Dell EMC PowerEdge C6420 Technical Specifications Regulatory Model: E43S Series Regulatory Type: E43S001 December 2020 Rev.
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Contents Chapter 1: Technical specifications............................................................................................... 4 Dimensions of the Dell EMC PowerEdge C6420 sled.................................................................................................4 Chassis weight......................................................................................................................................................................4 Processor specifications..................
1 Technical specifications The technical and environmental specifications of your system are outlined in this section. Topics: • • • • • • • • • • Dimensions of the Dell EMC PowerEdge C6420 sled Chassis weight Processor specifications Supported operating systems System battery Expansion bus specifications Memory specifications Drives and storage specifications Video specifications Environmental specifications Dimensions of the Dell EMC PowerEdge C6420 sled Figure 1.
Table 2. Chassis weight of the enclosure with the sleds (continued) System Maximum weight (with all sleds and drives) No backplane systems 34.56 Kg (76.19 lb) Processor specifications The Dell EMC PowerEdge C6420 sled supports up to two Intel Xeon Scalable processor in each of the four independent sleds. Each processor supports up to 28 cores. NOTE: The fabric processor must be installed in the processor 2 socket in a mixed configuration of fabric and non-fabric processors.
Memory specifications Table 4.
Table 7. Supported video resolution options Resolution Refresh rate (Hz) Color depth (bits) 1024 x 768 60 up to 24 1280 x 800 60 up to 24 1280 x 1024 60 up to 24 1360 x 768 60 up to 24 1440 x 900 60 up to 24 Environmental specifications The sections below contains information about the environmental specifications of the system.
Table 9.
Table 9. Maximum continuous operating temperature for nonfabric dual processor configuration (continued) TDP Watts 125 W 115 W Process or model Heat sink model Max memo ry/ proce ssor 6240 CPU1: JYKMM | CPU2: V2DRD CPU1: 8| CPU2: 8 21 6242 CPU1: JYKMM | CPU2: V2DRD CPU1: 8| CPU2: 8 6244 CPU1: FMM2M | CPU2: V2DRD 3.5-inch chassis 12x Drive s 8x 4x Drive Drive s s No-BP Chassis 2.
Table 9.
Table 9. Maximum continuous operating temperature for nonfabric dual processor configuration (continued) TDP Watts 70 W Process or model Heat sink model Max memo ry/ proce ssor 4208 CPU1: JYKMM | CPU2: V2DRD CPU1: 8| CPU2: 8 35 35 3204 CPU1: JYKMM | CPU2: V2DRD CPU1: 8| CPU2: 8 35 4209T CPU1: JYKMM | CPU2: V2DRD CPU1: 8| CPU2: 8 35 3.5-inch chassis 12x Drive s 8x 4x Drive Drive s s No-BP Chassis 2.
Table 10. Maximum continuous operating temperature for non-fabric single processor configuration (continued) TDP Watts Processo r model 150 W 125W 115 W 12 No-BP Chassis 2.
Table 10. Maximum continuous operating temperature for non-fabric single processor configuration (continued) TDP Watts Processo r model 85 W 70 W Heat sink model Max 3.5-inch chassis memor y/ 12x 8x 4x proces Drive Driv Driv sor s es es No-BP Chassis 2.
Table 11. Configuration Restrictions with Mellanox Navi Dual Port Card with Active (Optical) connectivity (continued) 3.5-inch chassis TDP Watts No-BP Chassis 2.
Table 13. Configuration Restrictions with Intel NVMe SSD AIC P4800X 3.5-inch chassis TDP Watts No-BP Chassis 2.
Table 14. Expanded operating temperature (continued) Expanded operating temperature Specifications 5°C-45°C for a maximum of 1% of its annual operating hours. For temperatures between 40°C-45°C, derate maximum allowable temperature by 1°C per 125 m above 950 m (1°F per 228 ft). NOTE: When operating in the expanded temperature range, system performance may be impacted. NOTE: When operating in the expanded temperature range, ambient temperature warnings may be reported in the System Event Log.
NOTE: Some configurations require a lower ambient temperature for more information, see the Standard operating temperature specifications. Thermal restrictions Table 18. Thermal restrictions matrix for dual processors Maximum continuous operating inlet temperature (°C) 3.5" Chassis TDP Watt s Proc No. DPN Max 12x 8x 4x of DIM HDDs HDDs HDDs CPU M Heat count Sinks s 165W 6238 R CPU1: CPU1: | 8| CPU2 CPU2 : :8 6240 R CPU1: CPU1: Not | 8| Suppo CPU2 CPU2 rted : :8 6230 R 2.
Table 18. Thermal restrictions matrix for dual processors (continued) Maximum continuous operating inlet temperature (°C) CPU2 CPU2 :8 :8 95W 4210T CPU1: CPU1: | 8| CPU2 CPU2 : :8 30 35 35 35 35 35 35 35 35 35 85W 3206 R 35 35 35 35 35 35 35 35 35 35 CPU1: CPU1: | 8| CPU2 CPU2 : :8 Table 19. Thermal restrictions matrix for single processor Maximum continuous operating inlet temperature (°C) 3.5" Chassis 2.5" Chassis No-BP Chassi s TDP Watts Proc No.
Table 19.
Maximum vibration specifications Table 22. Maximum vibration specifications Maximum vibration Specifications Operating 0.26 Grms at 5 Hz to 350 Hz (all operation orientations). Storage 1.88 Grms at 10 Hz to 500 Hz for 15 min (all six sides tested). Maximum shock specifications Table 23. Maximum shock specifications Maximum shock Specifications Operating 24 executed shock pulses 6 G in the positive and negative x, y, z axis for up to 11 ms (four pulses on each side of the system).
