Dell EMC PowerEdge T550 Technical Specifications Regulatory Model: E76S Regulatory Type: E76S001 December 2021 Rev.
Notes, cautions, and warnings NOTE: A NOTE indicates important information that helps you make better use of your product. CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid the problem. WARNING: A WARNING indicates a potential for property damage, personal injury, or death. © 2021 Dell Inc. or its subsidiaries. All rights reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its subsidiaries.
Contents Chapter 1: Technical specifications............................................................................................... 4 Chassis dimensions............................................................................................................................................................. 5 System weight......................................................................................................................................................................
1 Technical specifications The technical and environmental specifications of your system are outlined in this section.
Chassis dimensions Figure 1. Chassis dimensions Table 1. Chassis dimension for the system Drives A B C D E (with Bezel) 24 x 2.5-inch / 8 x 3.5-inch + 8 x 2.5inch NVMe 446.0 mm (17.60 inches) 459.0 mm (18.07 inches) 200.0 mm (7.87 inches) 663.5 mm (26.12 680.5 mm (26.79 inches) inches) NOTE: Zb is the nominal rear wall external surface where the system board I/O connectors reside. System weight Table 2.
Processor specifications Table 3. Processor specifications for the system Supported processor Number of processors supported 3 rd Generation Intel Xeon Scalable processors with up to 32 cores Up to two PSU specifications The PowerEdge T550 system supports up to two AC power supply units (PSUs). Table 4.
NOTE: This system is also designed to connect to the IT power systems with a phase-to-phase voltage not exceeding 240 V. NOTE: Heat dissipation is calculated using the PSU wattage rating. NOTE: When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Dell Energy Smart Solution Advisor available at Dell.com/ESSA.
System battery specifications The PowerEdge T550 system supports CR 2032 3.0-V lithium coin cell system battery. Expansion card riser specifications The system supports up to six PCI express (PCIe) Gen 4 expansion cards. Table 6. Expansion card slots support matrix Processor 1 Platform Controller Hub (PCH) Processor 2 Internal Internal Internal Slot 1 x16 - - Slot 2 - - x16 Slot 3 - - x16 Slot 4 - - x16 Slot 5 - x8 - Slot 6 x16 - - PCIe slot Table 7.
Table 10. Storage controller cards Internal controllers External controllers ● ● ● ● ● ● ● ● HBA355e ● PERC H840 S150 PERC H345 H355 PERC H755 H755N HBA355i Boot Optimized Storage Subsystem (BOSS-S2): HWRAID 2 x M.2 SSDs Drive specifications Drives The PowerEdge T550 system supports: ● Up to 8 x 2.5-inch SAS/SATA/ (HDD) drives ● Up to 16 x 2.5-inch SAS/SATA (HDD) drives ● Up to 24 x 2.5-inch SAS/SATA/ (HDD) drives ● Up to 8 x 3.5-inch SAS/SATA/ (HDD/SSD) drives ● Up to 8 x 3.5-inch SAS/SATA + 8 x 2.
NOTE: The USB 2.0 specifications provide a 5 V supply on a single wire to power connected USB devices. A unit load is defined as 100 mA in USB 2.0, and 150 mA in USB 3.0. A device may draw a maximum of 5 unit loads (500 mA) from a port in USB 2.0; 6 (900 mA) in USB 3.0. NOTE: The USB 2.0 interface can provide power to low-power peripherals but must adhere to USB specification. An external power source is required for higher-power peripherals to function, such as external CD/DVD Drives.
Environmental specifications NOTE: For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Manuals & Documents on www.dell.com/support/home. Table 14.
Table 17. Shared requirements across all categories (continued) Temperature Specifications Maximum operational altitude 3,048 meters (10,000 feet) Table 18. Maximum vibration specifications Maximum vibration Specifications Operating 0.21 G rms at 5 Hz to 500 Hz (all operation orientations) Storage 1.88 G rms at 10 Hz to 500 Hz for 15 minutes (all six sides tested) Table 19.
Table 20. Thermal restriction matrix Drive Processo Fans Configuratio r n CPU TDP Fan CPU HSK redundan TDP>150 TDP<=15 cy W 0W GPU support 8 x 3.5 Technical specifications 8 x 2.5 16 x 2.5 24 x 2.
Table 20. Thermal restriction matrix (continued) Technical specifications Drive Processo Fans Configuratio r n CPU TDP Fan CPU HSK redundan TDP>150 TDP<=15 cy W 0W GPU support GPU<=7 5W TBU suppo GPU>7 rt 5W CPU blank Fan blank Note GPU riser configurati on NOTE: GPU riser 1 and 2 not supported 8 x 3.5 + 8 x 2.
NOTE: OCP shroud are required for all drive configurations, even if the OCP card is not installed. NOTE: DIMM blanks are required for CPU TDP>185 W, but are not required for CPU TDP<=185 W. NOTE: GPU blank is required at GPU riser slot 2, when a GPU>75 W is installed at GPU riser slot 1. NOTE: HDD blanks are required for empty HDD slots. NOTE: *x5 and x7 fan count is applicable only for TBU configuration. Systems without TBU should not use x5 and x7 fan counts.
Particulate and gaseous contamination specifications The following table defines the limitations that help avoid any damages to the IT equipment and/or, or both failure from particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and results in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer. Table 22.
Table 24. 8 x 3.5-inch drive configuration Standard Operating Support (ASHRAE A2 compliant) NOTE: All options supported unless otherwise noted. ○ Broadcom OCP 3.0 QP 25G SFP28 ○ Broadcom PCIe QP 25G ○ NVIDIA CX6-LX PCIe Dual Port 25G SFP28 at slot 6 Extended ambient 40° C Operating Support (ASHRAE A3 compliant) Extended ambient 45° C Operating Support (ASHRAE A4 compliant) ● Non-Dell qualified peripheral cards and Channel devices (FW) cards not supported. ● NIC consuming power >= 25 W not supported.
Table 26. 8 x 3.5-inch x 8 x NVMe drive configuration Standard Operating Support (ASHRAE A2 compliant) 18 Technical specifications Extended ambient 40° C Operating Support (ASHRAE A3 compliant) Extended ambient 45° C Operating Support (ASHRAE A4 compliant) ● Two PSUs are required. System performance may be reduced in the event of a PSU failure. ● Optic cable with spec 85C is required. ● Two PSUs are required. System performance may be reduced in the event of a PSU failure.
