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PRELIMINARY

CYBLE-212019-00

EZ-BLE

PRoC

Module

Cypress Semiconductor Corporation 198 Champion Court San Jose, CA 95134-1709 408-943-2600

Document Number: 002-09764 Rev. **

Revised November 4, 2015

General Description

The CYBLE-212019-00 is a turnkey Bluetooth



Low Energy

(BLE) wireless module solution and includes onboard crystal

oscillators, trace antenna, passive components, and the Cypress

PRoC™ BLE 256KB chip. Refer to the CYBL10X7X datasheet

for additional details on the capabilities of the PRoC BLE device

used on this module.

The CYBLE-212019-00 supports a number of peripheral

functions (ADC, timers, counters, PWM) and serial

communication protocols (I

C, UART, SPI) through its

programmable architecture. The CYBLE-212019-00 includes a

royalty-free BLE stack compatible with Bluetooth 4.1 and

provides up to 23 GPIOs in a 14.52 × 19.20 × 2.00 mm package.

The CYBLE-212019-00 is drop-in compatible with the

CYBLE-012011-00.

The CYBLE-212019-00 is fully certified by Bluetooth SIG and is

targeted at applications requiring large memory size and

cost-optimized BLE wireless connectivity.

Module Description

n Module size: 14.52 mm ×19.20 mm × 2.00 mm (with shield)

n Castelated solder pad connections for ease-of-use

n Bluetooth 4.1 single-mode module

n Industrial temperature range: –40 °C to +85 °C

n 32-bit processor (0.9 DMIPS/MHz) with single-cycle 32-bit

multiply, operating at up to 48 MHz

n 256-KB flash memory, 32-KB SRAM memory

n Watchdog timer with dedicated internal low-speed oscillator

(ILO)

n Two-pin SWD for programming

n Up to 23 GPIOs configurable as open drain high/low,

pull-up/pull-down, HI-Z analog, HI-Z digial, or strong output

n Certified to FCC, IC, CE, MIC and KC regulations

n Bluetooth SIG 4.1 qualified

p QDID: TBD

p Declaration ID: TBD

Power Consumption

n TX output power: –18 dbm to +3 dbm

n Received signal strength indicator (RSSI) with 1-dB resolution

n TX current consumption of 15.6 mA (radio only, 0 dbm)

n RX current consumption of 16.4 mA (radio only)

n Low power mode support

p Deep Sleep: 1.3 µA with watch crystal oscillator (WCO) on

p Hibernate: 150 nA with SRAM retention

p Stop: 60 nA with XRES wakeup

Functional Capabilities

n Up to 22 capacitive sensors for buttons or sliders with

best-in-class signal-to-noise ration (SNR) and liquid tolerance

n 12-bit, 1-Msps SAR ADC with internal reference,

sample-and-hold (S/H), and channel sequencer

n Two serial communication blocks (SCBs) supporting I

(master/slave), SPI (master/slave), or UART

n Four dedicated 16-bit timer, counter, or PWM blocks

(TCPWMs)

n LCD drive supported on all GPIOs (common or segment)

n Programmable low voltage detect (LVD) from 1.8 V to 4.5 V

n I

S master interface

n Bluetooth Low Energy protocol stack supporting generic

access profile (GAP) Central, Peripheral, Observer, or

Broadcaster roles

n Switches between Central and Peripheral roles on-the-go

n Standard Bluetooth Low Energy profiles and services for

interoperability

n Custom profile and service for specific use cases

Benefits

The CYBLE-212019-00 module is provided as a turnkey

solution, including all necessary hardware required to use BLE

communication standards.

n Proven hardware design ready to use

n Cost optimized for applications without space constraint

n Reprogrammable architecture

n Fully certified module eliminates the time needed for design,

development and certification processes

n Bluetooth SIG qualified with QDID and Declaration ID

n Flexible communication protocol support

n PSoC Creator™ provides an easy-to-use integrated design

environment (IDE) to configure, develop, program, and test a

BLE application

Summary of content (31 pages)

PAGE 1
PRELIMINARY CYBLE-212019-00 TM EZ-BLETM PRoC Module General Description The CYBLE-212019-00 is a turnkey Bluetooth Low Energy (BLE) wireless module solution and includes onboard crystal oscillators, trace antenna, passive components, and the Cypress PRoC™ BLE 256KB chip. Refer to the CYBL10X7X datasheet for additional details on the capabilities of the PRoC BLE device used on this module.
PAGE 2
CYBLE-212019-00 Contents Overview............................................................................ 3 Module Description...................................................... 3 Pad Connection Interface ................................................ 5 Recommended Host PCB Layout ................................... 6 Power Supply Connections and Recommended External Components...................................................................... 9 Connection Options................................
PAGE 3
CYBLE-212019-00 Overview Module Description The CYBLE-212019-00 module is a complete module designed to be soldered to the applications main board. Module Dimensions and Drawing Cypress reserves the right to select components (including the appropriate BLE device) from various vendors to achieve the BLE module functionality. Such selections will still guarantee that all height restrictions of the component area are maintained.
PAGE 4
CYBLE-212019-00 Figure 1. Module Mechanical Drawing Side View Top View Bottom View Note 1. No metal should be located beneath or above the antenna area. Only bare PCB material should be located beneath the antenna area. For more information on recommended host PCB layout, see Figure 3 and Figure 4 on page 6. Document Number: 002-09764 Rev.
PAGE 5
CYBLE-212019-00 Pad Connection Interface As shown in the bottom view of Figure 1 on page 4, the CYBLE-212019-00 connects to the host board via solder pads on the backside of the module. Table 2 and Figure 2 detail the solder pad length, width, and pitch dimensions of the CYBLE-212019-00 module. Table 2. Solder Pad Connection Description Name SP Connections Connection Type 31 Solder Pads Pad Length Dimension Pad Width Dimension Pad Pitch 1.02 mm 0.71 mm 1.27 mm Figure 2.
PAGE 6
CYBLE-212019-00 Recommended Host PCB Layout Figure 3 details the recommended PCB layout pattern for the host PCB. Figure 3. Recommended PCB Layout Pattern for CYBLE-212019-00 Module Top View (On Host PCB) To maximize RF performance, the host layout should follow these recommendations: 1. The ideal placement of the Cypress BLE module is in a corner of the host board with the trace antenna located at the far corner. This placement minimizes the additional recommended keep out area stated in item 2. 2.
PAGE 7
CYBLE-212019-00 Table 3 details the solder pad pitch (center-to-center) for each of the neighboring connections. Table 3. Module Solder Pad Connection Dimensions Pad X Pad Y Pad Pitch (Pad X - Pad Y) Comments Bottom Right Corner 1 4.88 mm Distance from Bottom Right Corner to Pad 1 center 1 2 1.27 mm Distance from Pad 1 center to Pad 2 center 2 3 1.27 mm Distance from Pad 2 center to Pad 3 center 3 4 1.27 mm Distance from Pad 3 center to Pad 4 center 4 5 1.
PAGE 8
CYBLE-212019-00 Table 4 details the solder pad connection definitions and available functions for each connection pad. Table 4 lists the solder pads on CYBLE-212019-00, the BLE device port-pin, and denotes whether the function shown is available for each solder pad. Each connection is configurable for a single option shown with a 3. Table 4. Solder Pad Connection Definitions Solder Pad Number Device Port Pin 1 XRES 2 P4.0[3] 3 P3.7 4 P3.6 5 P3.5 6 P3.4 7 P3.3 8 P3.2 9 P2.
PAGE 9
CYBLE-212019-00 Power Supply Connections and Recommended External Components Power Connections External Component Recommendation The CYBLE-212019-00 contains two power supply connections, VDD and VDDR. The VDD connection supplies power for both digital and analog device operation. The VDDR connection supplies power for the device radio. In either connection scenario, it is recommended to place an external ferrite bead between the supply and the module connection.
PAGE 10
CYBLE-212019-00 The CYBLE-212019-00 schematic is shown in Figure 7. Figure 7. CYBLE-212019-00 Schematic Diagram Document Number: 002-09764 Rev.
PAGE 11
CYBLE-212019-00 Critical Components List Table 5 details the critical components used in the CYBLE-212019-00 module. Table 5. Critical Component List Component Reference Designator Silicon U1 Description 56-pin QFN 256KB flash Programmable Radio-on-Chip (PRoC) with BLE Crystal Y1 24.000 MHz, 10PF Crystal Y2 32.768 kHz, 12.5PF Antenna Design Table 6 details trace antenna used in the CYBLE-212019-00 module. For more information, see Table 8. Table 6.
PAGE 12
CYBLE-212019-00 Electrical Specification Table 7 details the absolute maximum electrical characteristics for the Cypress BLE module. Table 7. CYBLE-212019-00 Absolute Maximum Ratings Parameter Description Min Typ Max Units Details/Conditions VDDD_ABS Analog, digital, or radio supply relative to VSS (VSSD = VSSA) –0.5 – 6 V Absolute maximum VCCD_ABS Direct digital core voltage input relative to VSSD –0.5 – 1.
PAGE 13
CYBLE-212019-00 Table 9. CYBLE-212019-00 DC Specifications (continued) Parameter IDD8 Description Execute from flash; CPU at 12 MHz Min Typ Max Units Details/Conditions – – – mA T = –40 °C to 85 °C IDD9 Execute from flash; CPU at 24 MHz – 7.1 – mA T = 25 °C, VDD = 3.3 V IDD10 Execute from flash; CPU at 24 MHz – – – mA T = –40 °C to 85 °C IDD11 Execute from flash; CPU at 48 MHz – 13.4 – mA T = 25 °C, VDD = 3.
PAGE 14
CYBLE-212019-00 Table 10. AC Specifications Parameter Description Min Typ Max Units DC – 48 MHz Wakeup from Sleep mode – 0 – µs Guaranteed by characterization TDEEPSLEEP Wakeup from Deep-Sleep mode – – 25 µs 24-MHz IMO. Guaranteed by characterization THIBERNATE Wakeup from Hibernate mode – – 2 ms Guaranteed by characterization TSTOP Wakeup from Stop mode – – 2 ms XRES wakeup FCPU CPU frequency TSLEEP Details/Conditions 1.71 V ≤ VDD ≤ 5.5 V GPIO Table 11.
PAGE 15
CYBLE-212019-00 Table 12. GPIO AC Specifications Parameter Description Min Typ Max Units Details/Conditions TRISEF Rise time in Fast-Strong mode 2 – 12 ns 3.3-V VDDD, CLOAD = 25 pF TFALLF Fall time in Fast-Strong mode 2 – 12 ns 3.3-V VDDD, CLOAD = 25 pF TRISES Rise time in Slow-Strong mode 10 – 60 ns 3.3-V VDDD, CLOAD = 25 pF TFALLS Fall time in Slow-Strong mode 10 – 60 ns 3.3-V VDDD, CLOAD = 25 pF FGPIOUT1 GPIO Fout; 3.3 V ≤ VDD ≤ 5.
PAGE 16
CYBLE-212019-00 Table 16. XRES AC Specifications Parameter TRESETWIDTH Description Min Typ Max Units Details/Conditions 1 – – µs – Reset pulse width Temperature Sensor Table 17. Temperature Sensor Specifications Parameter TSENSACC Description Temperature-sensor accuracy Min –5 Typ ±1 Max 5 Units °C Details/Conditions –40 to +85 °C Details/Conditions SAR ADC Table 18.
PAGE 17
CYBLE-212019-00 Table 19. SAR ADC AC Specifications (continued) Parameter Description Min Typ Max Units Details/ Conditions A_dnl Differential nonlinearity. VDD = 1.71 V to 5.5 V, 1 Msps –1 – 2.2 LSB VREF = 1 V to VDD A_DNL Differential nonlinearity. VDD = 1.71 V to 3.6 V, 1 Msps –1 – 2 LSB VREF = 1.71 V to VDD A_DNL Differential nonlinearity. VDD = 1.71 V to 5.5 V, 500 Ksps –1 – 2.
PAGE 18
CYBLE-212019-00 Digital Peripherals Timer Table 20. Timer DC Specifications Parameter ITIM1 Description Block current consumption at 3 MHz Min – Typ – Max 42 Units µA Details/Conditions 16-bit timer ITIM2 Block current consumption at 12 MHz – – 130 µA 16-bit timer ITIM3 Block current consumption at 48 MHz – – 535 µA 16-bit timer Min FCLK Typ – Max 48 Units MHz Table 21.
PAGE 19
CYBLE-212019-00 Pulse Width Modulation (PWM) Table 24. PWM DC Specifications Parameter Description Min Typ Max Units Details/Conditions IPWM1 Block current consumption at 3 MHz – – 42 µA 16-bit PWM IPWM2 Block current consumption at 12 MHz – – 130 µA 16-bit PWM IPWM3 Block current consumption at 48 MHz – – 535 µA 16-bit PWM Min Typ Max Units Table 25.
PAGE 20
CYBLE-212019-00 Serial Communication Table 28. Fixed I2C DC Specifications Parameter Description II2C1 Block current consumption at 100 kHz II2C2 Block current consumption at 400 kHz II2C3 Block current consumption at 1 Mbps 2 I C enabled in Deep-Sleep mode II2C4 Min Typ Max Units Details/Conditions – – 50 µA – – – 155 µA – – – 390 µA – – – 1.4 µA – Min Typ Max Units Details/Conditions – – 400 kHz Table 29.
PAGE 21
CYBLE-212019-00 Memory Table 36. Flash DC Specifications Parameter Description Min Typ Max Units Details/Conditions 1.71 – 5.5 V – Number of Wait states at 32–48 MHz 2 – – CPU execution from flash Number of Wait states at 16–32 MHz 1 – – CPU execution from flash Number of Wait states for 0–16 MHz 0 – – CPU execution from flash Min Typ Max VPE Erase and program voltage TWS48 TWS32 TWS16 Table 37.
PAGE 22
CYBLE-212019-00 Voltage Monitors (LVD) Table 42. Voltage Monitor DC Specifications Parameter VLVI1 Description LVI_A/D_SEL[3:0] = 0000b Min 1.71 Typ 1.75 Max 1.79 Units V Details/Conditions – VLVI2 LVI_A/D_SEL[3:0] = 0001b 1.76 1.80 1.85 V – VLVI3 LVI_A/D_SEL[3:0] = 0010b 1.85 1.90 1.95 V – VLVI4 LVI_A/D_SEL[3:0] = 0011b 1.95 2.00 2.05 V – VLVI5 LVI_A/D_SEL[3:0] = 0100b 2.05 2.10 2.15 V – VLVI6 LVI_A/D_SEL[3:0] = 0101b 2.15 2.20 2.
PAGE 23
CYBLE-212019-00 Internal Main Oscillator Table 45. IMO DC Specifications Parameter Description Min Typ Max Units Details/Conditions IIMO1 IMO operating current at 48 MHz – – 1000 µA – IIMO2 IMO operating current at 24 MHz – – 325 µA – IIMO3 IMO operating current at 12 MHz – – 225 µA – IIMO4 IMO operating current at 6 MHz – – 180 µA – IIMO5 IMO operating current at 3 MHz – – 150 µA – Table 46.
PAGE 24
CYBLE-212019-00 Environmental Specifications Environmental Compliance This Cypress BLE module is built in compliance with the Restriction of Hazardous Substances (RoHS) and Halogen Free (HF) directives. The Cypress module and components used to produce this module are RoHS and HF compliant. RF Certification The CYBLE-212019-00 module will be certified under the following RF certification standards at production release.
PAGE 25
CYBLE-212019-00 Regulatory Information FCC FCC NOTICE: The device CYBLE-212019-00 complies with Part 15 of the FCC Rules. The device meets the requirements for modular transmitter approval as detailed in FCC public Notice DA00-1407.transmitter Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation.
PAGE 26
CYBLE-212019-00 Industry Canada (IC) Certification CYBLE-212019-00 is licensed to meet the regulatory requirements of Industry Canada (IC), License: IC: 7922A-2011 Manufacturers of mobile, fixed or portable devices incorporating this module are advised to clarify any regulatory questions and ensure compliance for SAR and/or RF exposure limits. Users can obtain Canadian information on RF exposure and compliance from www.ic.gc.ca.
PAGE 27
CYBLE-212019-00 MIC Japan CYBLE-212019-00 is certified as a module with type certification number TBD. End products that integrate CYBLE-212019-00 do not need additional MIC Japan certification for the end product. End product can display the certification label of the embedded module. KC Korea CYBLE-212019-00 is certified for use in Korea with certificate number MSIP-CRM-Cyp-2011. Document Number: 002-09764 Rev.
PAGE 28
CYBLE-212019-00 Ordering Information The CYBLE-212019-00 is avialable in certified and uncertified options. The avialable part numbers and features are listed in the below table. Part Number CPU Speed (MHz) Flash Size (KB) CapSense CYBLE-212019-00 48 256 Yes SCB TCPWM 2 4 12-Bit SAR ADC I2S LCD Package Packing Shield 1 Msps Yes Yes 31-SMT Tape and Reel Yes Part Numbering Convention The part numbers are of the form CYBLE-ABCDEF-GH where the fields are defined as follows.
PAGE 29
CYBLE-212019-00 Acronyms Acronym Description BLE Bluetooth Low Energy Bluetooth SIG Bluetooth Special Interest Group CE European Conformity CSA Canadian Standards Association EMI electromagnetic interference ESD electrostatic discharge FCC Federal Communications Commission GPIO general-purpose input/output IC Industry Canada IDE integrated design environment KC Korea Certification MIC Ministry of Internal Affairs and Communications (Japan) PCB printed circuit board RX receive Q
PAGE 30
CYBLE-212019-00 Document History Page Document Title: CYBLE-212019-00 Bluetooth® Low Energy (BLE) Module Document Number: 002-09764 Revision ** ECN Orig. of Change Submission Date MINS 11/1/2015 Document Number: 002-09764 Rev. ** Description of Change Preliminary datasheet for CYBLE-212019-00 module.
PAGE 31
CYBLE-212019-00 Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. PSoC® Solutions Products Automotive Clocks & Buffers Interface Lighting & Power Control Memory cypress.com/go/automotive cypress.com/go/clocks cypress.com/go/interface cypress.com/go/powerpsoc cypress.