COMPANY CONFIDENTIAL Preliminary Datasheet HON HAI PRECISION IND. CO., LTD. No.2, 2nd Dong Huan Road, 10th YouSong lndustrial District, Longhua Town, Baoan, ShenZhen Tel: +86-755-28128988#29413 Fax: +86-755-28129800#64886 Revision Note BCM4356 Dual-Band 2x2 802.11ac and Bluetooth v4.1 Combo Module Project Name Foxconn Part No. Customer Model Name. M.2 Type1216 BCM4356 WLAN + BT Combo Module T77H566.
COMPANY CONFIDENTIAL Preliminary Datasheet Index 1. REVISION HISTORY ...................................................................................................................................................3 2. INTRODUCTION ..........................................................................................................................................................4 2.1 HARDWARE ARCHITECTURE ...............................................................................................
COMPANY CONFIDENTIAL Preliminary Datasheet 1. Revision History Date Change Note Author REV Note 2014-07-25 Initial release(draft) Robin Xu 0.1 2014-07-30 Add customer project code Robin Xu 0.2 2014-08-21 1.Update the block diagram and support BTv4.1 in section2 Robin Xu 0.3 2.Update the ME drawing in section3.1 3.Update the Recommended stencil aperture in setion3.4 2014-11-14 Update WiFi Transmit Output Power Ru-yan Li 0.4 2014-12-2 Add 3.7 RF port define Ru-yan Li 0.
COMPANY CONFIDENTIAL Preliminary Datasheet 2. Introduction Project Name: M.2 Type 1216 BCM4356 WLAN+BT Combo Module Project Number: T77H566.01 Form factor Host Interface PCB RF connector M.2 Type 1216 LGA WLAN: PCIe v2.0 BT: UART for data, PCM for audio 6-layer HDI design Two MHF-4 RF connectors on module This documentation describes the engineering requirements specification of this M.2 1216 type module. WLAN is compliant with IEEE 802.11 a/b/g/n and 2x2 IEEE 802.
COMPANY CONFIDENTIAL Preliminary Datasheet 2.2 Features This module supports the following features: IEEE 802.11a/b/g/n/ac dual-band 2x2 MIMO radio with virtual-simultaneous dual-band operation Bluetooth v4.1+EDR with integrated class1 PA Enhanced Bluetooth and WLAN coexistence performance WLAN PCIe module complies with PCI express base specification revision2.0 for x1 lane and power management base specification.
COMPANY CONFIDENTIAL Preliminary Datasheet 3. Mechanical Specification 3.1 Mechanical Drawing Typical module dimension (W x L): 12mmx16mm. Max Z-height is 1.53mm. Unit:mm 3.2 PCB stack 6 Layers, HDI, thickness:0.43mm +/-0.
COMPANY CONFIDENTIAL Preliminary Datasheet 3.3 Recommended LGA Land Pattern Unit: mm TOP VIEW Suggest use “solder-mask on pad” design for main-board to avoid the soldering short. 3.4 Recommended stencil aperture Remark: Red stencil layer Green (pad layer) Below is recommendation about respectively defined apertures as A,B,B`,C and C` Stencil thickness=0.12mm A=24*24 mil2 B=22*9 mil2 B`=24*9 mil2 Define space between apertures as D and E D=11mil E=19.5mil C=40*40 mil2 C`=29.5*29.
COMPANY CONFIDENTIAL Preliminary Datasheet 3.5 RF Connector Type The standard 2x2mm size RF receptacle connectors to be used in conjunction with the M.2 boards/modules Same RF Receptacle on module supports either 0.81mm or 1.13mm diameter cable Prefer to use 1.13mm diameter cable for lower cable loss 1.2mm max.
COMPANY CONFIDENTIAL Preliminary Datasheet 3.6 RF cable assembly notice 1> Mating/Unmating Jig We recommend to use below Jig for mating/Unmating RF cable 2> Mating method of RF cable Please push as gently as possible while mating plug with receptacle. (The force must be 30N Max.) 3.7 RF port define Main ANT for WiFi and BT, Aux ANT for WiFi.
COMPANY CONFIDENTIAL Preliminary Datasheet 4. LGA Pin-out Definition 4.
COMPANY CONFIDENTIAL Preliminary Datasheet 4.2 Pin definition Pin No. Pin Name Type Description Voltage 1-3, 7-16, 18,19,21, 22,25, 43-44,66, 67 4,5,72,73 24 NC - No connection - Conne cting No 3.3V BT_DEV_WAKE Power I 3.3V 1.8V Yes Yes 27 SUSCLK (32KHz) I 1.8V (Note1) Yes 28 WLAN_RFDISAB LE_L I 1.8V (Note2) No 29 PCIE_PME_L OD 1.8V Yes 30 PCIE_CLKREQ_ L OD 1.8V Yes 31 PCIE_PERST_L I 1.
COMPANY CONFIDENTIAL Preliminary Datasheet 47 48 49 50 51 52 53 SDIO_DATA3 SDIO_DATA2 SDIO_DATA1 SDIO_DATA0 SDIO_CMD SDIO_CLK BT_UART_HOST _WAKE_L I/O I/O I/O I/O I/O I O 54 I 55 BT_UART_CTS_ L BT_UART_TXD 56 BT_UART_RXD I 57 O 58 BT_UART_RTS_ L BT_PCM_SYNC 59 BT_PCM_IN I 60 BT_PCM_OUT O 61 BT_PCM_CLK I/O 63 BT_REG_ON I 64 BT_LED_L O 65 WL_LED_L O 69 70 6,17,20, 23,26,32, 35,38,41, 62,68,71, 74-108 BT_USB_DN BT_USB _DP GND I/O O I/O GND SDIO data line 3 SDIO data line 2
COMPANY CONFIDENTIAL Preliminary Datasheet 5. Product Specification 5.1 DC Electrical Specification Absolute Maximum Ratings These specifications indicate levels where permanent damage to the device can occur. Functional operation is not guaranteed under these conditions. Operation at absolute maximum conditions for extended can adversely affect long-term reliability of the device. Rating Symbol Value Unit DC supply voltage for the device 3.3V -0.5 to 3.
COMPANY CONFIDENTIAL Preliminary Datasheet Transmit Output Power Per Each Chain 2.4GHz: 11b 1~11Mbps: 16+/-1.5dBm 11g 6~54Mbps: 15+/-1.5dBm 11n HT20 MCS0~ MCS7: 14+/-1.5dBm 5GHz: 11a 6~12Mbps: 15+/-1.5dBm 11a 18~54Mbps: 14+/-1.5dBm 11n/ac 20MHz MCS0~ MCS2: 15+/-1.5dBm 11n/ac 20MHz MCS3~ MCS7: 14+/-1.5dBm 11n/ac 40MHz MCS0~ MCS2: 15+/-1.5dBm 11n/ac 40MHz MCS3~ MCS6: 14+/-1.5dBm 11n/ac HT40 MCS7: 13+/-1.5dBm 11ac VHT20 MCS8: 11+/-1.5dBm 11ac VHT40 MCS8~ MCS9: 11+/-1.5dBm 11ac VHT80 MCS0~ MCS2: 14.5+/-1.
COMPANY CONFIDENTIAL Preliminary Datasheet EDR Relative Power P[GFSK]-4dB2.4GHz,FH<2.4835GHz BDR Frequency Range EDR Sensitivity BDR TX Output Spectrum -20dB Bandwidth LE Output Power LE Modulation Characteristics LE Carrier frequency offset and drift LE Receiver Sensitivity -80dBm@BER <= 0.
COMPANY CONFIDENTIAL Preliminary Datasheet 5.3.1 Control signal Timing (WLAN=ON, BT=ON) 5.3.
COMPANY CONFIDENTIAL Preliminary Datasheet 5.3.3 Control signal Timing (WLAN=ON, BT=OFF) 5.3.3 Control signal Timing (WLAN=OFF, BT=ON) 5.3.4 WLAN Boot Up Sequence Below figure shows that the WLAN boot-up sequence from power-up to firmware download.
COMPANY CONFIDENTIAL Preliminary Datasheet 5.4 UART Host Interface Timing The UART is a standard 4-wire interface(RX,TX,RTS and CTS) with adjustable baud rates from 9600bps to 4.0Mbps.
COMPANY CONFIDENTIAL Preliminary Datasheet 5.
COMPANY CONFIDENTIAL Preliminary Datasheet Short Frame Sync, Slave Mode 20
COMPANY CONFIDENTIAL Preliminary Datasheet Long Frame Sync, Master Mode Long Frame Sync, Slave Mode 21
COMPANY CONFIDENTIAL Preliminary Datasheet Receive Only, Short Frame Sync 22
COMPANY CONFIDENTIAL Preliminary Datasheet Receive Only, Long Frame Sync 23
COMPANY CONFIDENTIAL Preliminary Datasheet 6.Schematic Reference Design Following is the evaluation board schematics of M.2 1216 BCM4356 module for reference. Low Power Clock The BCM4356 module uses a secondary low frequency clock for low power mode timing. A precision external 32.768 KHz clock that meets the specifications listed in Table 3 is required by BCM4356. Table 3: External 32.
COMPANY CONFIDENTIAL Preliminary Datasheet Below section describes the directionality of some of the interface signals incorporated in the various pinouts. Because some signals have directionality associated with them, their names and locations may be different between the Platform side and the Module side. The Module pinouts are described in Item2.5. The main differences between Platform-side pinouts and Module-side pinouts are shown in Figure 95~96 of M.2 spec.
COMPANY CONFIDENTIAL Preliminary Datasheet 7. Software Requirement(TBD) - Operating System Support Windows 8 Windows Blue or later Android 4.
COMPANY CONFIDENTIAL Preliminary Datasheet 10. Package information Below is M.2 1216 package information for reference only.
COMPANY CONFIDENTIAL Preliminary Datasheet 11. Environmental Requirements and Specifications 11.1 Temperature 11.1.1 Operating Temperature Conditions The product shall be capable of continuous reliable operation when operating in ambient temperature of 0 °C to +70°C. 11.1.2 Non-Operating Temperature Conditions Neither subassemblies shall be damaged nor shall the operational performance be degraded when restored to the operating temperature when exposed to storage temperature in the range of -30°C to +85°C.
COMPANY CONFIDENTIAL Preliminary Datasheet 11.6 Soldering and reflow condition 1) Heating method Conventional Convection or IR/convection 2) Temperature measurement Thermocouple d=0.1mm ~ 0.2mm CA (K) or CC (T) at soldering portion or equivalent method. 3) Solder paste composition Sn/3.0Ag/0.5Cu 4) Allowable reflow soldering times: 2 times, based on the below reflow soldering profile Suggest reflow soldering one time for better reliability.
