CS-63016-XX CS-63016-XX BLE Module User’s Suide Dyaco International Inc. 12F,No.111,Songjiang Road, Taipei City ,Taiwan R.O.C TEL ：+886-2-2515-2288 FAX ：+886-2-2515-9963 Version:0.
CS-63016-XX 1. Introduction The SS-HYB70B01FC2 Bluetooth® module is design for Bluetooth® standard BLE electronic accessories via Bluetooth® connectivity. It is available in the 2.4GHz ISM band Class 2 Radio, compatible with Bluetooth® Core Specification Version 4.2 1.1. Operational - Single operating voltage: 1.9V to 3.
CS-63016-XX 2.0 Device overview The BM70/71 embedded 2.4 GHz Bluetooth version 4.2 BLE module is built around Microchip Technology IS1870/71 BLE System on Chip (SoC). The IS1870/71 SoC incorporates Bluetooth stack, power management subsystem, 2.4 GHz transceiver, and RF power amplifier. The user can embed Bluetooth functionality into any applications using the BM70/71 module. -3- ver 0.
CS-63016-XX 2.1. PIN DESCRIPTION -4- ver 0.
CS-63016-XX -5- ver 0.
CS-63016-XX 3. Reference designed circuit -6- ver 0.
CS-63016-XX 4. ELECTRICAL CHARACTERISTICS This section provides an overview of the B70 modules electrical characteristics. Additional information will be provided in future revisions of this document. Absolute maximum ratings for the B70 devices are listed here. Exposure to the maximum rating conditions for extended periods may affect device reliability.
CS-63016-XX TABLE 4-1: RECOMMENDED OPERATING CONDITIONS -8- ver 0.
CS-63016-XX TABLE 4-2: SS-HYB70B01FC2 APPLICATION MODE CURRENT CONSUMPTION Note 1: Test condition: VBAT=3.3V, LED set off and measured in VBAT input. 2: Flash code version: BLEDK3 v1.03, UI version: IS187x_102_BLEDK3_UIv100.123. 3: Test phone: iPhone® 6+ with iOS 9.02. 4: Test application version: BLEDK3 V1.2. 5: UI set flow control and RX_IND. 6: For information on how to measure the current, refer to the “IS187x_BM7x BLEDK3 Application Note”. -9- ver 0.
CS-63016-XX 5.0 PACKAGING INFORMATION FIGURE 5-1: SS-HYB70B01FC2 MODULE DIMENSIONS FIGURE 5-2: SS-HYB70B01FC2 RECOMMENDED PCB FOOT PRINT - 10 - ver 0.
CS-63016-XX 6.0 SOLDERING RECOMMENDATIONS The B70 should be assembled using a standard lead-free, re-flow profile IPC/JEDEC J-STD-020. The module can be soldered to the host PCB using a standard lead or lead-free solder re-flow profiles, see Figure 6-1. To avoid any damage to the B70, follow these recommendations: • Do not exceed the peak temperature (TP) of +250°C • Use no-clean flux solder paste • Do not wash as moisture can be trapped under the shield • Use only one flow.
CS-63016-XX EOF Federal Communication Commission Interference Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.
CS-63016-XX End Product Manual Information The user manual for end users must include the following information in a prominent location “IMPORTANT NOTE: To comply with FCC RF exposure compliance requirements, the antenna used for this transmitter must be installed to provide a separation distance of at least 0.5cm from all persons and must not be colocated or operating in conjunction with any other antenna or transmitter.” This device complies with part 15 of the FCC rules.
