Cinterion® ELS81-US Hardware Interface Description Version: DocId: 01.004 els81-us_hid_v01.004 GEMALTO.
Cinterion® ELS81-US Hardware Interface Description Page 2 of 107 2 Document Name: Cinterion® ELS81-US Hardware Interface Description Version: 01.004 Date: 2017-09-27 DocId: els81-us_hid_v01.004 Status Confidential / Preliminary GENERAL NOTE THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE "PRODUCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL.
Cinterion® ELS81-US Hardware Interface Description Page 3 of 107 Contents 107 Contents 1 Introduction ................................................................................................................. 9 1.1 Key Features at a Glance .................................................................................. 9 1.2 ELS81-US System Overview ........................................................................... 12 1.3 Circuit Concept ................................................
Cinterion® ELS81-US Hardware Interface Description Page 4 of 107 Contents 107 3.3 3.4 3.5 3.6 3.7 3.8 4 3.2.2.1 Restart ELS81-US via AT+CFUN Command ...................... 59 3.2.2.2 Restart ELS81-US Using EMERG_RST ............................. 60 3.2.3 Signal States after Startup .................................................................. 61 3.2.4 Turn off ELS81-US.............................................................................. 62 3.2.4.
Cinterion® ELS81-US Hardware Interface Description Page 5 of 107 Contents 107 5 Regulatory and Type Approval Information ........................................................... 93 5.1 Directives and Standards................................................................................. 93 5.2 SAR requirements specific to portable mobiles ............................................... 96 5.3 Reference Equipment for Type Approval ......................................................... 97 5.
Cinterion® ELS81-US Hardware Interface Description Page 6 of 107 Tables 118 Tables Table 1: Table 2: Table 3: Table 4: Table 5: Table 6: Table 7: Table 8: Table 9: Table 10: Table 11: Table 12: Table 13: Table 14: Table 15: Table 16: Table 17: Table 18: Table 19: Table 20: Table 21: Table 22: Table 23: Table 24: Table 25: Table 26: Table 27: Pad assignments............................................................................................ 16 Signal properties ................................
Cinterion® ELS81-US Hardware Interface Description Page 7 of 107 Figures 118 Figures Figure 1: Figure 2: Figure 3: Figure 4: Figure 5: Figure 6: Figure 7: Figure 8: Figure 9: Figure 10: Figure 11: Figure 12: Figure 13: Figure 14: Figure 15: Figure 16: Figure 17: Figure 18: Figure 19: Figure 20: Figure 21: Figure 22: Figure 23: Figure 24: Figure 25: Figure 26: Figure 27: Figure 28: Figure 29: Figure 30: Figure 31: Figure 32: Figure 33: Figure 34: Figure 35: Figure 36: Figure 37: Figure 38: Figure 39: Figu
Cinterion® ELS81-US Hardware Interface Description Page 8 of 107 Figures 118 Figure 51: Figure 52: Figure 53: Figure 54: Figure 55: Moisture barrier bag (MBB) with imprint......................................................... Moisture Sensitivity Label .............................................................................. Humidity Indicator Card - HIC ........................................................................ Tray dimensions....................................................
Cinterion® ELS81-US Hardware Interface Description Page 9 of 107 1 Introduction 14 1 Introduction This document1 describes the hardware of the Cinterion® ELS81-US module. It helps you quickly retrieve interface specifications, electrical and mechanical details and information on the requirements to be considered for integrating further components. 1.
Cinterion® ELS81-US Hardware Interface Description Page 10 of 107 1.1 Key Features at a Glance 14 Feature Implementation SMS Point-to-point MT and MO Cell broadcast Text and PDU mode Storage: SIM card plus SMS locations in mobile equipment Software AT commands Hayes 3GPP TS 27.007, TS 27.005, Gemalto M2M AT commands for RIL compatibility Java™ Open Platform Java™ Open Platform with • Java™ profile IMP-NG & CLDC 1.
Cinterion® ELS81-US Hardware Interface Description Page 11 of 107 1.1 Key Features at a Glance 14 Feature Implementation GPIO interface 22 GPIO lines comprising: 13 lines shared with ASC0, ASC1 and SPI lines, with network status indication, PWM functionality, fast shutdown and pulse counter 5 GPIO lines not shared I2C interface Supports I2C serial interface SPI interface Serial peripheral interface, shared with GPIO lines Antenna interface pads 50Ω.
Cinterion® ELS81-US Hardware Interface Description Page 12 of 107 1.2 ELS81-US System Overview 14 1.
Cinterion® ELS81-US Hardware Interface Description Page 13 of 107 1.3 Circuit Concept 14 1.
Cinterion® ELS81-US Hardware Interface Description Page 14 of 107 1.
Cinterion® ELS81-US Hardware Interface Description Page 15 of 107 2 Interface Characteristics 53 2 Interface Characteristics ELS81-US is equipped with an SMT application interface that connects to the external application. The SMT application interface incorporates the various application interfaces as well as the RF antenna interface. 2.1 Application Interface 2.1.
Cinterion® ELS81-US Hardware Interface Description Page 16 of 107 2.1 Application Interface 53 Table 1: Pad assignments Pad no.
Cinterion® ELS81-US Hardware Interface Description Page 17 of 107 2.1 Application Interface 53 2.1.2 Signal Properties Table 2: Signal properties Function Signal name IO Signal form and level Comment Power supply BATT+BB BATT+RF I WCDMA activated: VImax = 4.5V VInorm = 3.8V VImin = 3.0V during Transmit active. Imax = 900mA during Tx Lines of BATT+ and GND must be connected in parallel for supply purposes because higher peak currents may occur. LTE activated: VImax = 4.5V VInorm = 3.
Cinterion® ELS81-US Hardware Interface Description Page 18 of 107 2.1 Application Interface 53 Table 2: Signal properties Function Signal name IO Signal form and level Comment Emergency restart EMERG_RST I RI ≈ 1kΩ, CI ≈ 1nF VOHmax = VDDLP max VIHmin = 1.35V VILmax = 0.3V at ~200µA This line must be driven low by an open drain or open collector driver connected to GND. ~~|___|~~ low impulse width > 10ms If unused keep line open. RTC backup VDDLP I/O VOnorm = 1.
Cinterion® ELS81-US Hardware Interface Description Page 19 of 107 2.1 Application Interface 53 Table 2: Signal properties Function Signal name IO Signal form and level Comment Serial Interface ASC1 RXD1 O If unused keep line open. TXD1 I VOLmax = 0.25V at I = 1mA VOHmin = 1.55V at I = -1mA VOHmax = 1.85V RTS1 I CTS1 O CCIN I SIM card detection VILmax = 0.35V VIHmin = 1.30V VIHmax = 1.85V RI ≈ 110kΩ VIHmin = 1.45V at I = 15µA, VIHmax= 1.9V VILmax = 0.
Cinterion® ELS81-US Hardware Interface Description Page 20 of 107 2.1 Application Interface 53 Table 2: Signal properties Function Signal name 1.8V SIM CCRST Card Interface CCIO IO Signal form and level Comment O VOLmax = 0.25V at I = 1mA VOHmin = 1.45V at I = -1mA VOHmax = 1.90V Maximum cable length or copper track to SIM card holder should not exceed 100mm. I/O VILmax = 0.35V VIHmin = 1.25V VIHmax = 1.85V VOLmax = 0.25V at I = 1mA VOHmin = 1.50V at I = -1mA VOHmax = 1.
Cinterion® ELS81-US Hardware Interface Description Page 21 of 107 2.1 Application Interface 53 Table 2: Signal properties Function Signal name IO Signal form and level Comment SPI SPI_CLK O MOSI O VOLmax = 0.25V at I = 1mA VOHmin = 1.55V at I = -1mA VOHmax = 1.85V If lines are unused keep lines open. MISO I SPI_CS O GPIO1-GPIO3 IO GPIO4 IO GPIO5 IO GPIO6 IO GPIO7 IO VILmax = 0.35V VIHmin = 1.30V VIHmax = 1.
Cinterion® ELS81-US Hardware Interface Description Page 22 of 107 2.1 Application Interface 53 Table 2: Signal properties Function Signal name IO Signal form and level Comment PWM PWM1 O PWM2 O VOLmax = 0.25V at I = 1mA VOHmin = 1.55V at I = -1mA VOHmax = 1.85V If unused keep lines open. Note that the PWM lines are originally available as GPIO lines.
Cinterion® ELS81-US Hardware Interface Description Page 23 of 107 2.1 Application Interface 53 2.1.2.1 Absolute Maximum Ratings The absolute maximum ratings stated in Table 3 are stress ratings under any conditions. Stresses beyond any of these limits will cause permanent damage to ELS81-US. Table 3: Absolute maximum ratings1 Parameter Min Max Unit Supply voltage BATT+BB, BATT+RF -0.5 +5.5 V Voltage at all signal lines in Power Down mode -0.3 +0.
Cinterion® ELS81-US Hardware Interface Description Page 24 of 107 2.1 Application Interface 53 2.1.3 USB Interface ELS81-US supports a USB 2.0 High Speed (480Mbit/s) device interface that is Full Speed (12Mbit/s) compliant. The USB interface is primarily intended for use as command and data interface and for downloading firmware. The external application is responsible for supplying the VUSB_IN line. This line is used for cable detection only.
Cinterion® ELS81-US Hardware Interface Description Page 25 of 107 2.1 Application Interface 53 2.1.3.1 Reducing Power Consumption While a USB connection is active, the module will never switch into SLEEP mode. Only if the USB interface is in Suspended state or Detached (i.e., VUSB_IN = 0) is the module able to switch into SLEEP mode thereby saving power.
Cinterion® ELS81-US Hardware Interface Description Page 26 of 107 2.1 Application Interface 53 2.1.4 Serial Interface ASC0 ELS81-US offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to ITU-T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). For electrical characteristics please refer to Table 2.
Cinterion® ELS81-US Hardware Interface Description Page 27 of 107 2.1 Application Interface 53 The following figure shows the startup behavior of the asynchronous serial interface ASC0. Power supply active Start up Reset state Firmware initialization Command interface initialization Interface active ON VCORE V180 EMERG_RST TXD0 PD RXD0 PU RTS0 PU CTS0 PU DTR0/GPIO1 PD DSR0/GPIO3 PD PU PD DCD0/GPIO2 PD PU PD RING0/GPIO24 PD PU PD PD For pull-up and pull-down values see Table 10.
Cinterion® ELS81-US Hardware Interface Description Page 28 of 107 2.1 Application Interface 53 2.1.5 Serial Interface ASC1 Four ELS81-US GPIO lines can be configured as ASC1 interface signals to provide a 4-wire unbalanced, asynchronous modem interface ASC1 conforming to ITU-T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state).
Cinterion® ELS81-US Hardware Interface Description Page 29 of 107 2.1 Application Interface 53 The following figure shows the startup behavior of the asynchronous serial interface ASC1. Power supply active Start up Reset state Firmware initialization Command interface initialization Interface active ON VCORE V180 EMERG_RST TXD1/GPIO17 PD RXD1/GPIO16 PD RTS1/GPIO18 PD CTS1/GPIO19 PD PD *) For pull-down values see Table 10. Figure 9: ASC1 startup behavior els81-us_hid_v01.
Cinterion® ELS81-US Hardware Interface Description Page 30 of 107 2.1 Application Interface 53 2.1.6 UICC/SIM/USIM Interface ELS81-US has an integrated UICC/SIM/USIM interface compatible with the 3GPP 31.102 and ETSI 102 221. This is wired to the host interface in order to be connected to an external SIM card holder. Five pads on the SMT application interface are reserved for the SIM interface. The UICC/SIM/USIM interface supports 3V and 1.8V SIM cards.
Cinterion® ELS81-US Hardware Interface Description Page 31 of 107 2.1 Application Interface 53 The figure below shows a circuit to connect an external SIM card holder. V180 CCIN CCVCC SIM 220nF 1nF CCRST CCIO CCCLK Figure 10: External UICC/SIM/USIM card holder circuit The total cable length between the SMT application interface pads on ELS81-US and the pads of the external SIM card holder must not exceed 100mm in order to meet the specifications of 3GPP TS 51.
Cinterion® ELS81-US Hardware Interface Description Page 32 of 107 2.1 Application Interface 53 2.1.6.1 Enhanced ESD Protection for SIM Interface To optimize ESD protection for the SIM interface it is possible to add ESD diodes to the SIM interface lines as shown in the example given in Figure 11.1 The example was designed to meet ESD protection according ETSI EN 301 489-1/7: Contact discharge: ± 4kV, air discharge: ± 8kV.
Cinterion® ELS81-US Hardware Interface Description Page 33 of 107 2.1 Application Interface 53 2.1.7 RTC Backup The internal Real Time Clock of ELS81-US is supplied from a separate voltage regulator in the power supply component which is also active when ELS81-US is in Power Down mode and BATT+ is available. An alarm function is provided that allows to wake up ELS81-US without logging on to the RF network. In addition, you can use the VDDLP pad to backup the RTC from an external capacitor.
Cinterion® ELS81-US Hardware Interface Description Page 34 of 107 2.1 Application Interface 53 2.1.8 GPIO Interface ELS81-US offers a GPIO interface with 22 GPIO lines. The GPIO lines are shared with other interfaces or functions: Fast shutdown (see Section 2.1.13.4), status LED (see Section 2.1.13.1), the PWM functionality (see Section 2.1.11), an pulse counter (see Section 2.1.12), ASC0 (see Section 2.1.4), ASC1 (see Section 2.1.5), an SPI interface (see Section 2.1.10).
Cinterion® ELS81-US Hardware Interface Description Page 35 of 107 2.1 Application Interface 53 The following figure shows the startup behavior of the GPIO interface. With an active state of the ASC0 interface (i.e. CTS0 is at low level) the initialization of the GPIO interface lines is also finished.
Cinterion® ELS81-US Hardware Interface Description Page 36 of 107 2.1 Application Interface 53 2.1.9 I2C Interface I2C is a serial, 8-bit oriented data transfer bus for bit rates up to 400kbps in Fast mode. It consists of two lines, the serial data line I2CDAT and the serial clock line I2CCLK. The module acts as a single master device, e.g. the clock I2CCLK is driven by the module. I2CDAT is a bi-directional line.
Cinterion® ELS81-US Hardware Interface Description Page 37 of 107 2.1 Application Interface 53 The following figure shows the startup behavior of the I2C interface. With an active state of the ASC0 interface (i.e. CTS0 is at low level) the initialization of the I2C interface is also finished.
Cinterion® ELS81-US Hardware Interface Description Page 38 of 107 2.1 Application Interface 53 2.1.10 SPI Interface Four ELS81-US GPIO interface lines can be configured as Serial Peripheral Interface (SPI). The SPI is a synchronous serial interface for control and data transfer between ELS81-US and the external application. Only one application can be connected to the SPI and the interface supports only master mode. The transmission rates are up to 6.5Mbit/s.
Cinterion® ELS81-US Hardware Interface Description Page 39 of 107 2.1 Application Interface 53 2.1.11 PWM Interfaces The GPIO6 and GPIO7 interface lines can be configured as Pulse Width Modulation interface lines PWM1 and PWM2. The PWM interface lines can be used, for example, to connect buzzers. The PWM1 line is shared with GPIO7 and the PWM2 line is shared with GPIO6 (for GPIOs see Section 2.1.8). GPIO and PWM functionality are mutually exclusive.
Cinterion® ELS81-US Hardware Interface Description Page 40 of 107 2.1 Application Interface 53 2.1.13.2 Power Indication Circuit In Power Down mode the maximum voltage at any digital or analog interface line must not exceed +0.3V (see also Section 2.1.2.1). Exceeding this limit for any length of time might cause permanent damage to the module. It is therefore recommended to implement a power indication signal that reports the module’s power state and shows whether it is active or in Power Down mode.
Cinterion® ELS81-US Hardware Interface Description Page 41 of 107 2.1 Application Interface 53 2.1.13.4 Fast Shutdown The GPIO4 interface line can be configured as fast shutdown signal line FST_SHDN. The configured FST_SHDN line is an active low control signal and must be applied for at least 1 milliseconds. If unused this line can be left open because of a configured internal pull-up resistor. Before setting the FST_SHDN line to low, the ON signal should be set to low (see Figure 19).
Cinterion® ELS81-US Hardware Interface Description Page 42 of 107 2.2 RF Antenna Interface 53 2.2 RF Antenna Interface The ELS81-US UMTS/LTE antenna interface comprises a UMTS/LTE main antenna as well as a UMTS/LTE Rx diversity antenna to improve signal reliability and quality1. The RF interface has an impedance of 50Ω. ELS81-US is capable of sustaining a total mismatch at the antenna line without any damage, even when transmitting at maximum RF power.
Cinterion® ELS81-US Hardware Interface Description Page 43 of 107 2.2 RF Antenna Interface 53 Table 8: RF Antenna interface UMTS/LTE (at operating temperature range1) Parameter Conditions RF Power @ ARP with 50Ω Load (Board temperature < 85°C, BW:5MHz RB:25 (DL), 1 (UL) QPSK) Min. Typical Max. Unit LTE 700 Band 12 (ch. band- +21 width 5MHz; 1RB, position low) +23 dBm LTE 850 Band 5 (ch. bandwidth 5MHz; 1RB, position low) +21 +23 dBm LTE AWS Band 4 (ch.
Cinterion® ELS81-US Hardware Interface Description Page 44 of 107 2.2 RF Antenna Interface 53 2.2.2 Antenna Installation The antenna is connected by soldering the antenna pad (ANT_MAIN or ANT_DRX) and its neighboring ground pads (GND) directly to the application’s PCB. The antenna pads are the antenna reference points (ARP) for ELS81-US. All RF data specified throughout this document is related to the ARP.
Cinterion® ELS81-US Hardware Interface Description Page 45 of 107 2.2 RF Antenna Interface 53 2.2.3 2.2.3.1 RF Line Routing Design Line Arrangement Examples Several dedicated tools are available to calculate line arrangements for specific applications and PCB materials - for example from http://www.polarinstruments.com/ (commercial software) or from http://web.awrcorp.com/Usa/Products/Optional-Products/TX-Line/ (free software).
Cinterion® ELS81-US Hardware Interface Description Page 46 of 107 2.2 RF Antenna Interface 53 Micro-Stripline This section gives two line arrangement examples for micro-stripline. • Micro-Stripline on 1.0mm Standard FR4 2-Layer PCB The following two figures show examples with different values for D1 (ground strip separation). Application board Ground line Antenna line Ground line Figure 22: Micro-Stripline on 1.0mm standard FR4 2-layer PCB - example 1 els81-us_hid_v01.
Cinterion® ELS81-US Hardware Interface Description Page 47 of 107 2.2 RF Antenna Interface 53 Application board Ground line Antenna line Ground line Figure 23: Micro-Stripline on 1.0mm Standard FR4 PCB - example 2 els81-us_hid_v01.
Cinterion® ELS81-US Hardware Interface Description Page 48 of 107 2.2 RF Antenna Interface 53 • Micro-Stripline on 1.5mm Standard FR4 2-Layer PCB The following two figures show examples with different values for D1 (ground strip separation). Application board Ground line Antenna line Ground line Figure 24: Micro-Stripline on 1.5mm Standard FR4 PCB - example 1 els81-us_hid_v01.
Cinterion® ELS81-US Hardware Interface Description Page 49 of 107 2.2 RF Antenna Interface 53 Application board Ground line Antenna line Ground line Figure 25: Micro-Stripline on 1.5mm Standard FR4 PCB - example 2 els81-us_hid_v01.
Cinterion® ELS81-US Hardware Interface Description Page 50 of 107 2.2 RF Antenna Interface 53 2.2.3.2 Routing Example Interface to RF Connector Figure 26 shows the connection of the module‘s antenna pad with an application PCB‘s coaxial antenna connector. Please note that the ELS81-US bottom plane appears mirrored, since it is viewed from ELS81-US top side. By definition the top of customer's board shall mate with the bottom of the ELS81-US module.
Cinterion® ELS81-US Hardware Interface Description Page 51 of 107 2.3 Sample Application 53 2.3 Sample Application Figure 27 shows a typical example of how to integrate a ELS81-US module with an application. Usage of the various host interfaces depends on the desired features of the application. Because of the very low power consumption design, current flowing from any other source into the module circuit must be avoided, for example reverse current from high state external control lines.
Cinterion® ELS81-US Hardware Interface Description Page 52 of 107 2.3 Sample Application 53 Main antenna GND VDDLP ANT_MAIN For switch on circuit see Section 3.2.1 GND ON EMERG_RST ANT_DRX GND 100k RESET Diversity antenna GND VDDLP V180 PWR_IND BATT+RF VCORE 22k BATT+BB 150µF, Low ESR! 53 33pF BEAD* 204 Power supply 100k 150µF, Low ESR! 4.7k ELS6x 100k Blocking** Blocking** 4 4 8 3 BEAD*: It is recommended to add the BEAD as shown to the BATT+BB line.
Cinterion® ELS81-US Hardware Interface Description Page 53 of 107 2.3 Sample Application 53 2.3.1 Sample Level Conversion Circuit Depending on the micro controller used by an external application ELS81-US‘s digital input and output lines (i.e., ASC0, ASC1 and GPIO lines) may require level conversion. The following Figure 28 shows a sample circuit with recommended level shifters for an external application‘s micro controller (with VLOGIC between 3.0V...3.6V).
Cinterion® ELS81-US Hardware Interface Description Page 54 of 107 3 Operating Characteristics 77 3 Operating Characteristics 3.1 Operating Modes The table below briefly summarizes the various operating modes referred to throughout the document. Table 9: Overview of operating modes Mode Function Normal UMTS / HSPA / operation LTE SLEEP Power saving set automatically when no call is in progress and the USB connection is suspended by host or not present and no active communication via ASC0.
Cinterion® ELS81-US Hardware Interface Description Page 55 of 107 3.2 Power Up/Power Down Scenarios 77 3.2 Power Up/Power Down Scenarios In general, be sure not to turn on ELS81-US while it is beyond the safety limits of voltage and temperature stated in Section 2.1.2.1. ELS81-US immediately switches off after having started and detected these inappropriate conditions. In extreme cases this can cause permanent damage to the module. 3.2.
Cinterion® ELS81-US Hardware Interface Description Page 56 of 107 3.2 Power Up/Power Down Scenarios 77 IRML6401 3.8V 47µF,X5R 47µF,X5R 47µF,X5R 47µF,X5R C3 C4 C5 VBATT Module 10k R6 C2 100nF R1 100k C1 T2 C6 47µF,X5R VBATT_IN µcontroller R2 100k Place C2-C5 close to module BC847 R3 100k ENABLE T1 Figure 29: Sample circuit for applying power using an external µC els81-us_hid_v01.
Cinterion® ELS81-US Hardware Interface Description Page 57 of 107 3.2 Power Up/Power Down Scenarios 77 3.2.1.2 Switch on ELS81-US Using ON Signal After the operating voltage BATT+ is applied, ELS81-US can be switched on by means of the ON signal. The ON signal is an edge triggered signal and allows the input voltage level up to 5V. The module starts into normal mode on detecting the rising edge of the ON signal. The rising edge of ON signal must be applied at least 100 milliseconds later than BATT+.
Cinterion® ELS81-US Hardware Interface Description Page 58 of 107 3.2 Power Up/Power Down Scenarios 77 >100ms BATT+ VDDLP ON Rising edge only starts up the module VCORE V180 EMERG_RST Figure 31: ON timing 3.2.1.3 Automatic Power On If an automatic power on function is required for module application, circuit shown in either Figure 32 or Figure 33 is recommended.
Cinterion® ELS81-US Hardware Interface Description Page 59 of 107 3.2 Power Up/Power Down Scenarios 77 VDDLP 0.1μF BATT+BB 2 Input R1 Voltage Detector* 10KOhm 5 CD GND ON 1 RESET Output 3 GND * It is recommended to apply the ultra-low current voltage detector NCP303LSN28T1 manufactured by ON Semiconductor. Details please refer to www.onsemi.com GND Figure 33: Automatic ON circuit based on voltage detector - option 2 3.2.
Cinterion® ELS81-US Hardware Interface Description Page 60 of 107 3.2 Power Up/Power Down Scenarios 77 3.2.2.2 Restart ELS81-US Using EMERG_RST The EMERG_RST signal is internally connected to the main module processor. A low level for more than 10ms sets the processor and with it all the other signal pads to their respective reset state. The reset state is described in Section 3.2.3 as well as in the figures showing the startup behavior of an interface. After releasing the EMERG-RST line, i.e.
Cinterion® ELS81-US Hardware Interface Description Page 61 of 107 3.2 Power Up/Power Down Scenarios 77 3.2.3 Signal States after Startup Table 10 lists the states each interface signal passes through during reset phase and the first firmware initialization. For further firmware startup initializations the values may differ because of different GPIO line configurations. The reset state is reached with the rising edge of the EMERG_RST signal - either after a normal module startup (see Section 3.2.1.
Cinterion® ELS81-US Hardware Interface Description Page 62 of 107 3.2 Power Up/Power Down Scenarios 77 3.2.4 Turn off ELS81-US To switch the module off the following procedures may be used: • Software controlled shutdown procedure: Software controlled by sending an AT command over the serial application interface. See Section 3.2.4.1. • Hardware controlled shutdown procedure: Hardware controlled by disconnecting the module‘s power supply lines BATT+ (see Section 3.2.1.1).
Cinterion® ELS81-US Hardware Interface Description Page 63 of 107 3.2 Power Up/Power Down Scenarios 77 AT^SMSO System power down procedure Power down BATT+ VDDLP ON VCORE V180 EMERG_RST Figure 35: Switch off behavior els81-us_hid_v01.
Cinterion® ELS81-US Hardware Interface Description Page 64 of 107 3.2 Power Up/Power Down Scenarios 77 3.2.5 Automatic Shutdown Automatic shutdown takes effect if the following event occurs: • ELS81-US board is exceeding the critical limits of overtemperature or undertemperature (see Section 3.2.5.1) • Undervoltage or overvoltage is detected (see Section 3.2.5.2 and Section 3.2.5.3) The automatic shutdown procedure is equivalent to the power-down initiated with an AT command, i.e.
Cinterion® ELS81-US Hardware Interface Description Page 65 of 107 3.2 Power Up/Power Down Scenarios 77 3.2.5.2 Undervoltage Shutdown The undervoltage shutdown threshold is the specified minimum supply voltage VBATT+ given in Table 2. When the average supply voltage measured by ELS81-US approaches the undervoltage shutdown threshold (i.e., 0.
Cinterion® ELS81-US Hardware Interface Description Page 66 of 107 3.3 Power Saving 77 3.3 Power Saving ELS81-US can be configured to control power consumption: • Using the AT command AT^SPOW it is possible to specify a so-called power saving mode for the module ( = 2; for details on the command see [1]). The module‘s UART interfaces (ASC0 and ASC1) are then deactivated and will only periodically be activated to be able to listen to network paging messages as described in Section 3.3.
Cinterion® ELS81-US Hardware Interface Description Page 67 of 107 3.3 Power Saving 77 Generally, power saving depends on the module’s application scenario and may differ from the above mentioned normal operation. The power saving interval may be shorter than 0.64 seconds or longer than 5.12 seconds. 3.3.2 Power Saving while Attached to LTE Networks The power saving possibilities while attached to an LTE network depend on the paging timing cycle of the base station. During normal LTE operation, i.e.
Cinterion® ELS81-US Hardware Interface Description Page 68 of 107 3.3 Power Saving 77 3.3.3 Wake-up via RTS0 RTS0 can be used to wake up ELS81-US from SLEEP mode configured with AT^SPOW. Assertion of RTS0 (i.e., toggle from inactive high to active low) serves as wake up event, thus allowing an external application to almost immediately terminate power saving. After RTS0 assertion, the CTS0 line signals module wake up, i.e., readiness of the AT command interface.
Cinterion® ELS81-US Hardware Interface Description Page 69 of 107 3.4 Power Supply 77 3.4 Power Supply ELS81-US needs to be connected to a power supply at the SMT application interface - 2 lines BATT+, and GND. There are two separate voltage domains for BATT+: • BATT+BB with a line mainly for the baseband power supply. • BATT+RF with a line for the UMTS/LTE power amplifier supply. Please note that throughout the document BATT+ refers to both voltage domains and power supply lines - BATT+BB and BATT+RF.
Cinterion® ELS81-US Hardware Interface Description Page 70 of 107 3.4 Power Supply 77 Table 13: Current consumption ratings (typical ratings to be confirmed) Description IVDDLP @ 1.8V OFF State supply current OFF State supply IBATT+1 current (i.e.
Cinterion® ELS81-US Hardware Interface Description Page 71 of 107 3.4 Power Supply 77 Table 13: Current consumption ratings (typical ratings to be confirmed) Description IBATT+1 Conditions Average LTE sup- SLEEP2 @ “Paging ply current Occasions“ = 256 (i.e.
Cinterion® ELS81-US Hardware Interface Description Page 72 of 107 3.4 Power Supply 77 3.4.2 Measuring the Supply Voltage (VBATT+) To measure the supply voltage VBATT+ it is possible to define two reference points GND and BATT+. GND should be the module’s shielding, while BATT+ should be a test pad on the external application the module is mounted on.
Cinterion® ELS81-US Hardware Interface Description Page 73 of 107 3.5 Operating Temperatures 77 3.5 Operating Temperatures Please note that the module’s lifetime, i.e., the MTTF (mean time to failure) may be reduced, if operated outside the extended temperature range. Table 14: Board temperature Parameter Normal operation 1 Min Typ Max Unit -30 +25 +85 °C +90 °C >+90 °C Extended operation -40 Automatic shutdown2 Temperature measured on ELS81-US board <-40 --- 1.
Cinterion® ELS81-US Hardware Interface Description Page 74 of 107 3.6 Electrostatic Discharge 77 3.6 Electrostatic Discharge The module is not protected against Electrostatic Discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates a ELS81-US module.
Cinterion® ELS81-US Hardware Interface Description Page 75 of 107 3.7 Blocking against RF on Interface Lines 77 3.7 Blocking against RF on Interface Lines To reduce EMI issues there are serial resistors, or capacitors to GND, implemented on the module for the ignition, emergency restart, and SIM interface lines (cp. Section 2.3). However, all other signal lines have no EMI measures on the module and there are no blocking measures at the module’s interface to an external application.
Cinterion® ELS81-US Hardware Interface Description Page 76 of 107 3.7 Blocking against RF on Interface Lines 77 The following table lists for each signal line at the module‘s SMT application interface the EMI measures that may be implemented. Table 16: EMI measures on the application interface Signal name EMI measures A CCIN B C x Remark D E x CCRST x CCIO x CCCLK x The external capacitor should be not higher than 30pF. The value of the capacitor depends on the external application.
Cinterion® ELS81-US Hardware Interface Description Page 77 of 107 3.8 Reliability Characteristics 77 3.8 Reliability Characteristics The test conditions stated below are an extract of the complete test specifications.
Cinterion® ELS81-US Hardware Interface Description Page 78 of 107 4 Mechanical Dimensions, Mounting and Packaging 92 4 Mechanical Dimensions, Mounting and Packaging 4.1 Mechanical Dimensions of ELS81-US Figure 42 shows the top and bottom view of ELS81-US and provides an overview of the board's mechanical dimensions. For further details see Figure 43. Product label Top view Bottom view Figure 42: ELS81-US– top and bottom view els81-us_hid_v01.
Cinterion® ELS81-US Hardware Interface Description Page 79 of 107 4.1 Mechanical Dimensions of ELS81-US 92 Figure 43: Dimensions of ELS81-US (all dimensions in mm) els81-us_hid_v01.
Cinterion® ELS81-US Hardware Interface Description Page 80 of 107 4.2 Mounting ELS81-US onto the Application Platform 92 4.2 Mounting ELS81-US onto the Application Platform This section describes how to mount ELS81-US onto the PCBs, including land pattern and stencil design, board-level characterization, soldering conditions, durability and mechanical handling. For more information on issues related to SMT module integration see also [3].
Cinterion® ELS81-US Hardware Interface Description Page 81 of 107 4.2 Mounting ELS81-US onto the Application Platform 92 The central ground pads are primarily intended for stabilizing purposes, and may show some more voids than the application interface pads at the module's rim. This is acceptable, since they are electrically irrelevant. Figure 45: Recommended design for 110µm thick stencil (top view) Figure 46: Recommended design for 150µm thick stencil (top view) els81-us_hid_v01.
Cinterion® ELS81-US Hardware Interface Description Page 82 of 107 4.2 Mounting ELS81-US onto the Application Platform 92 4.2.1.2 Board Level Characterization Board level characterization issues should also be taken into account if devising an SMT process. Characterization tests should attempt to optimize the SMT process with regard to board level reliability.
Cinterion® ELS81-US Hardware Interface Description Page 83 of 107 4.2 Mounting ELS81-US onto the Application Platform 92 4.2.3 Soldering Conditions and Temperature 4.2.3.1 Reflow Profile tP TP TL tL TSmax Temperature TSmin tS Preheat t to maximum Time Figure 47: Reflow Profile els81-us_hid_v01.
Cinterion® ELS81-US Hardware Interface Description Page 84 of 107 4.2 Mounting ELS81-US onto the Application Platform 92 Table 18: Reflow temperature ratings1 Profile Feature Pb-Free Assembly Preheat & Soak Temperature Minimum (TSmin) Temperature Maximum (TSmax) Time (tSmin to tSmax) (tS) 150°C 200°C 60-120 seconds Average ramp up rate (TL to TP) 3K/second max.
Cinterion® ELS81-US Hardware Interface Description Page 85 of 107 4.2 Mounting ELS81-US onto the Application Platform 92 4.2.4 Durability and Mechanical Handling 4.2.4.1 Storage Conditions ELS81-US modules, as delivered in tape and reel carriers, must be stored in sealed, moisture barrier anti-static bags. The conditions stated below are only valid for modules in their original packed state in weather protected, non-temperature-controlled storage locations.
Cinterion® ELS81-US Hardware Interface Description Page 86 of 107 4.2 Mounting ELS81-US onto the Application Platform 92 4.2.4.2 Processing Life ELS81-US must be soldered to an application within 72 hours after opening the moisture barrier bag (MBB) it was stored in. As specified in the IPC/JEDEC J-STD-033 Standard, the manufacturing site processing the modules should have ambient temperatures below 30°C and a relative humidity below 60%. 4.2.4.
Cinterion® ELS81-US Hardware Interface Description Page 87 of 107 4.3 Packaging 92 4.3 Packaging 4.3.1 Tape and Reel The single-feed tape carrier for ELS81-US is illustrated in Figure 48. The figure also shows the proper part orientation. The tape width is 44mm and the ELS81-US modules are placed on the tape with a 32-mm pitch. The reels are 330mm in diameter with a core diameter of 100mm. Each reel contains 500 modules. 4.3.1.
Cinterion® ELS81-US Hardware Interface Description Page 88 of 107 4.3 Packaging 92 4.3.1.2 Barcode Label A barcode label provides detailed information on the tape and its contents. It is attached to the reel. Barcode label Figure 50: Barcode label on tape reel els81-us_hid_v01.
Cinterion® ELS81-US Hardware Interface Description Page 89 of 107 4.3 Packaging 92 4.3.2 Shipping Materials ELS81-US is distributed in tape and reel carriers. The tape and reel carriers used to distribute ELS81-US are packed as described below, including the following required shipping materials: • Moisture barrier bag, including desiccant and humidity indicator card • Transportation box 4.3.2.
Cinterion® ELS81-US Hardware Interface Description Page 90 of 107 4.3 Packaging 92 Figure 52: Moisture Sensitivity Label els81-us_hid_v01.
Cinterion® ELS81-US Hardware Interface Description Page 91 of 107 4.3 Packaging 92 MBBs contain one or more desiccant pouches to absorb moisture that may be in the bag. The humidity indicator card described below should be used to determine whether the enclosed components have absorbed an excessive amount of moisture. The desiccant pouches should not be baked or reused once removed from the MBB.
Cinterion® ELS81-US Hardware Interface Description Page 92 of 107 4.3 Packaging 92 4.3.3 Trays If small module quantities are required, e.g., for test and evaluation purposes, ELS81-US may be distributed in trays (for dimensions see Figure 54). The small quantity trays are an alternative to the single-feed tape carriers normally used. However, the trays are not designed for machine processing.
Cinterion® ELS81-US Hardware Interface Description Page 93 of 107 5 Regulatory and Type Approval Information 99 5 Regulatory and Type Approval Information 5.1 Directives and Standards ELS81-US is designed to comply with the directives and standards listed below.
Cinterion® ELS81-US Hardware Interface Description Page 94 of 107 5.1 Directives and Standards 99 Table 22: Standards of European type approval Draft ETSI EN 301 48901 V2.2.0 Electromagnetic Compatibility (EMC) standard for radio equipment and services; Part 1: Common technical requirements; Harmonized Standard covering the essential requirements of article 3.
Cinterion® ELS81-US Hardware Interface Description Page 95 of 107 5.1 Directives and Standards 99 Table 25: Toxic or hazardous substances or elements with defined concentration limits els81-us_hid_v01.
Cinterion® ELS81-US Hardware Interface Description Page 96 of 107 5.2 SAR requirements specific to portable mobiles 99 5.2 SAR requirements specific to portable mobiles Mobile phones, PDAs or other portable transmitters and receivers incorporating a UMTS module must be in accordance with the guidelines for human exposure to radio frequency energy.
Cinterion® ELS81-US Hardware Interface Description Page 97 of 107 5.3 Reference Equipment for Type Approval 99 5.
Cinterion® ELS81-US Hardware Interface Description Page 98 of 107 5.4 Compliance with FCC and IC Rules and Regulations 99 5.4 Compliance with FCC and IC Rules and Regulations The Equipment Authorization Certification for the Gemalto M2M reference application described in Section 5.
Cinterion® ELS81-US Hardware Interface Description Page 99 of 107 5.4 Compliance with FCC and IC Rules and Regulations 99 If Canadian approval is requested for devices incorporating ELS81-US modules the below notes will have to be provided in the English and French language in the final user documentation. Manufacturers/OEM Integrators must ensure that the final user documentation does not contain any information on how to install or remove the module from the final product.
Cinterion® ELS81-US Hardware Interface Description Page 100 of 107 6 Document Information 104 6 Document Information 6.1 Revision History New document: "Cinterion® ELS81-US Hardware Interface Description" Version 01.004 Chapter What is new -- Initial document setup. 6.2 [1] [2] [3] [4] [5] Related Documents ELS81-US AT Command Set ELS81-US Release Note Application Note 48: SMT Module Integration Application Note 40: Thermal Solutions Universal Serial Bus Specification Revision 2.
Cinterion® ELS81-US Hardware Interface Description Page 101 of 107 6.3 Terms and Abbreviations 104 Abbreviation Description CTS Clear to Send DAC Digital-to-Analog Converter dBm0 Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law DCE Data Communication Equipment (typically modems, e.g.
Cinterion® ELS81-US Hardware Interface Description Page 102 of 107 6.
Cinterion® ELS81-US Hardware Interface Description Page 103 of 107 6.3 Terms and Abbreviations 104 Abbreviation Description TDMA Time Division Multiple Access TE Terminal Equipment, also referred to as DTE TLS Transport Layer Security Tx Transmit Direction UART Universal asynchronous receiver-transmitter URC Unsolicited Result Code USSD Unstructured Supplementary Service Data VSWR Voltage Standing Wave Ratio els81-us_hid_v01.
Cinterion® ELS81-US Hardware Interface Description Page 104 of 107 6.4 Safety Precaution Notes 104 6.4 Safety Precaution Notes The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating ELS81-US. Manufacturers of the cellular terminal are advised to convey the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product.
Cinterion® ELS81-US Hardware Interface Description Page 105 of 107 7 Appendix 106 7 Appendix 7.
Cinterion® ELS81-US Hardware Interface Description Page 106 of 107 7.1 List of Parts and Accessories 106 Table 27: Molex sales contacts (subject to change) Molex For further information please click: http://www.molex.com Molex Deutschland GmbH Otto-Hahn-Str. 1b 69190 Walldorf Germany Phone: +49-6227-3091-0 Fax: +49-6227-3091-8100 Email: mxgermany@molex.com American Headquarters Lisle, Illinois 60532 U.S.A.
About Gemalto Since 1996, Gemalto has been pioneering groundbreaking M2M and IoT products that keep our customers on the leading edge of innovation. We work closely with global mobile network operators to ensure that Cinterion® modules evolve in sync with wireless networks, providing a seamless migration path to protect your IoT technology investment.
