deRFsamR21E -23S00/-23S20 Datasheet 1. General description The deRFsamR21E is a 2.4GHz ZigBee 3.0 radio module series which integrates the SoC ATSAMR21E18 from Microchip / Atmel together with a 4 Mbit data flash on a tiny size of 21 mm x 13 mm. The microcontroller ATSAMR21E18 integrates a powerful and energy efficient 32-Bit ARM CortexM0+ core together with a 2.4 GHz ZigBee radio transceiver.
datasheet Version 0.9 2017-09-13 deRFsamR21E-23S00/-23S20 datasheet Table of contents 1. General description ......................................................................................................... 1 2. Features .......................................................................................................................... 1 1. Overview ......................................................................................................................... 6 2.
datasheet Version 0.9 2017-09-13 deRFsamR21E-23S00/-23S20 datasheet 10. Programming ................................................................................................................. 26 10.1. Software/Applications ........................................................................................... 26 10.2. Clocks .................................................................................................................. 26 10.3. Pre-flashed firmware ............................
datasheet Version 0.9 2017-09-13 deRFsamR21E-23S00/-23S20 datasheet Document history Date Version Description 2017-09-13 0.9 Preliminary version www.dresden-elektronik.
datasheet Version 0.9 2017-09-13 deRFsamR21E-23S00/-23S20 datasheet Abbreviations Abbreviation Description IEEE 802.15.
datasheet Version 0.9 2017-09-13 deRFsamR21E-23S00/-23S20 datasheet 1. Overview The deRFsamR21E series is the second generation of small, ready-to-use radio modules that provides a fully integrated solution for wireless applications, using the IEEE802.15.4 standard in the 2.45 GHz ISM frequency band. All required RF components are already integrated on the module, therefore no expensive RF design is needed. Features can be added by simply connecting sensors and output stages to the module.
datasheet Version 0.9 2017-09-13 deRFsamR21E-23S00/-23S20 datasheet 3. Block diagram Figure 5-15 shows the block diagram of the radio module deRFsamR21E-23S00. VCC SPI 4Mbit Serial Flash ATSAMR21E18 SPI Balun & Harmonic Filter Chip Antenna 12 GPIO Figure 3-1: Block diagram deRFsamR21E-23S00 Figure 5-2 shows the block diagram of the radio module deRFsamR21E-23S20 with u.FL connector. VCC 4Mbit Serial Flash SPI SPI ATSAMR21E18 Balun & Harmonic Filter U.
datasheet Version 0.9 2017-09-13 deRFsamR21E-23S00/-23S20 datasheet Figure 5-3 shows the block diagram of the radio module deRFsamR21E-23S20 with RF-out pad. VCC 4Mbit Serial Flash SPI SPI ATSAMR21E18 Balun & Harmonic Filter RF-out 12 GPIO Figure 5-3: Block diagram deRFsamR21E-23S20 with RF-out pad used www.dresden-elektronik.
datasheet Version 0.9 2017-09-13 deRFsamR21E-23S00/-23S20 datasheet 4. Pinout In this chapter the pinout is described. The following figure shows the pinout of the radio module. The pinout applies to both variants 23S00 and 23S20.
datasheet Version 0.9 2017-09-13 deRFsamR21E-23S00/-23S20 datasheet 5. Mechanical description 5.1. Module dimensions The mechanical dimensions are described in this chapter. The modules size is 21.0 x 13.0 x 2.5 mm (0,827 x 0,512 x 0,098 inch). Figure 7-1 shows additional dimensions. Figure 7-1: mechanical dimensions of the module www.dresden-elektronik.
datasheet Version 0.9 2017-09-13 5.2. deRFsamR21E-23S00/-23S20 datasheet Recommended footprint Both radio module types share the same footprint, only the area which it is not allowed to place copper on is different. Figure 7-2: Recommended Footprint for deRFsamR21E-23S00 www.dresden-elektronik.
datasheet Version 0.9 2017-09-13 deRFsamR21E-23S00/-23S20 datasheet Figure 7-3: Recommended Footprint for deRFsamR21E-23S20 The recommended pad size is 0.9 x 1.4 mm, solder mask clearance is 75 to 100 µm, stencil opening is 0.8 x 1.25 mm with stencil thickness 100 to 150 µm. The 23S00 with internal antenna requires the user to follow the placement and layout guidelines for best RF performance. For more details see Section 11.6 and 11.7.
datasheet Version 0.9 2017-09-13 deRFsamR21E-23S00/-23S20 datasheet 6. Electrical specification This section will outline the main parameters required to build applications. The module characteristics are determined by the implemented parts. See references at the end of this document for required datasheet references. 6.1. Absolute Maximum Ratings Stresses beyond those listed in Table 8-1 may cause permanent damage to the device.
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datasheet Version 0.9 2017-09-13 deRFsamR21E-23S00/-23S20 datasheet Table 8-3: TX_PWR Register settings at 3.0V TX Output Current TX_PWR Power Consuption Value [dBm] [mA]1 0x0 4 0x1 3.7 0x2 3.4 0x3 3 0x4 2.5 0x5 2 0x6 1 0x7 0 0x8 -1 0x9 -2 0xA -3 0xB -4 0xC -6 0xD -8 0xE -12 13.8 11.8 0xF -17 7.2 Note: 1. Current consumption for transceiver only, MCU and data flash currents have to be considered as well 6.4.
datasheet Version 0.9 2017-09-13 deRFsamR21E-23S00/-23S20 datasheet 7. Onboard SPI Serial Flash The module incorporates a 4 MBit data flash connected to the module by SPI bus. The data flash connects to PA16-PA19 according to Table 9-1.
datasheet Version 0.9 2017-09-13 deRFsamR21E-23S00/-23S20 datasheet Read Data (up to 30 MHz) Fast Read (up to 70 MHz) Read Manufacturer and Device ID Read ID 03h A23-A16 A15-A8 A7-A0 (D7-D0) 0Bh A23-A16 A15-A8 A7-A0 dummy 9Fh (M7-M0) (ID7-ID0) 90h dummy (ID15ID8) dummy 00h (M7-M0) (next byte) (D7-D0) continuous continuous (IRD7IRD0) *make sure not to send a second byte since it may lead to locked and not resettable protection with some of the flash devices 7.2.
datasheet Version 0.9 2017-09-13 deRFsamR21E-23S00/-23S20 datasheet 8. Recommended configuration This chapter describes a recommended configuration which enables use of all frequently used interfaces. The schematic symbol used in this chapter as well as a footprint can be found in dresden elektronik Altium and Eagle libraries (see Section 7.3). Figure 10-1 shows the schematic of a sample application.
datasheet Version 0.9 2017-09-13 8.1. deRFsamR21E-23S00/-23S20 datasheet Signal description The features of the controller can be mapped to different ports. How to configure the device for the example configuration is described in this chapter. The serial interface functions are organized in SERCOM units (Serial Communication Interface). These units consist of 4 Signals and can be mapped to several ports of the microcontroller. The configuration is shown in Table 10-1.
datasheet Version 0.9 2017-09-13 8.3. deRFsamR21E-23S00/-23S20 datasheet I2C (TWI) The I2C (Inter-Integrated Circuit, also referred to as TWI – two wire interface) is a common interface for sensor connection and it is able to connect several devices at one bus. There is one clock signal (SCL) and a data signal (SDA). It is necessary to place pull-up resistors for both lines externally to the radio module for proper function. We recommend the use of 4.7 kΩ resistors as shown in Figure 10-3.
datasheet Version 0.9 2017-09-13 deRFsamR21E-23S00/-23S20 datasheet 9. Application Information The PCB design of a radio module base board is important for a proper performance of peripherals and the radio. The next subsections give design hints to create a custom base board. 9.1. PCB Technology The module is designed for use with standard PCB technology to reduce the costs and cover a wide application range. 9.2. Power supply Power supply pins 13 and 14 have to be connected to a power domain of 2.
datasheet Version 0.9 2017-09-13 deRFsamR21E-23S00/-23S20 datasheet (-) no separate VCC plane usable (+) separate VCC plane usable (+) cheaper than 4 layers (-) more expensive than 2 layers 9.5.
datasheet Version 0.9 2017-09-13 deRFsamR21E-23S00/-23S20 datasheet Figure 11-5: Placing in the centre with antenna Figure 11-6: Placing in the centre with RF pad Do not place ground areas below the radio module and near the chip antenna (see Section 11.5 and 11.7). 9.7. Recommended layout for deRFsamR21E-23S00 For best performance of the deRFsamR21E-23S00 with chip antenna it is recommended to place the module at a corner of the PCB according to Figure 11-7.
datasheet Version 0.9 2017-09-13 9.8. deRFsamR21E-23S00/-23S20 datasheet Board thickness of 1.55 mm Copper layer thickness of 35 µm Top and bottom solder RF Design for deRFsamR21E-23S20 For deRFsamR21E-23S20 two options for the RF signal are available: using the coaxial u.FL connector to connect an external antenna or if needed in the application, custom designed RF circuitry using the RF-out pad. Note: Please get in contact with dresden elektronik to advise for a custom FCC certified design.
datasheet Version 0.9 2017-09-13 deRFsamR21E-23S00/-23S20 datasheet RF switches to PA, LNA and antenna The switch must have 50 Ω inputs and outputs for the RF signal. The switch control can be realized with the DIG3 and DIG4 signal of the radio transceiver. Power amplifier (PA) The PA has to be placed on the TX path after the RF switch. It is important to regard the PA’s manufacturer datasheet and application notes, especially for designing the power supply and ground areas.
datasheet Version 0.9 2017-09-13 deRFsamR21E-23S00/-23S20 datasheet 10. Programming The update process of the radio module, the required software and hardware for programming via SWD interface and the driver installation on different operating systems are described in this chapter. Currently, the SWD interface is supported by several Atmel and third party programmers and debuggers like Atmel ICE and Segger J-Link. Other programmers that support ATSAMR21E18A will work as well.
datasheet Version 0.9 2017-09-13 deRFsamR21E-23S00/-23S20 datasheet 10.3. Pre-flashed firmware The radio modules will be delivered without pre-flashed firmware. Dresden elektronik provides development services for industrial or ZigBee 3.0 compatible projects and the modules can be delivered with custom firmware pre-programmed. www.dresden-elektronik.
datasheet Version 0.9 2017-09-13 deRFsamR21E-23S00/-23S20 datasheet 11. Radio certification The modules deRFsamR21E-23S00 and deRFsamR21E-23S20 have received regulatory approvals for modular devices in the United States and European countries. The modules were also successfully tested according to IC regulations and are compliant but not certified for Canada. 11.1. United States (FCC) The deRFsamR21E-23S00 with onboard chip antenna and deRFsamR21E-23S20 with coaxial u.
datasheet Version 0.9 2017-09-13 deRFsamR21E-23S00/-23S20 datasheet 11.2. European Union (ETSI) Hereby, dresden elektronik ingenieurtechnik gmbh declares that the radio equipment types deRFsamR21E-23S00 and deRFsamR21E-23S20 are in compliance with the Directive 2014/53/EU. The full text of the EU declaration of conformity is available at the following internet address: https://www.dresden-elektronik.de/funktechnik/solutions/wireless-light-control/euconformity/?L=1.
datasheet Version 0.9 2017-09-13 deRFsamR21E-23S00/-23S20 datasheet 11.3. Approved antennas The deRFsamR21E-23S00 has an integrated chip antenna. The design is fully compliant with all regulations. The deRFsamR21E-23S20 is compliant with the listed approved antennas in Table 13-1. Table 13-1: Approved antenna(s) and accessory Approved antenna list Type External antenna 2400 to 2483.5 MHz Rubber antenna U.FL-to-RP-SMA pigtail, 15 cm Integrated antenna 2400 to 2483.
datasheet Version 0.9 2017-09-13 deRFsamR21E-23S00/-23S20 datasheet 12. Ordering information The product name includes the following information: deRF xxxx - x x x xx Features Form Factor Flash Memory Frequency Range Product / Chipset Table 14-1: Product name code Product name code Information Code Explanation Product / Chipset samR21E ATSAMR21E18A Frequency Range 2 2.4 GHz Flash memory 3 256 kByte Series S OEM module 2nd generation Features 00 Onboard chip antenna 20 Coaxial u.
datasheet Version 0.9 2017-09-13 deRFsamR21E-23S00/-23S20 datasheet 13. Packaging dimension The modules will be delivered in Tape & Reel. The reel quantity is 800 pcs, lower quantities will be delivered in cut tape. Tape dimensions Reel dimensions All dimensions are nominal and measured in mm. www.dresden-elektronik.
datasheet Version 0.9 2017-09-13 deRFsamR21E-23S00/-23S20 datasheet 14. Soldering profile Table 16-1 shows the recommended soldering profile for the radio modules.
datasheet Version 0.9 2017-09-13 deRFsamR21E-23S00/-23S20 datasheet 15. Revision notes Actually, no design issues of the radio modules are known. All errata of the ATSAMR21E18A are described in the datasheet [1]. www.dresden-elektronik.
datasheet Version 0.9 2017-09-13 deRFsamR21E-23S00/-23S20 datasheet 16. References [1] ATSAMR21E18A: Atmel SAM R21E / SAM R21G, SMART ARM-Based Wireless Microcontroller; Datasheet, URL: http://www.microchip.com/wwwproducts/en/ATSAMR21E18A [2] AT86RF233: Low Power, 2.4GHz Transceiver for ZigBee, RF4CE, IEEE 802.15.4, 6LoWPAN, and ISM Applications; Datasheet, URL: http://www.microchip.
datasheet Version 0.9 2017-09-13 deRFsamR21E-23S00/-23S20 datasheet dresden elektronik ingenieurtechnik gmbh Enno-Heidebroek-Straße 12 01237 Dresden GERMANY Phone +49 351 31850-0 Fax +49 351 31850-10 Email wireless@dresden-elektronik.de Trademarks and acknowledgements IEEE 802.15.4™ is a trademark of the Institute of Electrical and Electronics Engineers (IEEE). ZigBee® is a registered trademark of the ZigBee Alliance.