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MeshConnect™ Sub-G Module Series

CEL's MeshConnect™ Sub-G modules are built on the Si1000

and Si1002 highly integrated wireless SoC's from Silicon Labs.

Targeting dense operating environments, CEL’s MeshConnect

Sub-G modules deliver superior range and performance. Their

low power consumption enables longer battery life and their link

budgets provide reliable transmission in non line of sight ap-

plications such as lighting control, industrial sensor networks,

serial wire replacement, metering, irrigation and more. At +13

and +20 dBm power outputs, the new Sub-G modules offer 868

MHz (Europe) and 915 MHz (Americas) ISM band options. As

certied and qualied modules, the MeshConnect Sub-G solu-

tions eliminate the need for costly certications, reducing overall

system cost and accelerating time to market.

Development Kits Available:

ZICM0868P0-KIT1-1 and ZICM0900P2-KIT1-1

The information in this document is subject to change without notice, please conrm data is current

Document No: 0009-00-07-00-000 (Issue ES)

Date Published: June 1

, 2011

PRELIMINARY DATA SHEET

DESCRIPTION

ZICM0868P0

ZICM0900P2

868 / 900 MHz System-on-Chip (SoC) Based Modules

•FrequencyRange:



902- 928 MHz 

 868 MHz

•LinkBudgetupto-140dB

 (for +20 dBm module)



+20 dBm and +13 dBm available

output powers



•MaxOutputPower:

+ 13 dBm @ 3.5 V

DC (ZICM0868P0)

+ 20 dBm @ 3.5 V

DC (ZICM0900P2)

•DataRate:0.123to150kbps



•GeneralPurposeI/Os:21



•HighSpeed8051MCU:



25 MHz - single cycle instruction execution

4kB RAM / 64 kB Flash

•10-BitADC:

300 ksps, 18-ch inputs

•SerialCommunication:

UARTs, SPI (Master/Slave)

SMBus, PCA



•Add1MBadditionalFlashmemory

 toenableOverTheAir(OTA)

 programming

(Optional) 

FEATURES

•Modulation:  

 FSK, GFSK, OOK

•RFPowerConsumption 

 24 mA Receive

 18 mA @ + 1 dBm transmit 

 42 mA @ + 13 dBm transmit

 97 mA @ + 19 dBm transmit

•SleepCurrent1.2µATYP



•Upto6milesofrange

 (lineofsight)



•OperatingTemperatureRange:



-40 to +85ºC

•SoftwarePlatforms:



Synapse SNAP Embedded Firmware

Wireless M-Bus (868 MHz Only)

CEL Application Programming

Interface (API)

Silicon Labs EZMac



•FCC,CEandICcerticationsin

 Progress



Multiple antenna options

FSK Modulation Only

•ROHScompliant

MeshConnect

™

Sub-G Modules

ZICM0868P0 ZICM0900P2

APPLICATIONS

• Long Range

• Low Power Consumption

• 868 and 900 MHz Frequency Ranges

• 1MB additional Flash Memory option enables

Over the Air (OTA) Programming

•LightingControl

•Irrigation

•Serialwirereplacement

•IndustrialSensorNetworks

•WirelessM-BusMetering

•HomeAutomation&SmartPlugs

•Security

•Andmore...

Summary of content (16 pages)

PAGE 1
PRELIMINARY DATA SHEET MeshConnect™ Sub-G Module Series ZICM0868P0 ZICM0900P2 868 / 900 MHz System-on-Chip (SoC) Based Modules Development Kits Available: ZICM0868P0-KIT1-1 and ZICM0900P2-KIT1-1 DESCRIPTION CEL's MeshConnect™ Sub-G modules are built on the Si1000 and Si1002 highly integrated wireless SoC's from Silicon Labs. Targeting dense operating environments, CEL’s MeshConnect Sub-G modules deliver superior range and performance.
PAGE 2
MeshConnect™ Sub-G Module Series ORDERING INFORMATION Part Number MeshConnect™ Sub-G Module (868 MHz) MeshConnect™ Sub-G Module (902-928 MHz) MeshConnect™ Sub-G Development Kits Order Number Description ZICM0868P0-1CU 868 MHz Module, +13dBm SoC with U.FL connector for external antenna ZICM0868P0-1CS 868 MHz Module, +13dBm SoC with RP-SMA connector for external antenna ZICM0868P0-1C 868 MHz Module, +13dBm SoC with 1/4 wave wire antenna ZICM0900P2-1CU 900 MHz Module, +20dBm SoC with U.
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MeshConnect™ Sub-G Module Series MODULE BLOCK DIAGRAM Sub-G SI100x T/R Switch ANT Low Pass Filter External Memory Optional DEVELOPMENT KIT CEL's Development Kit assist users in both evaluation and development. As a stand-alone radio system, the kit allows users to place the modules into the target environment and evaluate performance on-site. The Development Kit also serves as an invaluable aid in application development.
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MeshConnect™ Sub-G Module Series TABLE OF CONTENTS Introduction and Overview Description.............................................................................................................................................................................................. 1 Features.................................................................................................................................................................................................. 1 Applications..........
PAGE 5
MeshConnect™ Sub-G Module Series TRANSCEIVER IC The MeshConnect Sub-G modules are based on the Silicon Labs Si1000 and Si1002 wireless SoCs ICs. These devices incorporate the RF transceiver with the baseband modem, a hardwired MAC, and an embedded 8051 microcontroller, offering a high performance solution for all Sub-G applications. For more information about the Silicon Labs ICs, visit http://www.silabs.com.
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MeshConnect™ Sub-G Module Series ABSOLUTE MAXIMUM RATINGS Description MeshConnect™ Sub-G Module Unit Min Max Power Supply Voltage (VDD) -0.3 3.6 VDC Voltage on any I/O Line -0.3 VDD + 0.3 VDC – 10 dBm -40 125 °C – 260 °C RF Input Power Storage Temperature Range Reflow Soldering Temperature Note: Module has built in TX disabling feature when VCC = 3.6VDC. Exceeding the maximum ratings may cause permanent damage to the module or devices.
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MeshConnect™ Sub-G Module Series RF CHARACTERISTICS (@ 25°C, VDD = 3.5V, ZICM0868P0) Description MeshConnect™ Sub-G Module Unit Min Typ Max 865 – 870 MHz Maximum Output Power – 13 – dBm Minimum Output Power – -12 – dBm FSK Error – 15 – % Deviation – 75 – KHz Sensitivity (1% PER, 150kbps) – -99 – dBm Saturation (maximum input level) – – 10 dBm General Characteristics RF Frequency Range Transmitter Receiver RF CHARACTERISTICS (@ 25°C, VDD = 3.
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MeshConnect™ Sub-G Module Series PIN SIGNALS I/O PORT CONFIGURATION MeshConnect module has 56 edge I/O interfaces for connection to the user’s host board. The MeshConnect Module Dimensions shows the layout of the 56 edge castellations. MeshConnect I/O PIN ASSIGNMENTS Number Name 1 2 3 4 5 6 7 8 9 10 11 12 GND GND GND GND GND GND GND NC ANTA GPIO0 GPIO2 P0.7/IREF P0.
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MeshConnect™ Sub-G Module Series MeshConnect I/O PIN ASSIGNMENTS (Continued) Number Name 34 35 36 37 38 39 40 41 42 43 44 45 46 47 P2.3 NC NC GND GND GND GND GND P2.2 P2.1 P2.0 P1.7 P1.6 P1.
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MeshConnect™ Sub-G Module Series SOFTWARE/FIRMWARE (Continued) • • • • • • • • • • • • • • • • • • • • • Self Healing (Orphan handling) Point-to-Point network formation Point-to-Multipoint (Star) network formation Mesh network formation* ACK Wakeup Modes (Si100X) Frequency Hopping Unicast Addressing using 16-bit device IDs Broadcast Addressing Packet Forwarding (Master node only) Forwarding Table Aging (Master node only) Listen Before Talk (LBT) RSSI Packet Filtering Pairing/Joining Network Synchronizat
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MeshConnect™ Sub-G Module Series MODULE Land footprint Note: Unless otherwise specified. Dimensions are in Inches [mm]. KEEP OUT 1.413 1.300 1.200 1.100 1.021 1.005 1 56 KEEP OUT 56X 0.50 x 0.040 Ø.0.150 0.050 PITCH 19 38 0.794 0.600 0.500 0.400 0.945 0.950 1.000 37 20 0.000 0.050 0.055 0.065 0.050 0.000 TOP VIEW EVALUATION BOARD CEL provides an Evaluation board to allow easy testing of the Module.
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MeshConnect™ Sub-G Module Series PROCESSING Recommended Reflow Profile Parameters Values Ramp up rate (from Tsoakmax to Tpeak) 3º/sec max Minimum Soak Temperature 150ºC Maximum Soak Temperature 200ºC Soak Time 60-120 sec TLiquidus 217ºC Time above TL 60-150 sec Tpeak 250ºC Time within 5º of Tpeak 20-30 sec Time from 25º to Tpeak 8 min max Ramp down rate 6ºC/sec max Pb-Free Solder Paste Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the s
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MeshConnect™ Sub-G Module Series PROCESSING (Continued) Hand Soldering Hand soldering is possible. When using a soldering iron, follow IPC recommendations (reference document IPC-7711) Rework The MeshConnect Module can be unsoldered from the host board. Use of a hot air rework tool should be programmable and the solder joint and module should not exceed the maximum peak reflow temperature of 250 ºC.
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MeshConnect™ Sub-G Module Series AGENCY CERTIFICATIONS (Continued) IC Certification — Industry Canada Statement The term "IC" before the certification / registration number only signifies that the Industry Canada technical specifications were met. This device complies with Industry Canada license-exempt RSS standard(s).
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MeshConnect™ Sub-G Module Series SHIPMENT, HANDLING, AND STORAGE Shipment The MeshConnect Modules are delivered in trays of 28. Handling The MeshConnect Modules are designed and packaged to be processed in an automated assembly line. Warning The MeshConnect Modules contain highly sensitive electronic circuitry. Handling without proper ESD protection may destroy or damage the module permanently. Warning The MeshConnect Modules are moisture-sensitive devices.
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MeshConnect™ Sub-G Module Series REFERENCES & REVISION HISTORY Previous Versions Changes to Current Version Page(s) 0008-00-07-00-000 (Issue ES) April 5, 2011 Initial preliminary datasheet. N/A 0008-00-07-00-000 (Issue ES) June 1st, 2011 IC Certification. N/A Disclaimer • The information in this document is current as of the published date. The information is subject to change without notice. For actual design-in, refer to the latest publications of CEL data sheets or data books, etc.