White Papers

PowerEdge Product Group
Direct from
Development
© 2017 Dell Inc. or its subsidiaries. All Rights Reserved. Dell, EMC and other trademarks are trademarks of Dell Inc. or its subsidiaries. Other trademarks may be trademarks of
their respective owners.
PowerEdge MX7000 Chassis Thermal Airflow Architecture
Tech Note by:
Rick Eiland
SUMMARY
Creating a modular
infrastructure that can efficiently
cool the high-power, high-
density workloads of today and
tomorrow requires intelligent,
scalable design.
Dell EMC’s PowerEdge MX7000
modular infrastructure meets
these thermal challenges
through an innovative, patent-
pending chassis architecture
design.
The Multiple Airflow Zone
architecture of the new MX7000
chassis enables enhanced
energy efficiency in the cooling
of higher power and denser
system configurations, extends
the lifecycle of the chassis to
accommodate multiple
generations of future IT
technology, and delivers
excellent investment protection.
Modular infrastructures enable customers to be flexible in configuration, agile in
management, and efficient in design, over several generations of compute,
storage, and networking needs. The unique thermal design of the new Dell
EMC PowerEdge MX7000 chassis ensures that customers can confidently grow
over many generations of IT technology, satisfying forthcoming demands for
scalable expansion and performance while providing excellent investment
protection. The multiple airflow zone architecture of the MX7000 is engineered
to ensure fresh air is delivered to each component of the chassis, enabling
enhanced cooling of higher power and dense system configurations.
CHASSIS ARCHITECTURE
The overall chassis architecture of the PowerEdge MX7000 uses dedicated,
independent airflow paths for each critical subsystem (Compute, I/O, and Power
Supplies) to provide fresh air to each individual zone. This design allows for
expanded feature support, improved cooling efficiency, and the flexibility to
scale with future needs. Figure 1 below provides a view of the front and rear of
the MX7000 chassis with each zone highlighted.
Zone 1 (Blue): Cooling air for the eight vertically-arranged Compute and
Storage sled slots at the front of the chassis is drawn thru the chassis by
five horizontally-arranged fans at the rear
Zone 2 (Yellow): Four vertically arranged fans at the front of the chassis
push cooling air into the I/O Modules (IOMs) at the rear of the chassis
Zone 3 (Green): The bottom of the chassis is populated with up to six
power supply units (PSUs) each with a dedicated fan and exhaust airflow
path out the rear of the chassis
Figure 1: Front and rear view of PowerEdge MX7000 chassis with dedicated airflow zones highlighted
The orthogonal layout of these zones allows for simple, front-to-back airflow
thru the chassis. By avoiding overly complex airflow paths to each subsystem,
the overall chassis minimizes its impedance, allowing for increased airflow

Summary of content (3 pages)