Data Sheet

ManualsBrandsCypress Semiconductor ManualsElectronicsEZ-BT WICED Module

Table Of Contents

CYBT-343052-02, EZ-BT WICED Module

CYBT-343052-02

EZ-BT WICED Module

Cypress Semiconductor Corporation • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600

Document Number: 002-28053 Rev. ** Revised August 23, 2019

CYBT-343052-02, EZ-BT WICED Module

General Description

The CYBT-343052-02 is a fully integrated Bluetooth



Smart Ready wireless module. The CYBT-343052-02 includes an onboard

crystal oscillator, passive components, flash memory, and the Cypress CYW20735 silicon device. Refer to the CYW20735 datasheet

for additional details on the capabilities of the silicon device used in this module.

The CYBT-343052-02 supports peripheral functions (ADC and PWM), UART, I

C, and SPI communication, and a PCM/I

S audio

interface. The CYBT-343052-02 includes a royalty-free Bluetooth stack compatible with Bluetooth 5.0 in a 13.3 × 22.4 × 1.95 mm

package.

The CYBT-343052-02 includes 512 KB of onboard serial flash memory and is designed for standalone operation. The

CYBT-343052-02 uses an integrated power amplifier to achieve Class I or Class II output power capability.

The CYBT-343052-02 is fully qualified by Bluetooth SIG and is targeted at applications requiring cost-optimized Bluetooth wireless

connectivity.

Module Description

■ Module size: 13.3 mm × 22.4 mm × 1.95 mm

■ Bluetooth 5.0 Qualified Smart Ready module

❐ QDID: TBD

❐ Declaration ID: TBD

■ Certified to FCC, ISED, MIC, and CE regulations

■ Castelated solder pad connections for ease-of-use

■ 512-KB on-module serial flash memory

■ Up to 24 GPIOs

■ Temperature range: –30 °C to +85 °C

■ Cortex-M4 32-bit processor

■ Maximum TX output power

❐ +10 dbm for Bluetooth Classic

❐ +12 dBm for Bluetooth Low Energy

• BLE connection range of up to 250 meters at 12 dBm

[1]

■ RX receive sensitivity:

❐ Bluetooth Classic: –91.5 dBm

❐ –94.5 dBm for Bluetooth Low Energy

Power Consumption

■ BLE Current Consumption

❐ RX current: 8 mA

❐ TX current: 18 mA @ 12 dBm

❐ Interval BLE ADV average current consumption: 30 µA

❐ HIDOFF (Deep Sleep): 1 µA

Functional Capabilities

■ 1x MIPI DMI-C interface

■ 6x 16-bit PWMs

■ Programmable key-scan matrix interface, up to 8x20 key

scanning matrix

■ Quadrature decoder

■ Watchdog timer (WDT)

■ 1x peripheral UART, 1x UART for programming and HCI

■ 1x SPI (master or slave mode)

■ 1x I2C master

■ One ADC (10-ENoB for DC measurement and 12-ENOB for

Audio measurement)

■ Hardware security engine

Benefits

CYBT-343052-02 provides all necessary components required

to operate BLE and/or BR communication standards.

■ Proven ready-to-use hardware design

■ Dual-mode operation eliminates the need for multiple modules

■ Cost optimized for applications without space constraints

■ Nonvolatile memory for self-sufficient operation and

over-the-air updates

■ Bluetooth SIG listed with QDID and Declaration ID

■ Fully certified module eliminates the time needed for design,

development, and certification processes

■ WICED

Studio provides an easy-to-use integrated design

environment (IDE) to configure, develop, and program a

Bluetooth application

Note

1. Connection range tested module-to-module in full line-of-sight environment, free of obstacles or interference sources with output power of +12.0 dBm. Actual range

will vary based on end product design, environment, receive sensitivity, and transmit output power of the central device.

Summary of content (47 pages)

PAGE 1
CYBT-343052-02 EZ-BT WICED Module CYBT-343052-02, EZ-BT WICED Module General Description The CYBT-343052-02 is a fully integrated Bluetooth Smart Ready wireless module. The CYBT-343052-02 includes an onboard crystal oscillator, passive components, flash memory, and the Cypress CYW20735 silicon device. Refer to the CYW20735 datasheet for additional details on the capabilities of the silicon device used in this module.
PAGE 2
CYBT-343052-02 More Information Cypress provides a wealth of data at www.cypress.com to help you to select the right module for your design, and to help you to quickly and effectively integrate the module into your design.
PAGE 3
CYBT-343052-02 Contents Overview ............................................................................ 4 Functional Block Diagram ........................................... 4 Module Description ...................................................... 4 Pad Connection Interface ................................................ 6 Recommended Host PCB Layout ................................... 7 Module Connections ........................................................
PAGE 4
CYBT-343052-02 Overview Functional Block Diagram Figure 1 illustrates the CYBT-343052-02 functional block diagram. Figure 1. Functional Block Diagram (GPIOs) XRES UART SPI CYW20735 Silicon Device 12C PCM/12S ADC UP to 6 PWMs UP to 24 GPIOs Passive Components (RES, CAP, IND) 512KB SERIAL FLASH 24 MHz XTAL 32kHz LPO_In (Optional) 1x MIPI DMI‐C interface Module Description The CYBT-343052-02 module is a complete module designed to be soldered to the application’s main board.
PAGE 5
CYBT-343052-02 Figure 2. Module Mechanical Drawing Top View (Seen from Top) Side View Bottom View Notes 2. No metal should be located beneath or above the antenna area. Only bare PCB material should be located beneath the antenna area. For more information on recommended host PCB layout, see “Recommended Host PCB Layout” on page 7. 3. The CYBT-343052-02 includes castellated pad connections, denoted as the circular openings at the pad location above. Document Number: 002-28053 Rev.
PAGE 6
CYBT-343052-02 Pad Connection Interface As shown in the bottom view of Figure 2 on page 5, the CYBT-343052-02 connects to the host board via solder pads on the backside of the module. Table 2 and Figure 3 detail the solder pad length, width, and pitch dimensions of the CYBT-343052-02 module. Table 2. Connection Description Name Connections Connection Type Pad Length Dimension Pad Width Dimension Pad Pitch SP 42 Solder Pads 1.01 mm 0.61 mm 0.90 mm Figure 3.
PAGE 7
CYBT-343052-02 Recommended Host PCB Layout Figure 5, Figure 6, Figure , and Table provide details that can be used for the recommended host PCB layout pattern for the CYBT-343052-02. Dimensions are in millimeters unless otherwise noted. Pad length of 1.27 mm (0.635 mm from center of the pad on either side) shown in Figure is the minimum recommended host pad length. The host PCB layout pattern can be completed using either Figure 5, Figure 6, or Figure .
PAGE 8
CYBT-343052-02 Table 3 provides the center location for each solder pad on the CYBT-343052-02. All dimensions are referenced to the center of the solder pad. Refer to Figure for the location of each module solder pad. Table 3. Module Solder Pad Location Table 3. Module Solder Pad Location Solder Pad (Center of Pad) Location (X,Y) from Orign (mm) Dimension from Orign (mils) 1 (0.38, 7.72) (14.96, 303.94) 2 (0.38, 8.62) (14.96, 339.37) 3 (0.38, 9.53) (14.96, 375.20) 4 (0.38, 10.43) (14.96, 410.
PAGE 9
CYBT-343052-02 Module Connections Table 4 details the solder pad connection definitions and available functions for the pad connections for the CYBT-343052-02 module. Table 4 lists the solder pads on the CYBT-343052-02 module, the silicon device pin, and denotes what functions are available for each solder pad. Table 4.
PAGE 10
CYBT-343052-02 Table 4. (continued) Module Pad Name Pad Number HOST_WAKE 35 Silicon Pin Name BT_HOST_WAKE NA NA BT_RF NA NA JTAG_SEL RST_N XRES 3 I/O Power Domain O VDDO I/O Description Host wake-up. This is a signal from the Bluetooth device to the host indicating that the Bluetooth device requires attention. ■ Asserted: Host device must wake up or remain awake ■ Deasserted: Host device may sleep when sleep awake criteria is met.
PAGE 11
CYBT-343052-02 Table 5.
PAGE 12
CYBT-343052-02 Connections and Optional External Components Power Connections (VDDIN) The CYBT-343052-02 contains one power supply connection, VDDIN, which accepts a supply input range of 2.3 V to 3.6 V for CYBT-343052-02. Table 12 provides this specification. The maximum power supply ripple for this power connection is 100 mV, as shown in Table 12. It is not required to place any power supply decoupling or noise reduction circuitry on the host PCB.
PAGE 13
CYBT-343052-02 Multiple-Bonded GPIO Connections The CYBT-343052-02 contains GPIOs, which are multiple-bonded at the silicon level. If any of these dual-bonded GPIOs are used, only the functionality and features for one of these port pins may be used. The desired port pin should be configured in the WICED Studio SDK. For details on the features and functions that each of these multiple-bonded GPIOs provide, refer to Table .
PAGE 14
CYBT-343052-02 Figure 9 illustrates the CYBT-343052-02 schematic. Figure 9. CYBT-343052-02 Schematic Diagram Document Number: 002-28053 Rev.
PAGE 15
CYBT-343052-02 Critical Components List Table 6 details the critical components used in the CYBT-343052-02 module. Table 6. Critical Component List Component Reference Designator Description Silicon U1 Silicon U2 8-pin TDF8N, 512K Serial Flash Crystal Y1 24.000 MHz, 12PF 60-pin QFN BT/BLE Silicon Device - CYW20735 Antenna Design Table 7 details trace antenna used in the CYBT-343052-02 module. For more information, see Table 7. Table 7.
PAGE 16
CYBT-343052-02 Functional Description Bluetooth Baseband Core The Bluetooth Baseband Core (BBC) implements all of the time-critical functions required for high-performance Bluetooth operation. The BBC manages the buffering, segmentation, and routing of data for all connections.
PAGE 17
CYBT-343052-02 Test Mode Support The CYBT-343052-02 fully supports the Bluetooth Test mode as described in Part I:1 of the Specification of the Bluetooth System Version 3.0. This includes the transmitter tests, normal and delayed loopback tests, and reduced hopping sequence. In addition to the standard Bluetooth Test Mode, the CYBT-343052-02 also supports enhanced testing features to simplify RF debugging and qualification and type-approval testing.
PAGE 18
CYBT-343052-02 External Reset (XRES) The CYBT-343052-02 has an integrated power-on reset circuit that completely resets all circuits to a known power-on state. An external active low reset signal, XRES, can be used to put the CYBT-343052-02 in the reset state. The XRES pin has an internal pull-up resistor and, in most applications, it does not require anything to be connected to it. Figure 10.
PAGE 19
CYBT-343052-02 Integrated Radio Transceiver The CYBT-343052-02 has an integrated radio transceiver that has been optimized for use in 2.4-GHz Bluetooth wireless systems. It has been designed to provide low-power, low-cost, robust communications for applications operating in the globally available 2.4-GHz unlicensed ISM band.
PAGE 20
CYBT-343052-02 Peripheral and Communication Interfaces I2C Communication Interface The CYBT-343052-02 provides a 2-pin master I2C interface, which can be used to retrieve configuration information from an external EEPROM or to communicate with peripherals such as track-ball or touch-pad modules, and motion tracking ICs used in mouse devices. This interface is compatible with I2C slave devices. I2C does not support multimaster capability or flexible wait-state insertion by either master or slave devices.
PAGE 21
CYBT-343052-02 Table 10 contains example values to generate common baud rates with a 48 MHz UART clock. Table 10. Common Baud Rate Examples, 48 MHz Clock Baud Rate (bps) High Rate Low Rate Mode Error (%) 6M 0xFF 0xF8 High rate 0 4M 0xFF 0xF4 High rate 0 3M 0x0 0xFF Normal 0 2M 0x44 0xFF Normal 0 1.5M 0x0 0xFE Normal 0 1M 0x0 0xFD Normal 0 921600 0x22 0xFD Normal 0.16 230400 0x0 0xF3 Normal 0.16 115200 0x1 0xE6 Normal –0.08 57600 0x1 0xCC Normal 0.
PAGE 22
CYBT-343052-02 Infrared Modulator The CYBT-343052-02 includes hardware support for infrared TX. The hardware can transmit both modulated and unmodulated waveforms. For modulated waveforms, hardware inserts the desired carrier frequency into all IR transmissions. IR TX can be sourced from firmware-supplied descriptors, a programmable bit, or the peripheral UART transmitter. If descriptors are used, they include IR on/off state and the duration between 1–32767/sec.
PAGE 23
CYBT-343052-02 Keyboard Scanner The keyboard scanner is designed to autonomously sample keys and store them into buffer registers without the need for the host microcontroller to intervene. The scanner has the following features: ■ Ability to turn off its clock if no keys are pressed. ■ Sequential scanning of up to 160 keys in an 8 × 20 matrix. ■ Programmable number of columns from 1 to 20. ■ Programmable number of rows from 1 to 8. ■ 16-byte key code buffer (can be augmented by firmware).
PAGE 24
CYBT-343052-02 Mouse Quadrature Signal Decoder The mouse signal decoder is designed to autonomously sample two quadrature signals commonly generated by an optomechanical mouse. The decoder has the following features: ■ Three pairs of inputs for X, Y, and Z (typical scroll wheel) axis signals. Each axis has two options: ❐ For the X axis, choose P2 or P32 as X0 and P3 or P33 as X1. ❐ For the Y axis, choose P4 or P34 as Y0 and P5 or P35 as Y1. ❐ For the Z axis, choose P6 or P36 as Z0 and P7 or P37 as Z1.
PAGE 25
CYBT-343052-02 Clock Frequencies The CYBT-343052-02 has an integrated 24-MHz crystal on the module. There is no need to add an additional crystal oscillator. GPIO Port GPIO ports for this device is shown in Table 4-2 on page 9. The CYBT-343052-02 uses 39 general-purpose I/Os (GPIOs). All GPIOs support programmable pull-ups and are capable of driving up to 8 mA at 3.3V or 4 mA at 1.8V, except P26, P27, P28, and P29, which are capable of driving up to 16 mA at 3.3V or 8 mA at 1.8V.
PAGE 26
CYBT-343052-02 Power Management Unit The Power Management Unit (PMU) provides power management features that can be invoked by software through power management registers or packet-handling in the baseband core. RF Power Management The BBC generates power-down control signals for the transmit path, receive path, PLL, and power amplifier to the 2.4-GHz transceiver, which then processes the power-down functions accordingly.
PAGE 27
CYBT-343052-02 Electrical Characteristics Table 11 shows the maximum electrical rating for voltages referenced to VDDIN pad. Table 11. Maximum Electrical Rating Rating VDDIN Voltage on input or output pin Operating ambient temperature range Storage temperature range Symbol – – Topr Tstg Value 3.795 VSS – 0.3 to VDD + 0.3 –30 to +85 –40 to +85 Unit V °C Table 12 shows the power supply characteristics for the range TJ = 0 to 125 °C. Table 12.
PAGE 28
CYBT-343052-02 Chipset RF Specifications All specifications in Table 15 are for industrial temperatures and are single-ended. Unused inputs are left open. Table 15. Receiver RF Specifications Parameter Min Typ1 Max Unit 2402 – 2480 MHz – – –91.5 – – GFSK, 1 Mbps – – –20 dBm dBm Conditions General Frequency range RX sensitivity 2 Maximum input – Interference Performance TBD Out-of-Band Blocking Performance (CW)3 30 MHz–2000 MHz 0.1% BER – –10.0 – 2000–2399 MHz 0.
PAGE 29
CYBT-343052-02 Table 16. Transmitter RF Specifications (TBD) Parameter Conditions Min Typ Max Unit – 2402 – 2480 MHz General Frequency range Class 1: GFSK TX power – – 10 – dBm Power control step – 2 4 8 dB 30 MHz to 1 GHz – – – –36.0[10] 1 GHz to 12.75 GHz – – – –30.0[11] 1.8 GHz to 1.9 GHz – – – –47.0 5.15 GHz to 5.3 GHz – – – –47.0 Conditions Min Typ Max Unit N/A 2402 – 2480 MHz Out-of-Band Spurious Emissions dBm Notes 10.
PAGE 30
CYBT-343052-02 Timing and AC Characteristics In this section, use the numbers listed in the Reference column of each table to interpret the following timing diagrams. UART Timing Table 18. UART Timing Specifications Reference Characteristics Min Max 1 Delay time, UART_CTS_N low to UART_TXD valid – 1.50 2 Setup time, UART_CTS_N high before midpoint of stop bit – 0.67 3 Delay time, midpoint of stop bit to UART_RTS_N high – 1.33 Unit Baud periods Figure 13.
PAGE 31
CYBT-343052-02 SPI Timing The SPI interface supports clock speeds up to 12 MHz Table 19 and Figure 14 show the timing requirements when operating in SPI Mode 0 and 2, and SPI Mode 1 and 3, respectively. Table 19.
PAGE 32
CYBT-343052-02 Table 20 and Figure 15 show the timing requirements when operating in SPI Mode 1 and 3. Table 20. SPI Mode 1 and 3 Reference 1 Min Max Time from master assert SPI_CSN to first clock edge Characteristics 45 – 2 Hold time for MOSI data lines 12 ½ SCK 3 Time from last sample on MOSI/MISO to slave deassert SPI_INT 0 100 4 Time from slave deassert SPI_INT to master deassert SPI_CSN 0 – 5 Idle time between subsequent SPI transactions 1 SCK – Unit ns Figure 15.
PAGE 33
CYBT-343052-02 I2C Interface Timing Table 21. I2C Interface Timing Specifications Reference Characteristics Min Max Unit 100 – 400 1 Clock frequency 2 START condition setup time 650 – 3 START condition hold time 280 – 4 Clock low time 650 – 5 Clock high time 280 – 6 Data input hold time[12] 0 – 7 Data input setup time 100 – 8 STOP condition setup time 280 – 9 Output valid from clock – 400 10 Bus free time[13] 650 – 800 kHz 1000 ns Notes 12.
PAGE 34
CYBT-343052-02 Table 22. Timing for I2S Transmitters and Receivers Transmitter Lower LImit Clock Period T Receiver Upper Limit Lower Limit Upper Limit Notes Min Max Min Max Min Max Min Max Ttr – – – Tr – – – 14 Master Mode: Clock generated by transmitter or receiver HIGH tHC 0.35Ttr – – – 0.35Ttr – – – 15 LOWtLC 0.35Ttr – – – 0.35Ttr – – – 15 Slave Mode: Clock accepted by transmitter or receiver HIGH tHC – 0.35Ttr – – – 0.35Ttr – – 16 LOW tLC – 0.
PAGE 35
CYBT-343052-02 Figure 17. I2S Transmitter Timing Figure 18. I2S Receiver Timing Document Number: 002-28053 Rev.
PAGE 36
CYBT-343052-02 Environmental Specifications Environmental Compliance This CYBT-343052-02 BLE module is produced in compliance with the Restriction of Hazardous Substances (RoHS) and Halogen-Free (HF) directives. The Cypress module and components used to produce this module are RoHS and HF compliant. RF Certification The CYBT-343052-02 module will be certified under the following RF certification standards at production release.
PAGE 37
CYBT-343052-02 Regulatory Information FCC FCC NOTICE: The device CYBT-343052-02 complies with Part 15 of the FCC Rules. The device meets the requirements for modular transmitter approval as detailed in FCC public Notice DA00-1407.transmitter Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation.
PAGE 38
CYBT-343052-02 ISED Innovation, Science and Economic Development Canada (ISED) Certification CYBT-343052-02 is licensed to meet the regulatory requirements of Innovation, Science and Economic Development Canada (ISED), License: IC: 7922A-3052 Manufacturers of mobile, fixed, or portable devices incorporating this module are advised to clarify any regulatory questions and ensure compliance for SAR and/or RF exposure limits. Users can obtain Canadian information on RF exposure and compliance from www.ic.gc.ca.
PAGE 39
CYBT-343052-02 European Declaration of Conformity Hereby, Cypress Semiconductor declares that the Bluetooth module CYBT-343052-02 complies with the essential requirements and other relevant provisions of Directive 2014.
PAGE 40
CYBT-343052-02 Packaging Table 24. Solder Reflow Peak Temperature Module Part Number Package CYBT-343052-02 42-pad SMT Maximum Peak Temperature Maximum Time at Peak Temperature No. of Cycles 260 °C 30 seconds 2 Table 25. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2 Module Part Number Package MSL CYBT-343052-02 24-pad SMT MSL 3 The CYBT-343052-02 is offered in tape and reel packaging. Figure 20 details the tape dimensions used for the CYBT-343052-02. Figure 20.
PAGE 41
CYBT-343052-02 Figure 22 details reel dimensions used for the CYBT-343052-02. Figure 22. Reel Dimensions The CYBT-343052-02 is designed to be used with pick-and-place equipment in an SMT manufacturing environment. The center-of-mass for the CYBT-343052-02 is detailed in Figure 23. Figure 23. CYBT-343052-02 Center of Mass Document Number: 002-28053 Rev.
PAGE 42
CYBT-343052-02 Ordering Information Table 26 lists the CYBT-343052-02 part number and features. Table 27 lists the reel shipment quantities for the CYBT-343052-02. Table 26. Ordering Information Part Number CPU Speed (MHz) CYBT-343052-02 96 Flash RAM Size (KB) Size (KB) 512 UART I2C (BSC) PWM Package Packaging Yes Yes 6 42-SMT Tape and Reel 384 Table 27.
PAGE 43
CYBT-343052-02 Acronyms Table 28.
PAGE 44
CYBT-343052-02 Table 28. Acronyms Used in this Document (continued) Acronym Description Acronym Description PAL programmable array logic, see also PLD SOF start of frame PC program counter S/H sample and hold PCB printed circuit board SINAD signal to noise and distortion ratio PGA programmable gain amplifier SIO special input/output, GPIO with advanced features. See GPIO.
PAGE 45
CYBT-343052-02 Document Conventions Units of Measure Table 29.
PAGE 46
CYBT-343052-02 Document History Page Document Title: CYBT-343052-02, EZ-BT WICED Module Document Number: 002-28053 Revision ** ECN Submission Date Description of Change 08/23/2019 Preliminary datasheet for CYBT-343052-02 module. Document Number: 002-28053 Rev.
PAGE 47
CYBT-343052-02 Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. PSoC® Solutions Products Arm® Cortex® Microcontrollers Automotive cypress.com/arm cypress.com/automotive Clocks & Buffers Interface cypress.com/clocks cypress.com/interface Internet of Things Memory cypress.com/iot cypress.