SZU06A2 Product Manual SZU06A2 ZIGBEE WIRELESS COMMUNICATION MODULE Product Manual
SZU06A2 Product Manual Table of Contents Table of Contents....................................................................................................................................................... 1 1 General.................................................................................................................................................................... 1 1.1 Module introduction....................................................................................................
SZU06A2 Product Manual 12.3 Storage conditions.....................................................................................................................................20 13 Packaging...........................................................................................................................................................21 13.1 Carrier tape...............................................................................................................................................
SZU06A2 Product Manual Module features Mini 33-pin stamp-like SMT package Provide on-board snake antenna Small form factor: 19 mm x 25 mm x 3.7 mm Compliant with EU CE certification Compliant with EU RoHS certification Compliant with EU ATEX certification Based on ARM Cortex®-M4 architecture 256K FLASH and 32K RAM Multiple sleep modes Operating voltage range: 2.1V to 3.
SZU06A2 Product Manual RF Features Based on the Silicon Labs EFR32MG1 chip solution 2.4 GHz ISM frequency band 250 Kbps data transmission rate over the air 16 channels (IEEE802.15.4: CH11–CH26) Maximum output power: +8dbm Signal sensitivity: -98dBm@1% PER Sleep current: 2.7μA RX current :14mA TX current: 31mA @+8dBm Visible barrier-free communication distance: 600 m@-69dBm, PER=0.
SZU06A2 Product Manual 1 General 1.1 Module introduction SZU06A2 introduced in this document is an embedded wireless communication module based on IEEE802.15.4/ZigBee technology. The hardware has taken the EFR32MG1V132 chip solution of Silicon Labs and the software adopts the SZU06 AT instruction set self developed based on Ember Z-net_5.9.0 protocol stack released by Silicon Labs.
SZU06A2 Product Manual Module Chip FLAH RAM Sealing Dimension SZU06A2 EFR32MG1V132 256KB 32KB 19mm * 25mm * 3.7mm Table 1- 1 Model of SZU06A2 Module The SZU06A2 is used for ZigBee applications (www.zigbee.org). If you don’t want to use the AT instruction interface we provided and expect to develop your own software, you need to download the official Simplicity Studio V4 development tool and Ember Z-net_5.9.0 or later protocol stack of Silicon Labs. 2 Approvals 2.
SZU06A2 Product Manual The "CE" marking must be placed in a prominent position of OEM products. Please refer to http://ec.europa.eu/enterprise/faq/ce-mark.htm for more information about CE certification mark. 2.2 FCC Approvals The SUZ06A2 ZigBee wireless communication module has been tested to comply with Part 15 of the FCC rules. FCC caution: This device complies with Part 15 of the FCC rules.
SZU06A2 Product Manual Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Please take attention that changes or modification not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
SZU06A2 Product Manual Name And Address Of Notified Body: Number Of Notified Body: 1. 2. 3. 4. TÜV SÜD Product Service GmbH Zertifizierstellen Ridlerstraße 65 80339 MÜNCHEN GERMANY 0123 Special conditions for safe use: The sign “U“ placed after the certificate number indicates that the certificate must not be mistaken with a certificate intended for an equipment or protective system. This partial certification may be used as a basis for certification of equipment or protective system.
SZU06A2 Product Manual 3 Module Pinout Fig. 3- 1 SZU06A2 Pinout (top view) In order to facilitate the user to develop and design the products based on SZU06A2 ZigBee wireless communication module, we have detailed the pin information of SZU06A2 ZigBee wireless communication module in the following Table 3-1. All GND pins are directly connected with the module; but for best RF performance, each GND pin shall be connected to a complete ground externally . Pin No.
SZU06A2 Product Manual 12 NC - - Float directly. 13 GND GND - System GND. 14 PTI.SYNC PB13 R/RW General GPIO 15 PTI.DATA PB12 R/RW General GPIO 16 PTI.CLK PB11 R/RW General GPIO 17 TXD PA0 R/RW Transmitted Data 18 RXD PA1 R/RW Received Data 19 GND GND - System GND. 20 GND GND - System GND.
SZU06A2 Product Manual 4 Hardware Description 4.1 Hardware Diagram Fig. 4-1 Hardware Diagram of SZU06A2 SZU06A2 wireless communication module is based on EFR32MG1V1321 chip from Silicon Labs, which integrates the RF transceiver complying with 2.4-GHz IEEE 802.15.4, high performance 32-bit ARM Cortex®-M4 CPU, 256KB FLASH and 32KB RAM which can be programmed in the system and many other peripherals with strong functions.
SZU06A2 Product Manual 4.2 Interface characteristics Test conditions Parameter UART Baud Rate Analog channel resolution Minimum value Maximum value Unit 9600 115200 bps 6 12 bit Half-duplex Analog input impedance Typical values 20 Analog input voltage 2.1 GPIO output voltage -0.3 Real-time clock frequency 3.3 32.768 kΩ 3.9 V 3.9 V kHz Table 4-1 SZU06A2 Interface Characteristics 9 SZU06A2 PM(Rev 2.
SZU06A2 Product Manual 5 Absolute Maximum Ratings Parameter Symbol Min value Max value Unit Supply voltage VDD -0.3 3.9 Supply current IVDD - 1000 Pin voltage VPIN -0.3 3.
SZU06A2 Product Manual 5.2 Recommended operating conditions Parameter Min value Typical value Max value Unit Environment Supply voltage 2.1 3.3 3.9 V RF input power - - 10 dbm 2480 MHz RF frequency 2405 Operating temperature -40 25 85 ℃ - - 95 % Relative humidity - Table 5-3 Recommended Operating Conditions 6 DC Electrical Characteristics VDD 3.3V,TOP 25℃，fC 2400MHz 2483.5MHz. Parameter Test condition Symbol Value Min. Type Max. Supply Voltage VDD 2.1V 3.
SZU06A2 Product Manual From EM2 to wake t em 2 w u - 3μs - From EM3 to wake t em 3 w u - 3μs - From EM4H to wake t em 4 h w u - 20μs - From EM4S to wake t em 4 s w u - 290μs - Table 6-1 DC Electrical Characteristics of SZU06A2 7 Digital IO Specifications VDD 3.3V,TOP 25℃. Parameter Sym Test conditions bol Parameter value Min. Logic0 input voltage VIL Logic1 input voltage VIH 0.7*VDD Typ. Max. 0.3*VDD Logic0 input current Input voltage 0V I IL - 0.
SZU06A2 Product Manual AC Electrical Characteristics 8 VDD =3.3V,TOP =25℃. No 1 Parameter Test conditions Frequency range Min Typ. Max 2400 2500 CH11 CH26 Unit MHz See Table 10.2 for the 2 Channel number correspondence between channel and frequency 3 Input impedance 4 Receiver sensitivity PER=1% 5 Input level Input voltage PER=1% High-side adjacent channel 7 50 53 Ω -100 -98 -97 dBm 10 dB Interferer is reference - 33.
SZU06A2 Product Manual RSSI accuracy in the linear 11 - region as defined by ±1 - dB 802.15.4-2003 12 Frequency Tolerance for 38.4 MHz, ESR = 50 Ω, the crystal CL = 10pF Occupied channel 13 bandwidth per ETSI EN300.
SZU06A2 Product Manual Physical Dimensions and Footprint 9 9.1 Physical Dimensions Fig. 9-1 Physical Dimensions of SZU06A2 Parameter Parameter Description Parameter value W Module width 19mm L1 Module length 25mm A1 Distance between semi-holes 1.27mm A2 Distance from semi-hole to PCB 0.8mm Table 9-1 Physical Dimensions of SZU06A2 15 SZU06A2 PM(Rev 2.
SZU06A2 Product Manual 9.2 Recommended Footprint Fig. 9-2 Recommended Footprint of SZU06A2 Notes: 1. When the surface mounted SZU06A2 ZigBee wireless communication module is used, it is suggested that the bonding pad shall be 1mm wide and 1.2mm high. 2. L=25mm. 3. You must ensure that the corresponding PCB of “keep-out area” part in Fig. 3- 1shall have no any device, running line or applied copper. 4.
SZU06A2 Product Manual 10 Soldering Temperature Time Profile (for reflow soldering) 10.1 Recommended temperature time profile for lead-free solder Fig. 10-1 SZU06A2 Temperature Profile for Lead-free Solder Notes: Preheat: The recommended temperature climbing speed shall be 2℃/s and not exceed 2.5℃/s at the preheat area. Cooling: The recommended temperature descent speed shall be 3℃/s and not exceed 4℃/s at the cooling area.
SZU06A2 Product Manual 11 Reliability Test To guarantee the environment adaptability of SZU06A2, we have done the the following measurements. No Test items Test methods 1 Vibration test Setting the vibration frequency of 50Hz, amplitude of 1.
SZU06A2 Product Manual 12 Application Precautions 12.1 Safety precautions Before use of SZU06A2, check and evaluate their operation when mounted on your products . These products may short-circuit.
SZU06A2 Product Manual The environment of direct sunshine, outdoor or dusty environment Environment easy to condensation Environment with high concentration and harmful gases (such as air with salt, muriatic acid, chlorine, sulfur dioxide, sulfuretted hydrogen, ammonia gas or nitrogen oxide) （5）Mechanical stress shall be avoided in assembly or operation of SZU06A2.
SZU06A2 Product Manual 13 Packaging 13.1 Carrier tape Fig. 13-1 Dimension of Carrier Tape (Top View) Fig. 13-2 Diagram of Cover Tape Fig. 13-3 Diagram of 21 Empty pocket SZU06A2 PM(Rev 2.
SZU06A2 Product Manual Fig. 13-4 Orientation of SZU06A2 13.2 Reel Fig. 13-5 Reel Dimensions Each reel will be packed in a electrostatic shielding bag 22 SZU06A2 PM(Rev 2.
SZU06A2 Product Manual 14 Ordering Information Product code Brief description SZU06A2 Based on EFR32MG1single chip solution On-board snake antenna 19mm * 25mm * 3.7mm Visible barrier-free communication distance is 600m @-69dBm Development kit contains SZU06DVK Development Kit 2 X SZURF-EVB Development Boards 2 X SZU06A1 on Carrier-Board 2 X SZU06A2 on Carrier-Board 2 X SZU06C1 on Carrier-Board 2 X SZU06C2 on Carrier-Board 2 X Pulse 2.
SZU06A2 Product Manual 15 Drawing of Product Label Fig. 15-1 SZU06A2 Product Label The label dimensions are 15.2mm*17mm and the label will withstand temperatures used during reflow soldering.
SZU06A2 Product Manual 16 Disclaimer We reserve the right to modify or improve the product, company name and LOGO at any time without prior notice. In addition, Chengdu Diyue Technology Co., Ltd. does not convey any license under its patent rights or assume any responsibility for the use of the described product.
SZU06A2 Product Manual 19 Reference Documents [1] Data sheet CC2530.TI. (www.ti.com-CC2530) [2] Data sheet CC2591.TI. (www.ti.com-CC2591) [3] Z-Stack-CC2530-2.5.1a (www.ti.com-Z-Stack-CC2530-2.5.1a) 20 Contact Information Website: www.cdiyue.com Add.: 4/F, Block A, Gaofa Building, No.6, Jiuxing Avenue, High-tech Zone, Chengdu Tel: 0086-28-85138368 Fax: 0086-28-85189190 E-mail：public@cdiyue.com Sales In China Tel: 0086-28-85106132 Fax: 0086-28-85189190 E-mail：sales@cdiyue.
