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PRELIMINARY

CYBLE-013025-00

CYBLE-013030-00

EZ-BLE™ WICED Module

Cypress Semiconductor Corporation • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600

Document Number: 002-xxxxx Rev. ** Revised April 10, 2017

General Description

The CYBLE-0130XX-00 is a fully integrated Bluetooth



Low

Energy (BLE) wireless module solution. The CYBLE-0130XX-00

includes onboard crystal oscillator, passive components, flash

memory, and the Cypress CYW20737 silicon device. Refer to the

CYW20737 datasheet for additional details on the capabilities of

the silicon device used in this module.

The CYBLE-0130XX-00 supports a number of peripheral

functions (ADC and PWM), as well as UART serial

communication. The CYBLE-0130XX-00 includes a royalty-free

BLE stack compatible with Bluetooth 4.1 in a 14.5 × 19.2 ×

2.25mm package.

The CYBLE-013025-00 includes 128KB of onboard flash

memory and is designed to allow for self-sufficient opperation.

The CYBLE-013030-00 does not contain onboard flash,

providing maximum cost optimization and allowing for hosted

control or application RAM upload, or interface to external flash

on the host board.

The CYBLE-0130XX-00 is fully certified by Bluetooth SIG is

targeted at applications requiring cost optimized BLE wireless

connectivity. The CYBLE-0130XX-00 is footprint compatible

[1]

with the CYBLE-x120xx-00 module family.

Module Description

n Module size: 14.52 mm × 19.20 mm × 2.25 mm

n Bluetooth LE 4.1 single-mode module

p QDID: TBD

p Declaration ID: TBD

n Certified to FCC, IC, MIC, and CE regulations

n Castelated solder pad connections for ease-of-use

n 128-KB flash memory, 60-KB SRAM memory

n Up to 14 GPIOs configurable as open drain high/low,

pull-up/pull-down, HI-Z analog, HI-Z digital, or strong output

n Industrial temperature range: –30 °C to +85 °C

n Cortex-M3 32-bit processor

n Watchdog timer with dedicated internal low-speed oscillator

n Supports A4WP wireless charging

n Supports fRSA encryption/decryption and key exchange

mechanisms (up to 4 kbit)

n Supports NFC tag-based “tap-to-pair”

n Supports IR learning with built-in IR modulator

Power Consumption

n Maximum TX output power: +4.0 dbm

n RX Receive Sensitivity: –94 dbm

n Received signal strength indicator (RSSI) with 1-dB resolution

n TX current consumption: 9.1 mA

n RX current consumption: 9.8 mA

n Cypress CYW20737 silicon low power mode support

p Sleep: 12 uA typical

p Deep Sleep: TBD

Functional Capabilities

n 10-bit auxiliary ADC with nine analog channels

n Serial Communications interface (compatible with Philips

I2C

slaves)

n Four dedicated PWM blocks

n BLE protocol stack supporting generic access profile (GAP)

Central, Peripheral, Observer, or Broadcaster roles

n Programmable output power control

Benefits

CYBLE-0130XX-00 provides all necessary components required

to operate BLE communication standards.

n Proven hardware design ready to use

n Cost optimized for applications without space constraints

n Non-volatile memory for complex application development

n Over-the-air update capable for in-field updates

n Bluetooth SIG qualified with QDID and Declaration ID

n Fully certified module eliminates the time needed for design,

development and certification processes

n WICED™ SMART provides an easy-to-use integrated design

environment (IDE) to configure, develop, and program a BLE

application

Notes

1. CYBLE-0130XX-00 global connections (Power, Ground, XRES, etc) are pad compatible with the CYBLE-x120xx-00 family of modules. Available GPIO and functions

may not be 100% compatible with your design. A review of the pad location and function within your design should be complete to determine if the CYBLE-0130XX-00

is completely pad-compatible to the CYBLE-x120xx-00 modules.

Summary of content (42 pages)

PAGE 1
CYBLE-013025-00 CYBLE-013030-00 PRELIMINARY EZ-BLE™ WICED Module General Description Power Consumption The CYBLE-0130XX-00 is a fully integrated Bluetooth Low Energy (BLE) wireless module solution. The CYBLE-0130XX-00 includes onboard crystal oscillator, passive components, flash memory, and the Cypress CYW20737 silicon device. Refer to the CYW20737 datasheet for additional details on the capabilities of the silicon device used in this module. n Maximum TX output power: +4.
PAGE 2
PRELIMINARY Contents Overview............................................................................ 3 Functional Block Diagram ........................................... 3 Module Description...................................................... 3 Pad Connection Interface ................................................ 5 Recommended Host PCB Layout ................................... 6 Module Connections ........................................................
PAGE 3
CYBLE-013025-00 CYBLE-013030-00 PRELIMINARY Overview Functional Block Diagram Figure 1 illustrates the CYBLE-0130XX-00 functional block diagram. Figure 1. Functional Block Diagram Module Description The CYBLE-0130XX-00 module is a complete module designed to be soldered to the applications main board. Module Dimensions and Drawing Cypress reserves the right to select components from various vendors to achieve the Bluetooth module functionality.
PAGE 4
PRELIMINARY CYBLE-013025-00 CYBLE-013030-00 Figure 2. Module Mechanical Drawing Top View (See from Top) Side View Bottom View (Seen from Bottom) Notes 2. No metal should be located beneath or above the antenna area. Only bare PCB material should be located beneath the antenna area. For more information on recommended host PCB layout, see “Recommended Host PCB Layout” on page 6. 3. The CYBLE-0130XX-00 includes castellated pad connections, denoted as the circular openings at the pad location above.
PAGE 5
CYBLE-013025-00 CYBLE-013030-00 PRELIMINARY Pad Connection Interface As shown in the bottom view of Figure 2 on page 4, the CYBLE-0130XX-00 connects to the host board via solder pads on the backside of the module. Table 2 and Figure 3 detail the solder pad length, width, and pitch dimensions of the CYBLE-0130XX-00 module. Table 2. Connection Description Name Connections Connection Type Pad Length Dimension Pad Width Dimension Pad Pitch SP 31 Solder Pads 1.02 mm 0.71 mm 1.27 mm Figure 3.
PAGE 6
PRELIMINARY CYBLE-013025-00 CYBLE-013030-00 Recommended Host PCB Layout Figure 5, Figure 6, Figure 7, and Table 3 provide details that can be used for the recommended host PCB layout pattern for the CYBLE-0130XX-00. Dimensions are in millimeters unless otherwise noted. Pad length of 1.27 mm (0.635 mm from center of the pad on either side) shown in Figure 7 is the minimum recommended host pad length. The host PCB layout pattern can be completed using either Figure 5, Figure 6, or Figure 7.
PAGE 7
PRELIMINARY CYBLE-013025-00 CYBLE-013030-00 Table 3 provides the center location for each solder pad on the CYBLE-0130XX-00. All dimensions reference the to the center of the solder pad. Refer to Figure 6 for the location of each module solder pad. Table 3. Module Solder Pad Location Figure 7. Solder Pad Reference Location Solder Pad (Center of Pad) Location (X,Y) from Orign (mm) Dimension from Orign (mils) 1 (0.39, 4.88) (15.35, 192.13) 2 (0.39, 6.15) (15.35, 242.13) 3 (0.39, 7.42) (15.
PAGE 8
CYBLE-013025-00 CYBLE-013030-00 PRELIMINARY Module Connections Table 4 and Table 5 detail the solder pad connection definitions and available functions for the pad connections for the CYBLE-013025-00 and CYBLE-013030-00 respectively. Table 4 and Table 5 lists the solder pads on the CYBLE-0130XX-00 modules, the silicon device pin, and denotes what functions are available for each solder pad. Table 4.
PAGE 9
CYBLE-013025-00 CYBLE-013030-00 PRELIMINARY Table 5. CYBLE-013030-00 Solder Pad Connection Definitions Pad Number Pad Name UART/SPI/I2C PWM GPIO Other Function 1 XRES Power Supply Input (3.
PAGE 10
PRELIMINARY CYBLE-013025-00 CYBLE-013030-00 Connections and Optional External Components Power Connections (VDD) The CYBLE-0130XX-00 contains one power supply connection, VDD. VDD accepts a supply input range of 2.3V to 3.6 V. Table 14 provides this specification. The maximum power supply ripple for this power connection is 100 mV, as shown in Table 14. External Reset (XRES) The CYBLE-0130XX-00 has an integrated power-on reset circuit which completely resets all circuits to a known power on state.
PAGE 11
PRELIMINARY CYBLE-013025-00 CYBLE-013030-00 Figure 8 illustrates the CYBLE-0130XX-00 schematic. Figure 8. CYBLE-0130XX-00 Schematic Diagram Document Number: 002-xxxxx Rev.
PAGE 12
CYBLE-013025-00 CYBLE-013030-00 PRELIMINARY Critical Components List Table 6 details the critical components used in the CYBLE-0130XX-00 module. Table 6. Critical Component List Component Reference Designator Description Silicon U1 32-pin QFN BLE Silicon Device - CYW20737r Silicon U2 8-pin TDF8N, 128KSerial Flash Crystal Y1 24.000 MHz, 12PF Antenna Design Table 7 details trace antenna used in the CYBLE-0130XX-00 module. For more information, see Table 7. Table 7.
PAGE 13
PRELIMINARY CYBLE-013025-00 CYBLE-013030-00 Bluetooth Baseband Core The Bluetooth Baseband Core (BBC) implements all of the time-critical functions required for high performance Bluetooth operation. The BBC manages the buffering, segmentation, and data routing for all connections.
PAGE 14
PRELIMINARY CYBLE-013025-00 CYBLE-013030-00 Bluetooth Low Energy Profiles The CYBLE-0130XX-00 supports Bluetooth low energy, including the following profiles that are supported[4] in ROM: n Battery status n Blood pressure monitor n Find me n Heart rate monitor n Proximity n Thermometer n Weight scale n Time n Alliance for Wireless Power (A4WP) wireless charging n Automation profile n Support for secure OTA The following additional profiles can be supported[4] from RAM: n Blood gluco
PAGE 15
PRELIMINARY CYBLE-013025-00 CYBLE-013030-00 Figure 9. Infrared TX Infrared Learning The CYBLE-0130XX-00 includes hardware support for infrared learning. The hardware can detect both modulated and unmodulated signals. For modulated signals, the CYBLE-0130XX-00 can detect carrier frequencies between 10 kHz~500 kHz and the duration that the signal is present or absent. The CYBLE-0130XX-00 firmware driver supports further analysis and compression of learned signal.
PAGE 16
PRELIMINARY CYBLE-013025-00 CYBLE-013030-00 Wireless Charging The CYBLE-0130XX-00 includes support for wireless charging in hardware, software, and firmware. It supports the protocol for implementing wireless charging solutions based on the specifications written by the Alliance for Wireless Power (A4WP). The A4WP protocol is embedded in the CYBLE-0130XX-00.
PAGE 17
PRELIMINARY CYBLE-013025-00 CYBLE-013030-00 ADC Port The CYBLE-0130XX-00 contains a 16-bit ADC (effective number of bits is 10). Additionally: n n There are 9 analog input channels in the 32-pin package The following GPIOs can be used as ADC inputs: P0 p P1 p P8/P33 (select only one) p P11 on P11/P27 pin p P12 on P12/28 pin p P13/P28 (select only one) p P14/P38 (select only one) p P15 p P32 p n The conversion time is 10 us.
PAGE 18
CYBLE-013025-00 CYBLE-013030-00 PRELIMINARY Serial Peripheral Interface The CYBLE-0130XX-00 has two independent SPI interfaces. One is a master-only interface and the other can be either a master or a slave. Each interface has a 16-byte transmit buffer and a 16-byte receive buffer. To support more flexibility for user applications, the CYBLE-0130XX-00 has optional I/O ports that can be configured individually and separately for each functional pin as shown in Table 9, Table 10, and Table 11.
PAGE 19
PRELIMINARY CYBLE-013025-00 CYBLE-013030-00 Internal Reset Figure 11. Internal Reset Timing External Reset (XRES) The CYBLE-0130XX-00 has an integrated power-on reset circuit that completely resets all circuits to a known power-on state. An external active low reset signal, XRES, can be used to put the CYBLE-0130XX-00 in the reset state. The XRES pin has an internal pull-up resistor and, in most applications, it does not require that anything be connected to it.
PAGE 20
PRELIMINARY CYBLE-013025-00 CYBLE-013030-00 Integrated Radio Transceiver The CYBLE-0130XX-00 has an integrated radio transceiver that is optimized for 2.4 GHz Bluetooth wireless systems. It has been designed to provide low power, low cost, and robust communications for applications operating in the globally available 2.4 GHz unlicensed ISM band. It is fully compliant with Bluetooth Radio Specification 4.1 and meets or exceeds the requirements to provide the highest communication link quality of service.
PAGE 21
PRELIMINARY CYBLE-013025-00 CYBLE-013030-00 Peripheral Transport Unit Broadcom Serial Communications Interface The CYBLE-0130XX-00 provides a 2-pin master BSC interface, which can be used to retrieve configuration information from an external EEPROM or to communicate with peripherals such as track-ball or touch-pad modules, and motion tracking ICs used in mouse devices. The BSC interface is compatible with I2C slave devices.
PAGE 22
CYBLE-013025-00 CYBLE-013030-00 PRELIMINARY Figure 13. 32 kHz Oscillator Block Diagram Table 12. XTAL Oscillator Characteristics Parameter Symbol Conditions Minimum Typical Maximum Unit Output frequency Foscout – – 32.768 – kHz Frequency tolerance – Crystal dependent – 100 – ppm Start-up time Tstartup – – – 500 ms XTAL drive level Pdrv For crystal selection 0.
PAGE 23
PRELIMINARY CYBLE-013025-00 CYBLE-013030-00 PWM The CYBLE-0130XX-00 has four PWMs. The PWM module consists of the following: n PWM0-3 n The following GPIOs can be mapped as PWMs: p . P26 p . P27 p . P14/P28 (Dual bonded, only one of two is available.) p . P13 on P13/28 n PWM0–3.
PAGE 24
PRELIMINARY CYBLE-013025-00 CYBLE-013030-00 Power Management Unit The Power Management Unit (PMU) provides power management features that can be invoked by software through power management registers or packet-handling in the baseband core. RF Power Management The BBC generates power-down control signals for the transmit path, receive path, PLL, and power amplifier to the 2.4 GHz transceiver, which then processes the power-down functions accordingly.
PAGE 25
CYBLE-013025-00 CYBLE-013030-00 PRELIMINARY Electrical Characteristics Table 13 shows the maximum electrical rating for voltages referenced to VDD pin. Table 13. Maximum Electrical Rating Rating VDD Voltage on input or output pin Operating ambient temperature range Storage temperature range Symbol – – Topr Tstg Value 3.8 VSS – 0.3 to VDD + 0.3 –30 to +85 –40 to +125 Unit V V °C °C Maximuma 3.6 100 Unit V mV Table 14 shows the power supply characteristics for the range TJ = 0 to 125×C. Table 14.
PAGE 26
CYBLE-013025-00 CYBLE-013030-00 PRELIMINARY 1. LSBs are expressed at the 10-bit level. Table 16 shows the specifications for the digital voltage levels. Table 16. Digital Levels1 Characteristics Symbol Min Typ Max Unit Input low voltage VIL – Input high voltage VIH 0.75 × VDDO – Input low voltage (VDDO = 1.62V) VIL – – 0.4 V Input high voltage (VDDO = 1.62V) VIH 1.2 – – V Output low voltage2 VOL – – 0.4 V Output high voltage2 VOH VDDO – 0.
PAGE 27
CYBLE-013025-00 CYBLE-013030-00 PRELIMINARY Table 17 shows the specifications for current consumption. Table 17. Current Consumption1 Operational Mode Conditions Typ Max Unit Receive Receiver and baseband are both operating, 100% ON. 9.8 10.0 mA Transmit Transmitter and baseband are both operating, 100% ON. 9.1 9.3 mA Sleep Internal LPO is in use. 12.0 13.0 µA – 0.65 – 1. Currents measured between power terminals (Vdd) using 90% efficient DC-DC converter at 3V. Table 18.
PAGE 28
CYBLE-013025-00 CYBLE-013030-00 PRELIMINARY RF Specifications Table 19. Receiver RF Specifications Parameter Mode and Conditions Min Typ Max Unit Receiver Section1 Frequency range – 2402 – 2480 MHz RX sensitivity (standard) 0.1%BER, 1 Mbps – –94 – dBm RX sensitivity (low current) – –91.5 – dBm – –16 – – dBm – –10 – – dBm C/I cochannel 0.1%BER – – 21 dB C/I 1 MHz adjacent channel 0.1%BER – – 15 dB C/I 2 MHz adjacent channel 0.
PAGE 29
CYBLE-013025-00 CYBLE-013030-00 PRELIMINARY Table 20. Transmitter RF Specifications (continued) Parameter Minimum Typical Maximum Unit 30 MHz to 1 GHz – – –36.0 dBm 1 GHz to 12.75 GHz – – –30.0 dBm 1.8 GHz to 1.9 GHz – – –47.0 dBm 5.15 GHz to 5.3 GHz – – –47.
PAGE 30
CYBLE-013025-00 CYBLE-013030-00 PRELIMINARY Timing and AC Characteristics In this section, use the numbers listed in the Reference column of each table to interpret the following timing diagrams. UART Timing Table 21.
PAGE 31
PRELIMINARY CYBLE-013025-00 CYBLE-013030-00 Figure 16. SPI Timing – Mode 0 and 2 Figure 17. SPI Timing – Mode 1 and 3 BSC Interface Timing Table 23. BSC Interface Timing Specifications Reference 1 Characteristics Clock frequency Min – Max 100 Unit kHz 400 800 1000 2 START condition setup time 650 – ns 3 START condition hold time 280 – ns 4 Clock low time 650 – ns 5 Clock high time 280 – ns 0 – ns 6 Data input hold Document Number: 002-xxxxx Rev.
PAGE 32
PRELIMINARY CYBLE-013025-00 CYBLE-013030-00 Table 23. BSC Interface Timing Specifications Reference Characteristics Min Max Unit 7 Data input setup time 100 – ns 8 STOP condition setup time 280 – ns 9 Output valid from clock – 400 ns 10 Bus free time2 650 – ns 1. As a transmitter, 300 ns of delay is provided to bridge the undefined region of the falling edge of SCL to avoid unintended generation of START or STOP conditions. 2.
PAGE 33
CYBLE-013025-00 CYBLE-013030-00 PRELIMINARY Environmental Specifications Environmental Compliance This Cypress BLE module is produced in compliance with the Restriction of Hazardous Substances (RoHS) and Halogen-Free (HF) directives. The Cypress module and components used to produce this module are RoHS and HF compliant. RF Certification The CYBLE-0130XX-00 module will be certified under the following RF certification standards at production release.
PAGE 34
PRELIMINARY CYBLE-013025-00 CYBLE-013030-00 Regulatory Information FCC FCC NOTICE: The device CYBLE-0130XX-00 complies with Part 15 of the FCC Rules. The device meets the requirements for modular transmitter approval as detailed in FCC public Notice DA00-1407.transmitter Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation.
PAGE 35
PRELIMINARY CYBLE-013025-00 CYBLE-013030-00 Industry Canada (IC) Certification CYBLE-0130XX-00 is licensed to meet the regulatory requirements of Industry Canada (IC), License: IC: 7922A-3025 Manufacturers of mobile, fixed or portable devices incorporating this module are advised to clarify any regulatory questions and ensure compliance for SAR and/or RF exposure limits. Users can obtain Canadian information on RF exposure and compliance from www.ic.gc.ca.
PAGE 36
PRELIMINARY CYBLE-013025-00 CYBLE-013030-00 MIC Japan CYBLE-0130XX-00 is certified as a module with type certification number TBD. End products that integrate CYBLE-013025-00 do not need additional MIC Japan certification for the end product. End product can display the certification label of the embedded module. Document Number: 002-xxxxx Rev.
PAGE 37
CYBLE-013025-00 CYBLE-013030-00 PRELIMINARY Packaging Table 25. Solder Reflow Peak Temperature Module Part Number Package CYBLE-0130XX-00 14-pad SMT Maximum Peak Temperature Maximum Time at Peak Temperature No. of Cycles 260 °C 30 seconds 2 Table 26. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2 Module Part Number Package MSL CYBLE-0130XX-00 31-pad SMT MSL 3 The CYBLE-0130XX-00 is offered in tape and reel packaging.
PAGE 38
PRELIMINARY CYBLE-013025-00 CYBLE-013030-00 Figure 21 details reel dimensions used for the CYBLE-0130XX-00. Figure 21. Reel Dimensions The CYBLE-0130XX-00 is designed to be used with pick-and-place equipment in an SMT manufacturing environment. The center-of-mass for the CYBLE-0130XX-00 is detailed in Figure 22. Figure 22. CYBLE-0130XX-00 Center of Mass (TBD) Document Number: 002-xxxxx Rev.
PAGE 39
CYBLE-013025-00 CYBLE-013030-00 PRELIMINARY Ordering Information Table 27 lists the CYBLE-0130XX-00 part number and features. Table 28 lists the reel shipment quantities for the CYBLE-0130XX-00. Table 27. Ordering Information Part Number CPU Speed (MHz) CYBLE-013025-00 24 128 CYBLE-013030-00 24 – Flash RAM Size (KB) Size (KB) UART BSC (I2C) PWM Package Packaging 60 Yes Yes 4 31-SMT Tape and Reel 60 Yes Yes 4 31-SMT Tape and Reel Table 28.
PAGE 40
CYBLE-013025-00 CYBLE-013030-00 PRELIMINARY Acronyms Document Conventions Table 29. Acronyms Used in this Document Units of Measure Acronym BLE Description Table 30.
PAGE 41
PRELIMINARY CYBLE-013025-00 CYBLE-013030-00 Document History Page Document Title: CYBLE-0130XX-00 EZ-BLE™ WICED Module Document Number: 002-XXXXX Revision ECN ** PRELIMINARY Orig. of Submission Change Date DSO Document Number: 002-xxxxx Rev. ** Description of Change Preliminary datasheet for CYBLE-0130XX-00 module.
PAGE 42
PRELIMINARY CYBLE-013025-00 CYBLE-013030-00 Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. PSoC® Solutions Products ARM® Cortex® Microcontrollers Automotive cypress.com/arm cypress.com/automotive Clocks & Buffers Interface Internet of Things Memory cypress.com/clocks cypress.