Specifications

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Table Of Contents

CYBT-273063-02, CYBT-263064-02, CYBT-263065-02, EZ-BT™ Module

PRELIMINARY

CYBT-273063-02

CYBT-263064-02

CYBT-263065-02

EZ-BT™ Module

Cypress Semiconductor Corporation • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600

Document Number: 002-29354 Rev. ** Revised December 26, 2019

CYBT-273063-02, CYBT-263064-02, CYBT-263065-02, EZ-BT™ Module

General Description

The CYBT-2X30XX-02 is a dual-mode Bluetooth



BR/EDR and

Low Energy (BLE) wireless module solution. The

CYBT-2X30XX-02 includes an onboard crystal oscillator,

passive components, PA/LNA, and the Cypress CYW20819

silicon device.

The CYBT-2X30XX-02 supports a number of peripheral

functions (ADC, PWM), as well as multiple serial communication

protocols (UART, SPI, I

C, I

S/PCM). The CYBT-2X30XX-02

includes a royalty-free stack compatible with Bluetooth 5.0 in a

12.0 × 16.61 × 1.70 mm module form-factor.

The CYBT-2X30XX-02 is offered in three certified versions

CYBT-273063-02, CYBT-263064-02, and CYBT-263065-02.

The CYBT-273063-02 includes an integrated trace antenna. The

CYBT-263064-02 supports an external antenna via a u-FL

connector. The CYBT-263065-02 supports an external antenna

through a RF solder pad output. CYBT-2X30XX-02 includes

onboard external power/low noise amplifier, qualified by

Bluetooth SIG, and includes regulatory certification approval for

FCC, ISED, MIC, and CE.

Module Description

■ Module size: 12.5 mm × 19 mm × 1.95 mm

■ Complies with Bluetooth Core Specification version 5.0 and

includes support for BR, EDR 2/3 Mbps, eSCO, BLE, LE

2 Mbps, as well as Bluetooth Mesh.

❐ QDID: TBD

❐ Declaration ID: TBD

■ Certified to FCC, ISED, MIC, and CE standards

■ 256-KB on-chip Flash, 176-KB on-chip RAM

■ Industrial temperature range: –30 °C to +85 °C

■ Integrated Arm

Cortex

-M4 microprocessor core with

floating point unit (FPU)

RF Characteristics

■ Maximum TX output power: +17.0 dBm

■ BLE RX Receive Sensitivity: –95.0 dBm

Power Consumption

■ TX current consumption

❐ BLE silicon: 5.8 mA (radio only, 4 dBm)

❐ 8TR8201: 8 mA Typ (PA/LNA only)

■ RX current consumption

❐ Bluetooth silicon: 5.9 mA (radio only)

❐ 8TR8201: 75 mA Typ (PA/LNA only, +20 dBm Pout)

❐ 8TR8201: ?? mA Typ (PA/LNA only, +7.5 dBm Pout)

■ Cypress CYW20819 silicon low power mode support

❐ PDS: 16.5 μA with 176 KB RAM retention

❐ ePDS: 8.7 μA

❐ HIDOFF (wake on external or timed interrupt): 1.75 μA

Functional Capabilities

■ Up to 20 GPIOs

■ I

C, I2S, UART, and PCM interfaces

■ Two Quad-SPI interfaces

■ Auxiliary ADC with up to 15 analog channels

■ Programmable key scan 20 × 8 matrix

■ General-purpose timers and six PWMs

■ Real-time clock (RTC) and watchdog timers (WDT)

■ Bluetooth Basic Rate (BR) and Enhanced Data Rate (EDR)

Support

■ BLE protocol stack supporting generic access profile (GAP)

Central, Peripheral, Observer, or Broadcaster roles

Benefits

CYBT-2X30XX-02 is fully integrated and certified solution that

provides all necessary components required to operate

Bluetooth communication standards.

■ Proven hardware design ready to use

■ Ultra-flexible supermux I/O design allows maximum flexibility

for GPIO function assignment

■ Over-the-air update capable for development or field updates

■ Bluetooth SIG qualified.

■ ModusToolbox™ provides an easy-to-use integrated design

environment (IDE) to configure, develop, program, and test

your Bluetooth application

Summary of content (45 pages)

PAGE 1
CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 PRELIMINARY EZ-BT™ Module CYBT-273063-02, CYBT-263064-02, CYBT-263065-02, EZ-BT™ Module General Description ■ The CYBT-2X30XX-02 is a dual-mode Bluetooth BR/EDR and Low Energy (BLE) wireless module solution. The CYBT-2X30XX-02 includes an onboard crystal oscillator, passive components, PA/LNA, and the Cypress CYW20819 silicon device.
PAGE 2
PRELIMINARY CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 More Information Cypress provides a wealth of data at www.cypress.com to help you to select the right module for your design, and to help you to quickly and effectively integrate the module into your design.
PAGE 3
PRELIMINARY CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 Contents Overview ............................................................................ 4 Functional Block Diagram ........................................... 4 Module Description ...................................................... 4 Pad Connection Interface ................................................ 6 Recommended Host PCB Layout ................................... 7 Module Connections ................................................
PAGE 4
CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 PRELIMINARY Overview Functional Block Diagram Figure 1 illustrates the CYBT-2X30XX-02 functional block diagram. Figure 1.
PAGE 5
PRELIMINARY CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 Figure 2. Module Mechanical Drawing Side View Top View (Seen from Top) Bottom View (Seen from Bottom) Note 1. No metal should be located beneath or above the antenna area. Only bare PCB material should be located beneath the antenna area. For more information on the recommended host PCB layout, see “Recommended Host PCB Layout” on page 7. Document Number: 002-29354 Rev.
PAGE 6
CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 PRELIMINARY Pad Connection Interface As shown in the bottom view of Figure 2 on page 5, the CYBT-2X30XX-02 has 35 connections to a host board via solder pads (SP). Table 2 and Figure 3 detail the solder pad length, width, and pitch dimensions of the CYBT-2X30XX-02 module. Table 2. Connection Description Name Connections Connection Type Pad Length Dimension Pad Width Dimension Pad Pitch SP 35 Solder Pad 1.11 mm 0.61 mm 0.97 mm Figure 3.
PAGE 7
PRELIMINARY CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 Recommended Host PCB Layout Figure 5, Figure 6, Figure 7, and Table 3 provide details that can be used for the recommended host PCB layout pattern for the CYBT-2X30XX-02. Dimensions are in millimeters unless otherwise noted. Pad length of 1.27 mm (0.633 mm from center of the pad on either side) shown in Figure 7 is the minimum recommended host pad length. The host PCB layout pattern can be completed using either Figure 5, Figure 6, or Figure 7.
PAGE 8
PRELIMINARY CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 Table 3 provides the center location for each solder pad on the CYBT-2X30XX-02. All dimensions are referenced to the center of the solder pad. Refer to Figure 7 for the location of each module solder pad. Table 3. Module Solder Pad Location Figure 7. Solder Pad Reference Location Solder Pad (Center of Pad) Location (X,Y) from Orign (mm) Dimension from Orign (mils) 1 (0.33, 6.83) (12.99, 268.90) 2 (0.33, 7.80) (12.99, 307.09) 3 (0.33, 8.
PAGE 9
CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 PRELIMINARY Module Connections Table 4 details the solder pad connection definitions and available functions for each connection pad. The GPIO connections available on the CYBT-2X30XX-02 can be configured to any of the input or output functions listed in Table 5. Table 4 specifies any function that is required to be used on a specific solder pad, and also identifies SuperMux capable GPIOs that can be configured using the ModusToolbox device configurator.
PAGE 10
CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 PRELIMINARY Table 5 details the available Input and Output functions that are configurable to any solder pad in Table 4 that are marked as SuperMux capable. Table 5.
PAGE 11
CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 PRELIMINARY Connections and Optional External Components Power Connections (VDD) The CYBT-2X30XX-02 contains one power supply connection, VDD. VDD accepts a supply input of 2.5 V to 3.6 V. Table 13 provides this specification. The maximum power supply ripple for this power connection is 100 mV, as shown in Table 13. External Reset (XRES) The CYBT-2X30XX-02 has an integrated power-on reset circuit which completely resets all circuits to a known power-on state.
PAGE 12
CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 PRELIMINARY The design guidelines that should be followed when completing the Antenna Matching Network are as follows: ■ The AMN should be placed close to the antenna on the main board. ■ Routing to the AMN from the ANT pad on the module must be controlled to an impedance of 50 W. The final AMN circuit may contain only a single component, or all three components shown above.
PAGE 13
CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 PRELIMINARY Critical Components List Table 6 details the critical components used in the CYBT-2X30XX-02 module. Table 6. Critical Component List Component Reference Designator Silicon Description U1 62-pin QFN Bluetooth Silicon Device - CYW20819 Crystal Y1 24.000 MHz, 12PF PA/LNA U2 PA/LNA, +23 dBm maximum boost Antenna Design Table 7 details the PCB trace antenna used in the CYBT-2X30XX-02 module. Table 7.
PAGE 14
CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 PRELIMINARY Bluetooth Baseband Core The Bluetooth Baseband Core (BBC) implements all time-critical functions required for high-performance Bluetooth operation. The BBC manages the buffering, segmentation, and routing of data for all connections. It prioritizes and schedules all RX/TX activities including adv, paging, scanning, and servicing of connections.
PAGE 15
PRELIMINARY CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 Power Management Unit Figure 10 shows the CYW20819 power management unit (PMU) block diagram. The CYW20819 includes an integrated buck regulator, a digital LDO for the digital core, and an RF LDO for the Radio. The PMU also includes a brownout detector which places the part in shutdown when input voltage is below a certain threshold. Figure 10. Default Usage Mode Document Number: 002-29354 Rev.
PAGE 16
PRELIMINARY CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 Integrated Radio Transceiver The CYBT-2X30XX-02 has an integrated radio transceiver that has been designed to provide low power operation in the globally available 2.4 GHz unlicensed ISM band. Transmitter Path CYBT-2X30XX-02 features a fully integrated transmitter. The baseband transmit data is GFSK modulated in the 2.4 GHz ISM band. Digital Modulator The digital modulator performs the data modulation and filtering required for the GFSK signal.
PAGE 17
PRELIMINARY CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 Microcontroller Unit The CYBT-2X30XX-02 includes a Cortex-M4 processor with 1 MB of program ROM, 176 KB of RAM, and 256 KB of flash. The CM4 has a maximum speed of 96 MHz. The 256 KB of flash is supported by an 8 KB cache allowing direct code execution from flash at near maximum speed and low power consumption. The CM4 runs all the BT layers as well as application code.
PAGE 18
CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 PRELIMINARY Table 10. XTAL Oscillator Characteristics Parameter Output frequency Symbol Foscout Frequency tolerance Minimum Typical Maximum Unit – – 32.768 – kHz Over temperature and aging – – 250 ppm Pdrv For crystal selection – – 0.5 μW XTAL series resistance Rseries For crystal selection – – 70 kΩ XTAL shunt capacitance Cshunt For crystal selection – – 2.
PAGE 19
PRELIMINARY CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 Peripherals and Communication Interfaces I 2C The CYBT-2X30XX-02 provides a 2-pin I2C master/slave interface to communicate with I2C compatible peripherals.
PAGE 20
PRELIMINARY CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 ADC Port The CYBT-2X30XX-02 includes a Σ-Δ ADC designed for audio and DC measurements. The ADC can measure the voltage on 15 GPIOs (P0, P1, P8-P15, P17, P28, P29, and P37). When used for analog inputs, the GPIOs must be placed in digital input disable mode to disconnect the digital circuit from the pin and avoid leakage. The internal bandgap reference has ±5% accuracy without calibration.
PAGE 21
PRELIMINARY CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 PWM The CYBT-2X30XX-02 has six internal PWMs, labeled PWM0-5. The PWM module consists of the following: ■ Each of the six PWM channels contains the following registers: ❐ 16-bit initial value register (read/write) ❐ 16-bit toggle register (read/write) ❐ 16-bit PWM counter value register (read) PWM configuration register shared among PWM0–5 (read/write).
PAGE 22
PRELIMINARY CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 I2S Interface The CYBT-2X30XX-02 supports a single I2S digital audio port. with both master and slave modes. The I2S signals are: ■ I2S Clock: I2S SCK ■ I2S Word Select: I2S WS ■ I2S Data Out: I2S DO 2 ■I S 2 Data In: I2S DI I S SCK and I2S WS become outputs in master mode and inputs in slave mode, while I2S DO always stays as an output.
PAGE 23
CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 PRELIMINARY Electrical Characteristics The absolute maximum ratings in the following table indicate levels where permanent damage to the device can occur, even if these limits are exceeded for only a brief duration. Functional operation is not guaranteed under these conditions. Operation at absolute maximum conditions for extended periods can adversely affect long-term reliability of the device. . Table 11.
PAGE 24
CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 PRELIMINARY Current Consumption Table 15 provides the current consumption measurements taken at the input of LDOIN and VDDIO combined (LDOIN = VDDIO = 3.0 V). Table 15. Current Consumption Operational Mode HCI RX Conditions Typical 48 MHz with Pause 1.3 48 MHz without Pause 2.55 Continuous RX 5.9 TX Continuous TX - 4 dBm 5.8 PDS – 16.5 ePDS All RAM retained 8.7 HID-Off (SDS) 32 kHz XTAL on 1.
PAGE 25
CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 PRELIMINARY Digital LDO Table 17. Digital LDO Parameter Input Supply, DIGLDO_VDDIN Condition Min must be met for correct operation Range Output Voltage, DIGLDO_VDDOUT Step Min Typ Max VOUT + 20 mV 1.26 1.4 0.9 1.2 1.275 – 25 – Unit V mV Accuracy after trimming –2 – +2 % Dropout Voltage At max load current – – 20 mV Output Current DC Load 0.075 40 60 mA Quiescent Current At T ≤ 85 °C, VIN = 1.4 V – – 40 μA 1.
PAGE 26
CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 PRELIMINARY Table 18. RF LDO (continued) Parameter Conditions PSRR COUT = 2.2 μF, 1.235 V ≤ VIN ≤ 1.4 V, VOUT = 1.2 V, IOUT = 20 mA f = 1 kHz f = 100 kHz Noise COUT = 2.2 μF, VIN = 1.235 V, VOUT = 1.2 V, IOUT = 20 mA f = 30 kHz f = 100 kHz Min. Typ. Max. Unit 25 13 – – dB dB – – 80 70 nV√Hz nV√Hz Digital I/O Characteristics Table 19.
PAGE 27
CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 PRELIMINARY Table 20. Electrical Characteristics (continued) Parameter Conversion rate Signal bandwidth Input impedance Startup time Symbol – – RIN – Conditions/Comments Min. Typ. Max.
PAGE 28
CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 PRELIMINARY Chipset RF Specifications Table 21, Table 22, Table 23, and Table 24 apply to single-ended industrial temperatures. Unused inputs are left open. Table 21. BR/EDR - Receiver RF Specifications Parameter Mode and Conditions Min Typ Max Unit 2402 – 2480 MHz – –92[6] – dBm EDR 2M – –93.5 – EDR 3M – –87 – –20 – – Receiver Section Frequency range – GFSK, BR GFSK 0.
PAGE 29
CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 PRELIMINARY Table 22. BR/EDR - Transmitter RF Specifications Parameter Min Typ Max Unit 2402 – 2480 MHz Class 2: BR TX power – 4.0 – Class 2: EDR 2M and 3M TX power – 0 – 20 dB bandwidth – 930 1000 |M – N| = 2 – – –20 |M – N| ≥ 3 [9] – – –40 – – –36.0 Transmitter Section Frequency range dBm kHz Adjacent Channel Power dBm Out-of-Band Spurious Emission 30 MHz to 1 GHz 1 GHz to 12.75 GHz – – –30.0 1.8 GHz to 1.
PAGE 30
CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 PRELIMINARY Table 24. BLE2 RF Specifications Parameter Conditions [12] Minimum Typical Maximum RX sensitivity – – –89 – TX power – – 4.0 – Unit dBm Timing and AC Characteristics In this section, use the numbers listed in the Reference column of each table to interpret the following timing diagrams. UART Timing Table 25. UART Timing Specifications Reference Characteristics Min. Typ. Max.
PAGE 31
CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 PRELIMINARY SPI Timing The SPI interface can be clocked up to 24 MHz. Table 26 and Figure 15 show the timing requirements when operating in SPI Mode 0 and 2. Table 26. SPI Mode 0 and 2 Reference Characteristics Min. Max. 1 Time from master assert SPI_CSN to first clock edge 45 – 2 Setup time for MOSI data lines 6 ¾ SCK 3 Idle time between subsequent SPI transactions 1 SCK – Unit ns Figure 15.
PAGE 32
CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 PRELIMINARY Table 27. SPI Mode 1 and 3 Reference Characteristics Min. Max. 1 Time from master assert SPI_CSN to first clock edge 45 – 2 Setup time for MOSI data lines 6 ¾ SCK 3 Idle time between subsequent SPI transactions 1 SCK – Unit ns Figure 16. SPI Timing, Mode 1 and 3 Document Number: 002-29354 Rev.
PAGE 33
CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 PRELIMINARY I2C Compatible Interface Timing The specifications in Table 27 references Figure . Table 28.
PAGE 34
CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 PRELIMINARY I2S Interface Timing I2S timing is shown below in Table 29, Figure 18, and Figure 19. Table 29. Timing for I2S Transmitters and Receivers Transmitter Lower LImit Clock Period T Receiver Upper Limit Lower Limit Upper Limit Notes Min Max Min Max Min Max Min Max Ttr – – – Tr – – – [15] Master Mode: Clock generated by transmitter or receiver HIGH tHC 0.35Ttr – – – 0.35Ttr – – – [16] LOWtLC 0.35Ttr – – – 0.
PAGE 35
PRELIMINARY CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 Figure 18. I2S Transmitter Timing Figure 19. I2S Receiver Timing Document Number: 002-29354 Rev.
PAGE 36
CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 PRELIMINARY Environmental Specifications Environmental Compliance This Cypress BLE module is produced in compliance with the Restriction of Hazardous Substances (RoHS) and Halogen-Free (HF) directives. The Cypress module and components used to produce this module are RoHS and HF compliant.
PAGE 37
PRELIMINARY CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 Regulatory Information FCC The device CYBT-2X30XX-02 complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. The device meets the requirements for modular transmitter approval as detailed in FCC public Notice DA00-1407.
PAGE 38
PRELIMINARY CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 ISED Innovation, Science and Economic Development (ISED) Canada Certification CYBT-2X30XX-02 is licensed to meet the regulatory requirements of Innovation, Science and Economic Development (ISED) Canada. License: IC: 7922A-3063 Manufacturers of mobile, fixed or portable devices incorporating this module are advised to clarify any regulatory questions and ensure compliance for SAR and/or RF exposure limits.
PAGE 39
PRELIMINARY CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 European Declaration of Conformity Hereby, Cypress Semiconductor declares that the Bluetooth module CYBT-2X30XX-02 complies with the essential requirements and other relevant provisions of Directive 2014.
PAGE 40
CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 PRELIMINARY Packaging Table 31. Solder Reflow Peak Temperature Module Part Number Package CYBT-273063-02 35-pad SMT Maximum Peak Temperature Maximum Time at Peak Temperature No. of Cycles 260 °C 30 seconds 2 CYBT-263064-02 35-pad SMT 260 °C 30 seconds 2 CYBT-263065-02 35-pad SMT 260 °C 30 seconds 2 Table 32.
PAGE 41
CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 PRELIMINARY Figure 22 details reel dimensions used for the CYBT-2X30XX-02. Figure 22. Reel Dimensions The CYBT-2X30XX-02 is designed to be used with pick-and-place equipment in an SMT manufacturing environment. The center-of-mass for the CYBT-2X30XX-02 is detailed in Figure 23. Figure 23. CYBT-2X30XX-02 Center of Mass Top View (Seen from Top) Document Number: 002-29354 Rev.
PAGE 42
CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 PRELIMINARY Ordering Information Table 33 lists the CYBT-2X30XX-02 part number and features. Table 33 also lists the target program for the respective module ordering codes. Table 34 lists the reel shipment quantities for the CYBT-2X30XX-02. Table 33.
PAGE 43
CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 PRELIMINARY Acronyms Document Conventions Table 35. Acronyms Used in this Document Units of Measure Acronym BLE Description Table 36.
PAGE 44
CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 PRELIMINARY Document History Page Document Title: CYBT-273063-02, CYBT-263064-02, CYBT-263065-02, EZ-BT™ Module Document Number: 002-29354 Revision ECN Submission Date Description of Change ** 6761681 12/26/2019 Preliminary datasheet for CYBT-273063-02, CYBT-263064-02, and CYBT-263065-02 module. Document Number: 002-29354 Rev.
PAGE 45
PRELIMINARY CYBT-273063-02 CYBT-263064-02 CYBT-263065-02 Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. PSoC® Solutions Products Arm® Cortex® Microcontrollers Automotive cypress.com/arm cypress.com/automotive Clocks & Buffers Interface cypress.com/clocks cypress.