2.4GHz Helical Antenna : AF 216M245001 No.1 Small Size : The Smallest Size in the world in keeping high efficiency Confidential Efficiency > -1.6dB (69%) Peak Gain > +1.7dBi Average Gain > +0.0dBi (ZX plane-Vertical polarization) ■Shapes ■Electrical Characteristics 2.5 x 1.6 x 1.6 mm Element-GND Distance: 3.5mm Efficiency [dB] Peak gain [dBi] Average XY-plane gain [dBi] YZ-plane ZX-plane *on Taiyo Yuden’s Evaluation Board *GND size on evaluation board: 45x10mm VSWR 2400MHz 2450MHz 2500MHz -1.
1.0 Scope This specification covers the helical antenna in mounted condition on Taiyo Yuden evaluation board. Part Numbering System AF 216 M 2450 01 − T Package (T: Taping) Individual specification Frequency bandwidth (4-digit number in MHz) Antenna Class Size (mm) Type 2.0 Environment condition (Refer to the reliability test of table -1 for the reliability assurance) 2.1 Operating temperature range : -20℃ to +80℃ 2.2 Humidity : 15 to 95%RH (Without dew condensation) 2.
Reflow soldering temperature profile Temp Recommended reflow profile ( ℃) 300 Peak temperature: 250〜255℃ 230℃ 250 200 150 100 50 0 About 60s 55〜75s 20〜30s − 3− Time(sec)
Figure -1 Part number: PG_AF_216M245001-T Shape dimension Code L W T E Size 2.5± 0.2 1.6± 0.2 1.6± 0.2 0.5± 0.
Figure -2 Dimension of evaluation board for this antenna ・Board material: FR-4 ・Thickness of base material: 0.8mm ・Electrode pattern: single-side ・Thickness of electrode: 35μ m ・Land part: Refer to figure3 pattern Board size Matching circuit 7.8 HK1005 6N8J (6.
Figure -3 Antenna land-patterns (Tentative) ※1 ※2 Unit:mm Land for matching circuit (1005 chip) 50Ω input Land for input terminal Land for NC terminal ※ 1:Don't arrange the pattern on near, surface and inside layer to the antenna mounting area. (Refer to our company evaluation circuit board.) ※ 2:A solder area is set at solder resist.
Precautions 1.Be careful of using these products because characteristics may be deteriorated when it is used in the following environment. ・Special gas atmosphere (Such as CI2, NH3, SOx and Nox, etc.) ・Gas atmosphere with volatility and flammability ・Place where dust is abundant ・Place where water splashes directly, dew condensation is ease to occur because of high humidity, direct sunlight is subjected and freeze.
Tape Packaging (T) ◎ In case of taping packing, plastic tapes shall be used. Tape Size Sprocket hole J Chip cavity Plastic tape E A D C B t G H F k Feeding direction Dimensions Code A B C D E F G Size 1.85± 0.1 2.75± 0.1 8.0± 0.2 3.5± 0.05 1.75± 0.1 4.0± 0.1 2.0± 0.05 [Unit:mm] Dimensions Code H Size 4.0± 0.1 J φ 1.5 +0.1 − 0 K t 1.85 max. 0.25 max. ※ A, B, t:Sufficient clearance. [Unit:mm] Dimensions of Reel Dimension of Reel Code A B C Size φ 178± 2.
Tape Packaging (T) 1. Taping shall be right-sided wound. When the end is pulled out, sprocket hole will be at the right-hand side. 2. For packaging chips by taping, blank spaces are provided on taping as shown in the figure. ・Leader part 400mm min. ・Leader part (Blank part) ・Trailer (Blank part) 20 pockets min. 40 pockets min. Chip packaging area Trailer Leader part End Start Blank part Blank part No shorter than 20 pockets No shorter than 40 pockets No shorter than 400mm Feeding direction 3.
Tape Packaging (T) [Packaging Mode] Tape packaging Feeding direction Customer label description 1.Manufacturer Name Customer label 2.Customer Parts No. Reel 3.Our Parts No. 4.Quantity 5. Control No. (Shipping Lot No.) A 6.Manufacturing site (MADE IN ○ ○ ○ ) B C Code A B Size 190 185 C Reel 70 5 reels max. 140 10 reels max. [Unit: mm] (The size is only for reference.) Material: Paper Packaging unit: Maximum 5 reels or 10 reels in a box.
Operating conditions for guarantee of this product are as shown in the specification. Please note that Taiyo Yuden Co., Ltd. shall not be responsible for a failure and/or abnormality which are caused by use under the conditions other than the aforesaid operating conditions. This product is developed, designed and intended for use in general electronics equipments. (for AV, household, office supply, information service, telecommunications, etc.).