72000 Bluetooth Development Kit User’s Guide 94001620000 Rev. 1.
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages.
Contents Chapter 1 Introduction 1.1 1.2 1.3 1.4 1.5 About This Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Additional Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Downloads and Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . System Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.1 Regulatory Statements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.1.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.1.2 European Union (EU) and EFTA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.1.3 France . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.1.
Chapter 1 Introduction NOTE: You must not make changes or modify the device in any way. The 72000 Development Kit for the Bluetooth Platform Solution from Motorola is a unique demonstration and development tool.
Introduction The following is an overview of the various sections of this user’s guide and a brief description of each section: • Chapter 1, “Introduction” contains an overview of the user’s guide and additional documents available from the CD. The introduction is also where to find information on support, system requirements, and a list of the acronyms used in this guide.
Downloads and Support • Application notes for the following: — Bluetooth Audio Signal Processor (BTASP) for High-Quality Audio Performance — Motorola’s Bluetooth Solution to Interference Rejection and Coexistence with 802.11 — Enhancing ISM Band Performance Using Adaptive Frequency Hopping • Data sheets and information for components on the 72000 Development Kit: — CODEC — UART Level Converter — EEPROMs — Crystals • Bluetooth Core Specification v1.1 1.
Introduction 1.5 Acronyms and Abbreviations Throughout this guide, the following acronyms and abbreviations are used: EEPROM Electrically Erasable/Programmable Read Only Memory Rx Receive(r) SEEPROM Serial Electrically Erasable/Programmable Read Only Memory SPI Serial Peripheral Interface The SPI Bus made by Motorola handles all serial communication with a number of different RF front ends and SEEPROMs.
Chapter 2 Product Overview This section contains a brief overview of the 72000 Development Kit. More detailed information on the various elements is included in later sections and in the separate user’s guides included on the CD. 2.1 Block Diagram The following figure shows the 72000 Development Kit block diagram: 32 KHz 13 MHz Figure 2-1.
Product Overview 2.2 Interfaces The 72000 Development Kit features the following interfaces: • RS232 interface: Programmable baud rate from 1200 to 921 Kbit. • UART interface: 5-pin header with RxD, CTS, RTS, and GND, 3.3 V signaling, programmable baud rate from 1200 to 921 Kbit, HCI UART transport layer. NOTE: The UART and RS232 interfaces cannot operate simultaneously. • 2.3 Audio connections, with audio routed to the CODEC.
Software Tools 2.4.3 DemoBench The DemoBench is a demonstration tool that can be used for a number of purposes. You can send a file to another Bluetooth device, “chat” with another Bluetooth device, and view link and packet statistics in a real-time application. 2.4.4 RadioTest The RadioTest application allows you to test all aspects of your Bluetooth hardware.
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Chapter 3 Setup This section explains how to set up the 72000 Development Kit hardware and software. Do the following: 1. Attach external antenna to the 50 ohm connector on the development board. 2. Attach the development board to your computer using the UART (RS232) cable. 3. Attach power supply to DC connector on board and connect to main electricity supply. 4. Insert the CD in the CD-ROM drive of your computer and follow the onscreen instructions to install the software and documentation. 5.
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Chapter 4 Hardware This section provides information on various aspects of the 72000 Development Kit hardware. In addition, Appendix A, “Board Diagrams“, contains the development board schematic and component placement, and Appendix B, “Bill of Material“, contains the BOM. 4.
Hardware Three buttons are provided for future embedded applications. Four status LEDs are provided: • One application-specific LED • 24 MHz/32 kHz • RX/TX • Power on 4.2 Environmental This section contains system level environmental information about the development board:: • Storage temperature (degrees centigrade): — Min. -40 — Max +125 • Operating temperature (degrees centigrade): — Min. 0 — Max +85 4.
Electrical The following table shows the current consumption measurements of the circuits of the MC72000 Bluetooth Baseband Controller and Transceiver IC. Table 1: Current Consumption Measurements of MC72000 Average Current Description DH5 asymmetric RX 57 mA TX rate 57.6 kbits DH5 asymmetric TX 55.5 mA DH5 symmetric 57.5 mA Type RX rate 723.2 kbits TX rate 723.2 kbits RX rate 57.6 kbits TX rate 433.9 kbits RX rate 433.9 kbits HV1 54.
Hardware 4.4.4 Memory The MC72000 has embedded memory of 256 Kbytes of ROM and 64 K of RAM. The file system and application can be uploaded from a host system, or a low-cost serial EEPROM (four-wire connection). For more information on the contents and structure of the MC72000 memory, please refer to the Bluetooth Platform Solution Embedded System User’s Guide. This is accessible from the document overview on the Development Kit CD. 4.4.5 UART Interface The UART interface is embedded in the MC72000.
Electrical 4.4.7 Antenna The 72000 Development Kit contains an SMA 50 ohm antenna connector. 4.4.8 100 mm² Module A six-layer HDI PCB with an area of 100mm² has been populated with an MC72000 IC and all the necessary external components for a host-based solution, where the reference oscillator signals are provided by the host. This serves as a demonstration of the space efficiency of the MC72000 Bluetooth solution.
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Chapter 5 Regulatory This section contains regulatory statements, a list of the countries where the 72000 Development Kit has obtained type approval or may be shipped as a prototype, and information on what is needed by developers to obtain type approval for their products. NOTE: This device is intended for evaluation and development purposes by professionals only and is NOT for re-sale. 5.1 Regulatory Statements This section contains the regulatory statements that apply to the 72000 Development Kit.
Regulatory 5.1.4 United States of America and Canada Tested to comply with FCC Standards FOR HOME OR OFFICE USE. See FCC 47CFR part 15.19(b)(2) This device complies with part 15 of the FCC rules and with RSS-210 / RSS-139 of the Industry Canada. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. See FCC regulation CFR47 sec. 15.19(3).
Development Kit Approval 5.1.6 Taiwan 5.2 Development Kit Approval 5.2.1 Type Approval In the following countries, the 72000 Development Kit has obtained type approval: • Europe (EU and EFTA countries) • USA • Canada • Japan* * The equipment will be tested at accredited in-country test house. However, actual application will not be submitted as the 72000 development board has no enclosure, which is requested for approval in Japan.
Regulatory 5.2.2 Prototype Shipment In the following countries, the 72000 Development Kit has not been typed approved but prototypes may be shipped: • China • Taiwan • Israel** • Hong Kong • Korea (South) • Singapore • Brazil • Mexico** ** Awaiting new regulations. 5.3 Obtaining Type Approval Customers of Motorola Bluetooth chipsets will face some Bluetooth qualification and regulatory requirements for their products.
Obtaining Type Approval Table 5-1. TRM/CA/04/E TX Output Spectrum-Frequency range TRM/CA/08/E Initial Carrier Frequency Tolerance TRM/CA/09/E Carrier Frequency Drift TTRC/CA/01/E Out-of-Band Spurious Emissions-radiated RCV/CA/02/E Sensitivity-multi-slot packets RCV/CA/03/E C/I performance RCV/CA/04E Blocking performance TP/PHYS/TRX/BV-05-C Symbol rate If changes are made to the 72000 Development Kit radio module BOM or layout, all 16 Bluetooth test cases will be required to be re-tested.
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Appendix A Board Diagrams The following pages show the 72000 development board schematic and component placement.
JTAG 5 J101 DC 4 1 2 3 2 4 6 8 10 Power Supply 4- 6VDC J103 VDD1V85 1 JTAG0 3 JTAG3 5 JTAG4 7 9 Not Mounted JTAG1 JTAG6 JTAG2 MAIN+ RESET JTAG[0..6] 4 SSI[0..3] GPIO[0..3] UART[0..3] Sheet 2 MAIN+ JTAG[0..6] RESET Power_ON EPADRV CLK1 CLK0 GPIO[0..3] SSI[0..3] UART[0..3] REFCTRL Module and Power Sheet3 REFCTRL UART[0..3] SSI[0..3] GPIO[0..
MAIN+ 5 1 R201 2 500mA D201 BZV90C6V8 VCC R207 0R 3 8 24 23 21 16 6 10 11 12 18 17 14 13 8 7 3 4 IC201 VCC1 VCC2 C201 100µF Vin+ VinHysteresisSelect Shutdown S INV Q1_b Q2 S OR 1V85_ENABLE 2V65_ENABLE S202 Switch 4 OUT2V65 OUT1V85 DelayCap RESET_b Detect REFOUT R202 1.0K TP201 D202 Green LED 1 2 3 S201 VCC 2 22 15 9 19 1 7 EP 4 20 5 R215 470R EP AGND1 AGND2 SGND OUT3V0/3V3 1 6 2 5 3 2 1 C202 100nF C203 100nF J202 1p J203 1p 1.0K VDD1V85 R204 R205 1.
D C B A SSI[0..3] CLK1 UART[0..3] SSI3 SSI2 SSI1 SSI0 5 GPIO[0..3] 5 1 3 5 7 9 11 1 UART03 UART25 UART37 UART19 11 2 4 6 8 10 12 2 4 6 8 10 12 4 100nF C302 100nF C304 26 2 27 4 C303 100nF TXD CTS BT_WAKEUP RTS RXD Ri Level shifter C307 22nF R317 43K 3 VDD3V R323 2.
Physical Layer 1 MOTOROLA A-5 Preliminary
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Appendix B Bill of Material This appendix shows the Bill of Material for the 72000 Development Kit PIN 80000504000 Rev. R02.00. Table B-1. Item Value Rating Tolerance Manufacturer Manufacturer's Part Number Part Reference 1 100µF 10V 20% AVX TPSD107MOlOR0150 C201 2 100nF 6.3V 10% X513 Murata GRP155R60J104KA01E C202 3 100nF 6.3V 10% X513 Murata GRP155R60J104KA01E C203 4 100nF 6.3V 10% X513 Murata GRP155R60J104KA01E C210 5 100nF 6.
Table B-1. Item Value Rating Tolerance Manufacturer Manufacturer's Part Number Part Reference 22 100nF 6.3V 10% X513 Murata GRP155R60J104KA01E C316 23 1µF 6.3V 10% X513 Murata GRM188R60J105K C204 24 1µF 6.3V 10% X513 Murata GRM188R60J105K C205 25 1µF 6.3V 10% X513 Murata GRM188R60J105K C206 26 1uF 6.3V 10% X513 Murata GRM188R60J105K C310 27 1uF 6.
Table B-1.
Table B-1. Item Value Rating Tolerance Manufacturer Manufacturer's Part Number Part Reference 71 OR 62.5mW/5 0V 5% Phycomp 2322 705 91001 R302 72 OR 62.5mW/5 0V 5% Phycomp 2322 705 91001 R327 73 OR 62.5mW/5 0V 5% Phycomp 2322 705 91001 R330 74 OR 62.5mW/5 0V 5% Phycomp 2322 705 91001 R331 75 500mA Raychem microSMD050-2 R201 76 1.0K 62.5mW/5 0V 1% ROHM MCR01MZSF1001 13202 77 1.0K 62.5mW/5 0V 1% ROHM MCR01MZSF1001 13204 78 1.0K 62.
Table B-1. Item Value Rating Tolerance Manufacturer Manufacturer's Part Number Part Reference 90 10K 62.5mW/2 5V 5% YAGEO RC02103JR 13309 91 10K 62.5mW/2 5V 5% YAGEO RC02103JR 13310 92 10K 62.5mW/2 5V 5% YAGEO RC02103JR 13311 93 10K 62.5mW/2 5V 5% YAGEO RC02103JR 13312 94 10K 62.5mW/2 5V 5% YAGEO RC02103JR 13318 95 10K 62.5mW/2 5V 5% YAGEO RC02103JR 13319 96 47013 63mW/50 V 5% KOA Speer Electronics Inc.
Table B-1. Manufacturer Manufacturer's Part Number Part Reference Switch ALPS SSSS210800 S201 110 Switch ALPS SSSS210800 S202 111 SPST Alps Electronic Co., LTD. SKHUAD S301 112 SPST Alps Electronic Co., LTD. SKHUAD S302 113 SPST Alps Electronic Co., LTD. SKHUAD S303 114 SPST Alps Electronic Co., LTD. SKHUAD S304 115 BC847BS Philips 9340 425 20115 TR301 116 BC847BS Philips 9340 425 20115 TR302 117 32.768KHz Epson MC-14632.7680K-A5 X201 118 13.
Appendix C 100 mm² Module Diagram The following pages show the 72000 100 mm² module schematic. This module serves as a demonstration of the space efficiency of the MC72000 Bluetooth solution.
D C B 5 sheet 2 Gillaris + RF EPADRV XBASE XEMIT Antenna CLK1 CLK0 /RESET SSI_STCK_SRCK SSI_STFS_SRFS SSI_STD_BT4 SSI_SRD TxD_BT6 RxD_BT3 /CTS_BT7 /RTS SPI1_MOSI SPI1_MISO SPI1_SCK SPI1_SS REFCTRL EXTAL 32_kHz OSC32K_REFCLK GPIO_B10 GPIO_B12 GPIO_C9_BT5 TRST TDI TDO TMS RTCK TTS TCK 4 4 N7749730 N7749740 PCB101 DIG501-2 N7749724 51 49 55 54 43 1V8_CORE N7752504 N7750260 N7750252 N7750256 62 57 61 56 VDD_PORT N7624266 N7749718 N7749722 N7749720 2 3 4 5 VDD_EMI 67 47 N7750236 N7749
1V8_CORE 5 VDD_PORT C308 100nF C301 100nF VDD_EMI C309 100nF CLK0 CLK1 C304 100nF R xD / CTS / RTS C310 1µF 1V8_CORE F2 J3 F8 B4 A2 A7 G3 B3 E8 A6 G8 C8 C9 B8 B9 A4 B7 B5 D7 C7 B6 C6 C5 IC301 VDDcore_I1 VDDcore_I2 VDDcore_I3 VDDcore_I4 VDDpa_VDDINT VDDpb_pc VDD_EIM VDD_IO RESET CLK0 CLK1 4 SSI_STCK_SRCK SSI_STFS_SRFS SSI_STD SSI_SRD TxD RxD CTS RTS SPI1-MOSI SPI1-MISO SPI1-SCK SPI1-SS MODE 1 REFCTRL EXTAL PAO-P PAO-M RFIN MN-LF DC-LF1 DC-LF2 XEMIT XBASE GPO-0 GNDSEAL GNDSEAL1 GNDSEA
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