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Table Of Contents

PRELIMINARY

CYBT-343026-01

CYBT-343029-01

CYBT-143038-01

EZ-BT™ WICED Module

Cypress Semiconductor Corporation • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600

Document Number: 002-19525 Rev. ** Revised May 31, 2017

General Description

The CYBT-X430XX-01 is a fully integrated Bluetooth



Smart

Ready wireless module. The CYBT-X430XX-01 includes an

onboard crystal oscillator, passive components, flash memory,

and the Cypress CYW20706 silicon device. Refer to the

CYW20706 datasheet for additional details on the capabilities of

the silicon device used in this module.

The CYBT-X430XX-01 supports peripheral functions (ADC and

PWM), UART and USB communication, and a Bluetooth audio

interface. The CYBT-X430XX-01 includes a royalty-free BLE

stack compatible with Bluetooth 4.2 in a 12.0 × 15.5 × 1.95 mm

package.

The CYBT-343026-01 includes 512KB of onboard serial flash

memory and is designed for stand-alone opperation. The

CYBT-343029-01 has the same characterisitcs as the

CYBT-343026-01, but also include an on-board Apple

Authentication co-processor for use with Apple products such as

Homekit. The CYBT-143038-01 does not contain onboard flash,

requiring hosted control or application RAM upload operating

modes. The CYBT-143038-01 can also interface to external

flash on the host board. The CYBT-X430XX-01 utilizes an

integrated power amplifer to achieve Class I or Class II output

power capability.

The CYBT-X430XX-01 is fully qualified by Bluetooth SIG and is

targeted at applications requiring cost optimized BLE wireless

connectivity.

Module Description

n Module size: 12.00 mm × 15.50 mm × 1.95 mm

n Bluetooth LE 4.2 Smart Ready module

p QDID: WAP3026

p Declaration ID: 7922A-3026

n Certified to FCC, IC, MIC, and CE regulations

n Castelated solder pad connections for ease-of-use

n 512-KB on-module serial flash memory ( CYBT-34302X-01)

n Up to 10 GPIOs

n Temperature range: –30 °C to +85 °C

n Cortex-M3 32-bit processor

n Maximum TX output power:

p +12 dbm for Bluetooth EDR

p +9 dBm for Bluetooth Low Energy

n RX Receive Sensitivity:

p –93.5 dBm for Bluetooth Classic

p –96.5 dBm for Bluetooth Low Energy

Power Consumption

[1]

n TX average current consumption: 12.5 mA (EDR) Class-II

n RX average current consumption: 20.0 mA (EDR)

n Low power mode support

p Sleep: 120 uA

Functional Capabilities

n 10-bit auxiliary ADC with nine analog channels

n Serial Communications interface compatible with I2C slaves

n Serial Peripheral Interface (SPI) support for both master and

slave modes

n HCI interface through USB or UART

n PCM/I2S Auido interface

n 2-wire Global Coexistence Interface (GCI)

n Bluetooth wideband speech support

n Integrated peripherals such as PWM, ADC, Triac control

n Programmable output power control

n Maximum of 100 LE Connections

n Supports extended synchronous connections (eSCO), for

enhanced voice quality by allowing for retransmission of

dropped packets

Benefits

CYBT-X430XX-01 provides all necessary components required

to operate BLE and/or EDR/BR communication standards.

n Proven hardware design ready to use

n Dual-mode operatoin eliminates the need for multiple modules

n Cost optimized for applications without space constraints

n Non-volatile memory for self-sufficient operation and

Over-the-air updates ( CYBT-34302X-01 only)

n Bluetooth SIG Listed with QDID and Declaration ID

n Fully certified module eliminates the time needed for design,

development and certification processes

n WICED™ STUDIO 4.0 provides an easy-to-use integrated

design environment (IDE) to configure, develop, and program

a Bluetooth application

n Pre-programmed EZ-Serial firmware platform to allow for

easy-to-use out of the box Bluetooth connectivity

Notes

1. The values in this section were calculated for a 90% efficient DC-DC at 3V in HCI mode, and based on a Class I configurationbench-marked at Class II. Lower values

are expected for a class II configuration using an external LPO and corresponding PAconfiguration

Summary of content (49 pages)

PAGE 1
CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 PRELIMINARY EZ-BT™ WICED Module General Description Power Consumption[1] The CYBT-X430XX-01 is a fully integrated Bluetooth Smart Ready wireless module. The CYBT-X430XX-01 includes an onboard crystal oscillator, passive components, flash memory, and the Cypress CYW20706 silicon device. Refer to the CYW20706 datasheet for additional details on the capabilities of the silicon device used in this module. n TX average current consumption: 12.
PAGE 2
PRELIMINARY CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 More Information Cypress provides a wealth of data at www.cypress.com to help you to select the right module for your design, and to help you to quickly and effectively integrate the module into your design.
PAGE 3
PRELIMINARY Contents Overview............................................................................ 4 Functional Block Diagram ........................................... 4 Module Description...................................................... 4 Pad Connection Interface ................................................ 6 Recommended Host PCB Layout ................................... 7 Module Connections ........................................................
PAGE 4
CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 PRELIMINARY Overview Functional Block Diagram Figure 1 illustrates the CYBT-343026-01 functional block diagram. Figure 1. Functional Block Diagram Module Description The CYBT-X430XX-01 module is a complete module designed to be soldered to the applications main board. Module Dimensions and Drawing Cypress reserves the right to select components from various vendors to achieve the Bluetooth module functionality.
PAGE 5
PRELIMINARY CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 Figure 2. Module Mechanical Drawing Side View Top View (See Bottom View (Seen from Bottom) Notes 2. No metal should be located beneath or above the antenna area. Only bare PCB material should be located beneath the antenna area. For more information on recommended host PCB layout, see “Recommended Host PCB Layout” on page 7. 3. The CYBT-343026-01 includes castellated pad connections, denoted as the circular openings at the pad location above.
PAGE 6
CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 PRELIMINARY Pad Connection Interface As shown in the bottom view of Figure 2 on page 5, the CYBT-X430XX-01 connects to the host board via solder pads on the backside of the module. Table 2 and Figure 3 detail the solder pad length, width, and pitch dimensions of the CYBT-X430XX-01 module. Table 2. Connection Description Name Connections Connection Type Pad Length Dimension Pad Width Dimension Pad Pitch SP 24 Solder Pads 1.02 mm 0.71 mm 1.
PAGE 7
PRELIMINARY CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 Recommended Host PCB Layout Figure 5, Figure 6, Figure 7, and Table 3 provide details that can be used for the recommended host PCB layout pattern for the CYBT-X430XX-01. Dimensions are in millimeters unless otherwise noted. Pad length of 1.27 mm (0.635 mm from center of the pad on either side) shown in Figure 7 is the minimum recommended host pad length. The host PCB layout pattern can be completed using either Figure 5, Figure 6, or Figure 7.
PAGE 8
PRELIMINARY CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 Table 3 provides the center location for each solder pad on the CYBT-X430XX-01. All dimensions reference the to the center of the solder pad. Refer to Figure 6 for the location of each module solder pad. Table 3. Module Solder Pad Location Figure 7. Solder Pad Reference Location Solder Pad (Center of Pad) Location (X,Y) from Orign (mm) Dimension from Orign (mils) 1 (0.38, 5.04) (14.96, 198.42) 2 (0.38, 6.26) (14.96, 246.46) 3 (0.38, 7.
PAGE 9
CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 PRELIMINARY Module Connections Table 4 and Table 5 detail the solder pad connection definitions and available functions for the pad connections for the CYBT-34302X-01 and CYBT-143038-01 respectively. Table 4 and Table 5 lists the solder pads on the CYBT-X430XX-01 modules, the silicon device pin, and denotes what functions are available for each solder pad. The CYBT-343026-01 and CYBT-343029-01 share a common footprint. Table 4.
PAGE 10
CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 PRELIMINARY Table 5.
PAGE 11
PRELIMINARY CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 Connections and Optional External Components Power Connections (VDDIN) The CYBT-X430XX-01 contains one power supply connection, VDDIN. VDDIN accepts a supply input range of 2.3 V to 3.6 V for CYBT-34302X-01 and 1.62 V to 3.6 V for the CYBT-143038-01. Table 12 provides this specification. The maximum power supply ripple for this power connection is 100 mV, as shown in Table 12.
PAGE 12
PRELIMINARY CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 Figure 8 illustrates the CYBT-343026-01 schematic. Figure 8. CYBT-343026-01 Schematic Diagram Document Number: 002-19525 Rev.
PAGE 13
CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 PRELIMINARY Critical Components List Table 6 details the critical components used in the CYBT-X430XX-01 module. Table 6. Critical Component List Component Reference Designator Description Silicon U1 49-pin FBGA BT/BLE Silicon Device - CYW20706 Silicon U2 8-pin TDF8N, 512KSerial Flash ( CYBT-34302X-01) Crystal Y1 24.000 MHz, 12PF Antenna Design Table 7 details trace antenna used in the CYBT-X430XX-01 module. For more information, see Table 7. Table 7.
PAGE 14
PRELIMINARY CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 Bluetooth Baseband Core The Bluetooth Baseband Core (BBC) implements all of the time-critical functions required for high-performance Bluetooth operation. The BBC manages the buffering, segmentation, and routing of data for all connections.
PAGE 15
PRELIMINARY CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 Test Mode Support The CYBT-X430XX-01 fully supports Bluetooth Test mode as described in Part I:1 of the Specification of the Bluetooth System Version 3.0. This includes the transmitter tests, normal and delayed loopback tests, and reduced hopping sequence. In addition to the standard Bluetooth Test Mode, the CYBT-X430XX-01also supports enhanced testing features to simplify RF debugging and qualification and type-approval testing.
PAGE 16
PRELIMINARY CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 Microprocessor Unit The microprocessor unit in CYBT-X430XX-01 runs software from the link control (LC) layer up to the host controller interface (HCI). The microprocessor is based on the Cortex-M3 32-bit RISC processor with embedded ICE-RT debug and JTAG interface units. The microprocessor also includes 848 KB of ROM memory for program storage and boot ROM, 352 KB of RAM for data scratch-pad, and patch RAM code.
PAGE 17
PRELIMINARY CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 External Reset (XRES) The CYBT-X430XX-01 has an integrated power-on reset circuit that completely resets all circuits to a known power-on state. An external active low reset signal, XRES, can be used to put the CYBT-X430XX-01 in the reset state. The XRES pin has an internal pull-up resistor and, in most applications, it does not require that anything be connected to it. Figure 9.
PAGE 18
PRELIMINARY CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 Integrated Radio Transceiver The CYBT-X430XX-01 has an integrated radio transceiver that has been optimized for use in 2.4 GHz Bluetooth wireless systems. It has been designed to provide low-power, low-cost, robust communications for applications operating in the globally available 2.4 GHz unlicensed ISM band.
PAGE 19
PRELIMINARY CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 Internal LDO The microprocessor in CYBT-X430XX-01 uses two LDOs - one for 1.2V and the other for 2.5V. The 1.2V LDO provides power to the baseband and radio and the 2.5V LDO powers the PA. Collaborative Coexistence The CYBT-X430XX-01 provides extensions and collaborative coexistence to the standard Bluetooth AFH for direct communication with WLAN devices.
PAGE 20
CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 PRELIMINARY UART Interface The UART physical interface is a standard, 4-wire interface (RX, TX, RTS, and CTS) with adjustable baud rates from 38400 bps to 6 Mbps. During initial boot, UART speeds may be limited to 750 kbps. The baud rate may be selected via a vendor-specific UART HCI command. The CYBT-X430XX-01 has a 1040-byte receive FIFO and a 1040-byte transmit FIFO to support enhanced data rates.
PAGE 21
CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 PRELIMINARY Peripheral UART Interface The CYBT-X430XX-01 has a second UART that may be used to interface to other peripherals. This peripheral UART is accessed through the optional I/O ports, which can be configured individually and separately for each functional pin as shown in Table 5 and Table 6. Table 10.
PAGE 22
PRELIMINARY CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 GPIO Port The CYBT-X430XX-01 has 24 general-purpose I/Os (GPIOs). All GPIOs support programmable pull-ups and are capable of driving up to 8 mA at 3.3V or 4 mA at 1.8V, except chip P26, P27, P28, and P29, which are capable of driving up to 16 mA at 3.3V or 8 mA at 1.8V.
PAGE 23
PRELIMINARY CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 Figure 11. PWM Block Diagram Triac Control/PWM The CYBT-X430XX-01 includes hardware support for zero-crossing detection and trigger control for up to two triacs (PAD 22/23). The CYBT-X430XX-01 detects zero-crossing on the AC zero detection line and uses that to provide a pulse that is offset from the zero crossing.
PAGE 24
PRELIMINARY CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 Host Controller Power Management Power is automatically managed by the firmware based on input device activity. As a power-saving task, the firmware controls the disabling of the on-chip regulator when in deep sleep (HIDOFF) mode. BBC Power Management There are several low-power operations for the BBC: n Physical layer packet handling turns RF on and off dynamically within packet TX and RX. n Bluetooth-specified low-power connection mode.
PAGE 25
CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 PRELIMINARY Electrical Characteristics Table 11 shows the maximum electrical rating for voltages referenced to VDD pin. Table 11. Maximum Electrical Rating Rating VDDIN Voltage on input or output pin Operating ambient temperature range Storage temperature range Symbol – – Topr Tstg Value 3.795 VSS – 0.3 to VDD + 0.3 –30 to +85 –40 to +125 Unit V V °C °C Maximum1 3.6 3.
PAGE 26
PRELIMINARY CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 Table 14. Bluetooth, BLE, BR and EDR Current Consumption, Class 1 Sniff Slave n 11.25 ms – 4.95 mA n 22.5 ms – 2.6 mA n 495.00 ms Based on one attempt and no timeout. 254 ?A n 1 Mbps Peak current level during the transmission of a basic-rate packet: GFSK output power = 10 dBm. 60.289 mA n EDR Peak current level during the transmission of a 2 or 3 Mbps rate packet. EDR output power = 8 dBm. 52.485 mA Remarks Typ.
PAGE 27
CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 PRELIMINARY RF Specifications All specifications in Table 16 are for industrial temperatures and are single-ended. Unused inputs are left open. Table 16. Receiver RF Specifications Parameter Conditions Minimum Typical 1 Maximum Unit 2402 – 2480 MHz – –93.5 – dBm General Frequency range – GFSK, 0.1% BER, 1 Mbps LE GFSK, 0.1% BER, 1 Mbps – –96.5 – dBm π/4-DQPSK, 0.01% BER, 2 Mbps – –95.5 – dBm 8-DPSK, 0.01% BER, 3 Mbps – –89.
PAGE 28
CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 PRELIMINARY Table 16.
PAGE 29
CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 PRELIMINARY Table 17.
PAGE 30
CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 PRELIMINARY Timing and AC Characteristics In this section, use the numbers listed in the Reference column of each table to interpret the following timing diagrams. UART Timing Table 19.
PAGE 31
CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 PRELIMINARY SPI Timing The SPI interface supports clock speeds up to 12 MHz Table 20 and Figure 13 show the timing requirements when operating in SPI Mode 0 and 2, and SPI Mode 1 and 3, respectively. Table 20.
PAGE 32
CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 PRELIMINARY Table 21.
PAGE 33
PRELIMINARY CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 BSC Interface Timing Table 22.
PAGE 34
CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 PRELIMINARY PCM Interface Timing Short Frame Sync, Master Mode Figure 16. PCM Timing Diagram (Short Frame Sync, Master Mode) Table 23. PCM Interface Timing Specifications (Short Frame Sync, Master Mode) Reference 1 Characteristics PCM bit clock frequency Minimum Typical Maximum Unit – – 20.0 MHz 2 PCM bit clock LOW 20.0 – – ns 3 PCM bit clock HIGH 20.0 – – ns 4 PCM_SYNC delay 0 – 5.7 ns 5 PCM_OUT delay –0.4 – 5.
PAGE 35
CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 PRELIMINARY Short Frame Sync, Slave Mode Figure 17. PCM Timing Diagram (Short Frame Sync, Slave Mode) Table 24.
PAGE 36
CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 PRELIMINARY Figure 18. PCM Timing Diagram (Long Frame Sync, Master Mode) Table 25.
PAGE 37
CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 PRELIMINARY Long Frame Sync, Slave Mode Figure 19. PCM Timing Diagram (Long Frame Sync, Slave Mode) Table 26.
PAGE 38
CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 PRELIMINARY I2S Interface Timing The I2S interface supports both master and slave modes. The I2S signals are: n I2S clock: I2S SCK n I2S Word Select: I2S WS n I2S Data Out: I2S SDO 2 nI S 2 Data In: I2S SDI I S SCK and I2S WS become outputs in master mode and inputs in slave mode, while I2S SDO always stays as an output.
PAGE 39
CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 PRELIMINARY Environmental Specifications Environmental Compliance This CYBT-X430XX-01 BLE module is produced in compliance with the Restriction of Hazardous Substances (RoHS) and Halogen-Free (HF) directives. The Cypress module and components used to produce this module are RoHS and HF compliant. RF Certification The CYBT-X430XX-01 module will be certified under the following RF certification standards at production release.
PAGE 40
PRELIMINARY CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 Regulatory Information FCC FCC NOTICE: The device CYBT-X430XX-01 complies with Part 15 of the FCC Rules. The device meets the requirements for modular transmitter approval as detailed in FCC public Notice DA00-1407.transmitter Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation.
PAGE 41
PRELIMINARY CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 ISED Innovation, Science and Economic Development Canada (ISED) Certification CYBT-X430XX-01 is licensed to meet the regulatory requirements of Innovation, Science and Economic Development Canada (ISED), License: ISED: 7922A-3026 Manufacturers of mobile, fixed or portable devices incorporating this module are advised to clarify any regulatory questions and ensure compliance for SAR and/or RF exposure limits.
PAGE 42
PRELIMINARY CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 European Declaration of Conformity Hereby, Cypress Semiconductor declares that the Bluetooth module CYBT-X430XX-01 complies with the essential requirements and other relevant provisions of Directive 2014.
PAGE 43
CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 PRELIMINARY Packaging Table 29. Solder Reflow Peak Temperature Module Part Number Package CYBT-X430XX-01 24-pad SMT Maximum Peak Temperature Maximum Time at Peak Temperature No. of Cycles 260 °C 30 seconds 2 Table 30. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2 Module Part Number Package MSL CYBT-X430XX-01 24-pad SMT MSL 3 The CYBT-X430XX-01 is offered in tape and reel packaging.
PAGE 44
PRELIMINARY CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 Figure 22 details reel dimensions used for the CYBT-X430XX-01. Figure 22. Reel Dimensions The CYBT-X430XX-01 is designed to be used with pick-and-place equipment in an SMT manufacturing environment. The center-of-mass for the CYBT-X430XX-01 is detailed in Figure 23. Figure 23. CYBT-X430XX-01 Center of Mass (TBD) Document Number: 002-19525 Rev.
PAGE 45
CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 PRELIMINARY Ordering Information Table 31 lists the CYBT-X430XX-01 part number and features. Table 32 lists the reel shipment quantities for the CYBT-X430XX-01. Table 31.
PAGE 46
PRELIMINARY CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 Acronyms Table 33.
PAGE 47
PRELIMINARY CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 Document Conventions Units of Measure Table 34. Units of Measure Symbol Unit of Measure °C degree Celsius kV kilovolt mA milliamperes mm millimeters mV millivolt μA μm microamperes MHz megahertz micrometers GHz gigahertz V volt Document Number: 002-19525 Rev.
PAGE 48
CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 PRELIMINARY Document History Page Document Title: CYBT-X430XX-01 EZ-BT™ WICED Module Document Number: 002-19525 Revision ECN ** PRELIMINARY Orig. of Submission Change Date DSO Document Number: 002-19525 Rev. ** Description of Change Preliminary datasheet for CYBT-X430XX-01 module.
PAGE 49
PRELIMINARY CYBT-343026-01 CYBT-343029-01 CYBT-143038-01 Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. PSoC® Solutions Products ARM® Cortex® Microcontrollers Automotive cypress.com/arm cypress.com/automotive Clocks & Buffers Interface cypress.com/clocks cypress.