User's Manual

ManualsBrandsCalifornia Eastern Laboratories ManualsElectronicsMeshConnect Sub-G Extended Range Module

Page 1

MeshConnect™ Sub-G Module Series

CEL's MeshConnect™ Module Series provides high performance

and low cost Sub-G modules for a broad range of wireless net-

works. The MeshConnect certied and qualied modules enable

customers to accelerate time to market by greatly reducing design

and certication phases of development.

CEL's MeshConnect™ Sub-G modules (868/900MHz) are based

on the Silicon Labs SoC ICs (single-chip solutions). Each IC con-

sists of an RF transceiver with baseband modem, a hard-wired

MAC and an embedded 8051 microcontroller with internal RAM

(4kB) and Flash (64kB) memory. The device provides numer-

ous general-purpose I/O pins and peripheral functions such as

timers and UARTs.

The MeshConnect Sub-G modules have 2 different output powers

(+12dBm and +19dBm). They provide a reliable transmission, to

reduce the number of nodes in a network. They are especially

useful for open outdoor applications where the nodes are physi-

cally far apart. The higher power Modules have an outstanding

118dB link budget ensuring high quality connections even in

harsh environments.

Development Kits Available:

ZICM0868P2-KIT1-1 and ZICM0900P2-KIT1-1

The information in this document is subject to change without notice, please conrm data is current

Document No: 0009-00-07-00-000 (Issue ES)

Date Published: December 7, 2010

PRELIMINARY DATA SHEET

DESCRIPTION

ZICM0868Px

ZICM0900Px

868 / 900 MHz Transceiver Based Modules

•FrequencyRange:

 902- 928 MHz 

 868 MHz

•Sensitivity:-99dBm

•MaxOutputPower:

+ 12 dBm @ 3.6 VDC (ZICM0xxxP0)

+ 19 dBm @ 3.6 VDC (ZICM0xxxP2)

•DataRate:0.123to150kbps

•Upto21GPIOPins

•HighSpeed8051MCU:

30 MHz

4kB RAM / 64 kB Flash

•10-BitADC:

300 ksps, 18-ch inputs

•SerialCommunication:

UARTs, SPI (Master/Slave)

SMBus, PCA

•Modulation:  

 FSK

FEATURES

•RFPowerConsumption 

 24 mA Receive

 18 mA @ + 1 dBm transmit 

 30 mA @ + 12 dBm transmit

 90 mA @ + 19 dBm transmit

•Auto-FrequencyCalibration(AFC)

•FrequencyHoppingCapability

•Upto12milesofrange

•OperatingTemperatureRange:

 -40 to +85ºC

•SoftwareSupport:

 Synapse SNAP Embedded Firmware

 Wireless M-Bus (868MHz Only)

 Silicon Labs EZMac

 CEL Protocol

•FCC,CEandICcerticationsin

 Progress

•ROHScompliant

MeshConnect

™

Sub-G Modules

ZICM0868Px ZICM0900Px

APPLICATIONS

• Metering

• RFID

• RemoteKeylessEntry

• HomeAutomation

• Security

• Irrigation

• WeatherStations

• Andmore...

Best Reliable Performance

• Good sensitivity providing longer range for Non-line-of-site

aplications

• Low operating (receive) current

Summary of content (15 pages)

PAGE 1
PRELIMINARY DATA SHEET MeshConnect™ Sub-G Module Series ZICM0868Px ZICM0900Px 868 / 900 MHz Transceiver Based Modules Development Kits Available: ZICM0868P2-KIT1-1 and ZICM0900P2-KIT1-1 DESCRIPTION MeshConnect™ Sub-G Modules CEL's MeshConnect™ Module Series provides high performance and low cost Sub-G modules for a broad range of wireless networks.
PAGE 2
MeshConnect™ Sub-G Module Series ORDERING INFORMATION Part Number MeshConnect™ Sub-G (Eruope Only) MeshConnect™ Sub-G MeshConnect™ Sub-G Development Kits Order Number Description ZICM0868P0-1CU 868 MHz Module, +12dBm output power with U.FL connector for external antenna ZICM0868P2-1CU 868 MHz Module, +19dBm output power with U.
PAGE 3
MeshConnect™ Sub-G Module Series MODULE BLOCK DIAGRAM Sub-G SI100x T/R Switch ANT Low Pass Filter External Memory Optional DEVELOPMENT KIT CEL's Development Kit assist users in both evaluation and development. As a stand-alone radio system, the kit allows users to place the modules into the target environment and evaluate performance on-site. The Development Kit also serves as an invaluable aid in application development.
PAGE 4
MeshConnect™ Sub-G Module Series TABLE OF CONTENTS Introduction and Overview Description.............................................................................................................................................................................................. 1 Features.................................................................................................................................................................................................. 1 Applications..........
PAGE 5
MeshConnect™ Sub-G Module Series TRANSCEIVER IC The MeshConnect Sub-G modules are based on the Silicon Labs Si1000 and Si1002 SOC transceiver ICs. These ICs incorporate the RF transceiver with the baseband modem, a hardwired MAC, and an embedded 8051 microcontroller, offering a high performance solution for all Sub-G applications. For more information about the Silicon Labs ICs, visit http://www.silabs.com.
PAGE 6
MeshConnect™ Sub-G Module Series ABSOLUTE MAXIMUM RATINGS Description MeshConnect™ Sub-G Module Unit Min Max Power Supply Voltage (VDD) -0.3 3.6 VDC Voltage on any I/O Line -0.3 VDD + 0.3 VDC – 10 dBm -40 125 °C – 260 °C RF Input Power Storage Temperature Range Reflow Soldering Temperature Note: Exceeding the maximum ratings may cause permanent damage to the module or devices.
PAGE 7
MeshConnect™ Sub-G Module Series RF CHARACTERISTICS (@ 25°C, VDD = 3.
PAGE 8
MeshConnect™ Sub-G Module Series PIN SIGNALS I/O PORT CONFIGURATION MeshConnect module has 56 edge I/O interfaces for connection to the user’s host board. The MeshConnect Module Dimensions shows the layout of the 56 edge castellations. MeshConnect I/O PIN ASSIGNMENTS Number Name 1 GND 2 GND 3 GND 4 GND 5 GND 6 GND 7 GND 8 NC 9 ANTA 10 GPIO0 11 GPIO2 12 P0.7/IREF P0.6/ 13 CNVSTR 14 P0.5/RXD 15 P0.4/TXD 16 WP 17 NC 18 GND 19 GND 20 NC 21 NC 22 NC 23 P0.3 24 P0.2 25 P0.1 26 P0.
PAGE 9
MeshConnect™ Sub-G Module Series MeshConnect I/O PIN ASSIGNMENTS (Continued) Number Name Notes 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 NC NC GND GND GND GND GND P2.2 P2.1 P2.0 P1.7 P1.6 P1.
PAGE 10
MeshConnect™ Sub-G Module Series SOFTWARE/FIRMWARE (Continued) • • • • • • • • • • • • • • • • • • • • • • • • • Self Healing (Orphan handling) Point-to-Point network formation Point-to-Multipoint (Star) network formation Self Healing (Orphan handling) Point-to-Point network formation Point-to-Multipoint (Star) network formation ACK Wakeup Modes (Si100X) – most likely software will just use one of the wakeup modes Frequency Hopping Unicast Addressing using 16-bit device IDs Broadcast Addressing Packet For
PAGE 11
MeshConnect™ Sub-G Module Series MODULE LAND FOOTPRINT Note: Unless otherwise specified. Dimensions are in Inches [mm]. EVALUATION BOARD CEL provides an Evaluation board to allow easy testing of the Module. The Evaluation board provides power via: • • • • AA cell batteries USB AC Adapter regulated down to 3.3VDC External Lab Power Supply (A jumper is also provided for the purposes of monitoring the DC current of the module under various modes of operation).
PAGE 12
MeshConnect™ Sub-G Module Series PROCESSING Recommended Reflow Profile Parameters Values Ramp up rate (from Tsoakmax to Tpeak) 3º/sec max Minimum Soak Temperature 150ºC Maximum Soak Temperature 200ºC Soak Time 60-120 sec TLiquidus 217ºC Time above TL 60-150 sec Tpeak 250ºC Time within 5º of Tpeak 20-30 sec Time from 25º to Tpeak 8 min max Ramp down rate 6ºC/sec max Achieve the brightest possible solder fillets with a good shape and low contact angle.
PAGE 13
MeshConnect™ Sub-G Module Series PROCESSING (Continued) Hand Soldering Hand soldering is possible. Use a soldering iron temperature setting equivalent to 350°C, follow IPC recommendations/ reference document IPC-7711. Rework The MeshConnect Module can be unsoldered from the host board. Use of a hot air rework tool and hot plate for pre-heating from underneath is recommended. Avoid overheating. Warning Never attempt a rework on the module itself, e.g. replacing individual components.
PAGE 14
MeshConnect™ Sub-G Module Series AGENCY CERTIFICATIONS (Continued) IC Certification — Industry Canada Statement The term "IC" before the certification / registration number only signifies that the Industry Canada technical specifications were met. Section 14 of RSS-210 The installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit RF field in excess of Health Canada limits for the general population.
PAGE 15
MeshConnect™ Sub-G Module Series REFERENCES & REVISION HISTORY Previous Versions 0008-00-07-00-000 (Issue ES) December 7, 2010 Changes to Current Version Initial preliminary datasheet. Page(s) N/A Disclaimer • The information in this document is current as of the published date. The information is subject to change without notice. For actual design-in, refer to the latest publications of CEL data sheets or data books, etc., for the most up-to-date specifications of CEL products.