DS-52810-03 Datasheet Version：V1.0.0 SHEZHEN DEASINO TECHNOLOGY.
REVISION VERSION HISTORY AMENDMENT DATA Page 2 of 15 DEASINO
DESCRIPTION DS-52810-03 is an external antenna Bluetooth low power module. DS-52810-03 integrates all features of Bluetooth radio,software stack,GATT based profiles,antenna and host end user applications,which means no external micro controller. It provides a Bluetooth Low Energy fully compliant system for a data communication. At +4 dBm TX Power and -93dBm RX Sensitivity DS-52810-03 has best RF performance.
1.Block Diagram DS-52810-03 block diagram is illustrated in figure 2 below.
CPU and Memory The Main core is ARM Cortex-M4.
The general GPIO is organized as one port with up to 33 I/Os enabling access and control of up to 28 pins through one port. Each GPIO can be accessed individually with the following user configurable features. - Input/output direction - Output drive strength - Internal pull-up and pull-down resistors - Wake-up from high or low level triggers on all pins - Trigger interrupt on all pins - All pins can be used by the PPI task/event system.
The temperature sensor measures die temperature over the temperature range of the device with0. 25 degree resolution. The SPI is implemented with Easy DMA support for ultra low power serial communication from anexternal SPI master. Easy DMA in conjunction with hardware-based semaphore mechanismsremoves all real-time requirements associated with controlling the SPI slave from a low priority CPU execution context. The TWI slave with EasyDMA(TWIS) is compatible with I2C operating at 100 kHz and 400 kHz.
2.Electrical Characteristic 2.1 Absolute Maximum rating Rating Min Max Unit Storage Temperature -40 +120 Degree VDD, VDD_RF -0.3 3.9 V Other Terminal Voltages -0.3 VDD+0.3 V 2.2 Recommended Operating Conditions Rating Min Max Unit Operating Temperature -40 +85 Degree VDD, VDD_RF* 1.7 3.6 V *)normal supply voltage is 3.0 to 3.3V 2.
3. Pin Description DS-52810-03 PIN descriptions are summarized in Figure 4 and Table 5 below. .Bottom View(Bottom Pad) Pin Name Type Description 1 P0.25 Digital I/O General purpose I/O pin. 2 P0.26 Digital I/O General purpose I/O pin. 3 P0.27 Digital I/O General purpose I/O pin. 4 P0.30 AIN6 Digital I/O Analog input General purpose I/O pin. SAADC/COMP/LPCOMP input. 5 P0.28 AIN4 Digital I/O Analog input General purpose I/O pin. SAADC/COMP/LPCOMP input.
AIN3 Analog input SAADC/COMP/LPCOMP input. 15 P0.06 Digital I/O General purpose I/O pin. 16 P0.07 Digital I/O General purpose I/O pin. 17 P0.08 Digital I/O General purpose I/O pin. 18 P0.09 Digital I/O General purpose I/O pin. 19 P0.10 Digital I/O General purpose I/O pin. 20 P0.11 Digital I/O General purpose I/O pin. 21 P0.12 Digital I/O General purpose I/O pin. 22 P0.13 Digital I/O General purpose I/O pin. 23 P0.14 Digital I/O General purpose I/O pin.
4.Layout UINT : mm ·Top View(Bottom pad) 4.1 PCB design suggestion For the best performance of theDS-52810-03 module, do not place any metal or other obstacles in the clear area of the antenna, do not allow any plastic or insulating materials to touch the antenna, and make the PCBA design follow the design shown in figure 7
5.Re-flow Temperature time profile The data here is given only for guidance on solder and has to be adapted to your process and other re-flow parameters for example the used solder paste. The paste manufacturer provides a re-flow profile recommendation for his product.
Preheat Main Heat Peak Tsmax TLmax tpmax Temperature Time Temperature Time Temperature Time Degree sec Degree sec Degree sec 150 10 220 90 258 9 230 40 Parameter Value Unit Average ramp-up rate 3 Degree/sec Average ramp-down rate 6 Degree/sec Max. Time 25degree to Peak Temperature 8 Min.
6.Contact information COMPANY: SHEZHEN DEASINO TECHNOLOGY .,LTD (深圳市鼎欣茂科技有限公司) ADDRESS: Floor3B. 4Building. YongQi Technology Park.NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
his transmitter/module and its antenna(s) must not be co-located or operating in conjunction with any transmitter. This information also extends to the host manufacturer’s instruction manual. 2.4 Limited module procedures not applicable. 2.5 Trace antenna designs It is “not applicable” as trace antenna which is not used on the module. 2.6 RF exposure considerations This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment.
