflux curve requirements of BT module products are shown in figure 11： Fig 11 Furnace temperature curve Note: 1. The maximum furnace temperature of the module is 260℃, don't exceed this temperature. 2. The gold plating thickness of the module pad is 2u".
Module：EWN-8250FGT1AA EWN-8258FAT1BA 13 WARNING 13.1 FCC WARNING This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. Warning: Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.
Module：EWN-8250FGT1AA EWN-8258FAT1BA 13.2 IC Caution Radio Standards Specification RSS-Gen, issue 5 - English: This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canada’s licence-exempt RSS(s). Operation is subject to the following two conditions: This device may not cause interference. This device must accept any interference, including interference that may cause undesired operation of the device.
Module：EWN-8250FGT1AA EWN-8258FAT1BA 14 Revision History Revision Release Date V1.0 2019-11-19 V1.1 2020-07-22 V1.2 2020-08-05 V1.3 2020-8-12 Revised By Summary First release Guo.QL Modify the picture, change the module pin size, modify the specification Increase current requirement; Modify dimension drawing; Add packing method Added EWN-8258FAT1BA Waiting for your suggestion at anytime. - 19 - Guo.QL Guo.QL Guo.QL E-mail：sales@eardatek.
Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01 2.2 List of applicable FCC rules FCC Part 15 Subpart C 15.247 & 15.207 & 15.209 2.3 Specific operational use conditions The module is a Bluetooth module with BLE function. Operation Frequency: 2402-2480MHz Number of Channel: 40 Modulation: GFSK Type: PCB Antenna Gain: 0.5dBi Max. The module can be used for mobile or portable applications with a maximum 0.5dBi antenna.
2.8 Label and compliance information Host product manufacturers need to provide a physical or e-label stating “Contains FCC ID: 2AMM6825X1BA” with their finished product. 2.
Federal Communication Commission Statement (FCC, U.S.) This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
Information that must be placed in the end user manual: The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user's manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.
