Specifications
Table Of Contents
- CYBT-223058-02, CYBT-253059-02, EZ-BT Module
- General Description
- Benefits
- More Information
- Contents
- Overview
- Pad Connection Interface
- Recommended Host PCB Layout
- Module Connections
- Connections and Optional External Components
- Critical Components List
- Antenna Design
- Bluetooth Baseband Core
- Power Management Unit
- Integrated Radio Transceiver
- Microcontroller Unit
- Peripherals and Communication Interfaces
- Electrical Characteristics
- Chipset RF Specifications
- Timing and AC Characteristics
- Environmental Specifications
- Regulatory Information
- Packaging
- Ordering Information
- Acronyms
- Document Conventions
- Document History Page
- Sales, Solutions, and Legal Information
PRELIMINARY
CYBT-223058-02
CYBT-253059-02
EZ-BT Module
Cypress Semiconductor Corporation • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600
Document Number: 002-29172 Rev. ** Revised December 11, 2019
CYBT-223058-02, EZ-BT Module
General Description
The CYBT-2x305x-02 is a dual-mode Bluetooth
BR/EDR and Low Energy (BLE) wireless module solution. The CYBT-223058-02
includes an onboard crystal oscillator, passive components, and the Cypress CYW20819 silicon device. The CYBT-253059-02
includes an onboard crystal oscillator, passive components, and the Cypress CYW20820 silicon device.
The CYBT-2x305x-02 supports a number of peripheral functions (ADC, PWM), as well as multiple serial communication protocols
(UART, SPI, I
2
C, I
2
S/PCM). The CYBT-2x305x-02 includes a royalty-free stack compatible with Bluetooth 5.0 in a small 11.0 ×11.00
× 1.70 mm module form-factor.
The CYBT-2x305x-02 includes 256 KB of on-chip flash memory and is designed for standalone operation. The CYBT-2x305x-02 uses
an integrated power amplifier to achieve Class I or Class II output power capability.
The CYBT-2x305x-02 includes an integrated chip antenna, is qualified by Bluetooth SIG, and includes regulatory certification approval
for FCC, ISED, MIC, and CE.
Module Description
■ Module size: 11.00 mm × 11.00 mm × 1.70 mm
■ Complies with Bluetooth Core Specification version 5.0 and
includes support for BR, EDR 2/3 Mbps, eSCO, BLE, LE
2 Mbps, as well as Bluetooth Mesh.
❐ QDID: TBD
❐ Declaration ID: TBD
■ Certified to FCC, ISED, MIC, and CE standards
■ 256-KB on-chip Flash, 176-KB on-chip RAM
■ Industrial temperature range: –30 °C to +85 °C
■ Integrated Arm
®
Cortex
®
-M4 microprocessor core with
floating point unit (FPU)
RF Characteristics
■ Maximum TX output power: +4.0 dBm (CYBT-223058-02);
+10.5 dBm (CYBT-253059-02)
■ BLE RX Receive Sensitivity: –94.5 dBm
Power Consumption
■ TX current consumption
❐ BLE silicon: 5.8 mA (radio only, 4 dBm) (CYBT-223058-02);
22 mA (radio only, 10.5 dBm) (CYBT-253059-02)
■ RX current consumption
❐ Bluetooth silicon: 5.9 mA (radio only)
■ Cypress CYW20819/20 silicon low power mode support
❐ PDS: 16.5 µA with 176 KB RAM retention
❐ ePDS: 8.7 µA
❐ HIDOFF (wake on external or timed interrupt): 1.75 µA
Functional Capabilities
■ Up to 22 GPIOs
■ I
2
C, I2S, UART, and PCM interfaces
■ Two Quad-SPI interfaces
■ Auxiliary ADC with up to 15 analog channels
■ Programmable key scan 20 × 8 matrix
■ General-purpose timers and six PWMs
■ Real-time clock (RTC) and watchdog timers (WDT)
■ Bluetooth Basic Rate (BR) and Enhanced Data Rate (EDR)
Support
■ BLE protocol stack supporting generic access profile (GAP)
Central, Peripheral, Observer, or Broadcaster roles
Benefits
CYBT-2x305x-02 is fully integrated and certified solution that
provides all necessary components required to operate
Bluetooth communication standards.
■ Proven hardware design ready to use
■ Ultra-flexible supermux I/O design allows maximum flexibility
for GPIO function assignment
■ Over-the-air update capable for development or field updates
■ Bluetooth SIG qualified.
■ ModusToolbox™ provides an easy-to-use integrated design
environment (IDE) to configure, develop, program, and test
your Bluetooth application