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ManualsBrandsCalifornia Eastern Laboratories ManualsElectronicsMeshConnectÂ™ EM357 Zigbee Module

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MeshConnect™ EM357 Module

DESCRIPTION

CEL’s MeshConnect™ EM357 Module combines high perfor-

mance RF solution with the market's premier ZigBee stack.

The addition of on board memory enables Over-The-Air (OTA)

programming without the need for additional in system memory.

The integrated power amplier maximizes range and perfor-

mance. The small module footprint makes it suitable for a wide

range of ZigBee applications. The MeshConnect EM357 mod-

ule is certied and qualied enabling customers to accelerate

time to market by greatly reducing the design and certication

phases of development.

CEL’s MeshConnect™ EM357 module (ZICM357P2-1) is

based on the Ember EM357 Zigbee compliant SOC IC. The IC

is a single-chip solution, compliant with ZigBee specications

and IEEE 802.15.4, a complete wireless solution for all ZigBee

applications. The IC consists of an RF transceiver with the

baseband modem, a hardwired MAC and an embedded 32-bit

ARM® Cortex™-M3 microcontroller with internal RAM (12kB)

and Flash (192kB) memory. The device provides numerous

general-purpose I/O pins and peripheral functions such as

timers and UARTs.

The MeshConnect EM357 module adds a power amplier (PA)

to increase range up to 2.5 miles, provide more reliable trans-

mission, and reduce the number of nodes in your network. It is

especially useful for open outdoor applications where the nodes

are physically far apart or for indoor use where the nodes have

to operate in a noisy RF environment. The Module’s outstand-

ing 120dB link budget ensures high quality connections even in

such harsh environments.

The MeshConnect EM357 module also integrates an 1MB

Flash memory for Over-The-Air program updates, making this

device ready for Smart Energy Applications.

Integrated Transceiver Modules for ZigBee/IEEE 802.15.4

Development Kit available: ZICM357P2-KIT1-1

The information in this document is subject to change without notice, please conrm data is current

Document No: 0008-00-07-00-000 (Issue A)

Date Published: January 21, 2011

DATA SHEET

ORDERING INFORMATION

Part Number Order Number Description

MeshConnect™

EM357 Module

ZICM357P2-1 +20 dBm Output power, PCB Trace antenna

ZICM357P2-1C +20 dBm Output power, with U.FL Connector for external antenna

ZICM357P2-KIT1-1 +20 dBm Engineering Development Kit

• FLASHMemory:

192 kB (EM357 internal)

1MB (on module board)

• 12kBSRAM

• 32-bitARM®Cortex™-M3

• Upto23GPIOPins

• SPI(Master/Slave),TWI,UART

• Timers,SerialWire/JTAGInterface

• 5-channel14-bitADC

MeshConnect

™

EM357 Module

ZICM357P2-1

Ember EM357 Transceiver Based Module

•HighRFperformance:

  Up to 120 dB RF Link Budget

RX Sensitivity: -100 dBm

RF TX Power: +20 dBm

•DataRate:250kbps

•Smallfootprint:1”x1.41” 

 (25.4 mm x 35.9 mm)

•AdvancedPowerManagement 

 Scheme w/ Deep Sleep Mode

FEATURES

•IntegratedPCBtraceantenna 

 Optional U.FL external Antenna

•15RFchannels

•Upto13,000feetofrange

•AESencryption

•FCC,CEandICcertications

•ROHScompliant

APPLICATIONS

• SmartEnergy/GridMarkets

Smart Meters

• Buildingautomationandcontrol

• Homeautomationandcontrol

Thermostats

Displays

Energy Management

Security Devices

HVAC control

Lighting control

• GeneralZigBeewireless

 sensornetworking

• Transmit power +20dBm

• 1MB additional ash for Over-The-Air programming

• +120 dB RF link budget

• Range up to 2.5 miles

Summary of content (15 pages)

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DATA SHEET MeshConnect™ EM357 Module ZICM357P2-1 Ember EM357 Transceiver Based Module Integrated Transceiver Modules for ZigBee / IEEE 802.15.4 Development Kit available: ZICM357P2-KIT1-1 DESCRIPTION CEL’s MeshConnect™ EM357 Module combines high performance RF solution with the market's premier ZigBee stack. The addition of on board memory enables Over-The-Air (OTA) programming without the need for additional in system memory. The integrated power amplifier maximizes range and performance.
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MeshConnect™ EM357 Module MODULE BLOCK DIAGRAM EM357 Module PWR Reg 24 MHz XTAL Flash 1MB Castellation Edge Connector SPI Bus ANT Ember EM357 Micro processor Radio Balun PA Balun DEVELOPMENT KIT CEL's Development Kit assists users in both evaluation and development. As a stand-alone radio system, the kit allows users to place the modules into the target environment and evaluate performance on-site. The Development Kit also serves as an invaluable aid in application development.
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MeshConnect™ EM357 Module TABLE OF CONTENTS Introduction and Overview Description.............................................................................................................................................................................................. 1 Features.................................................................................................................................................................................................. 1 Applications.................
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MeshConnect™ EM357 Module TRANSCEIVER IC The MeshConnect EM357 module uses the Ember EM357 transceiver IC. This IC incorporates the RF transceiver with the baseband modem, a hardwired MAC, and an embedded ARM® Cortex™-M3 microcontroller, offering an excellent low cost high performance solution for all IEEE 802.15.4 / ZigBee applications. For more information about the Ember EM357 IC, visit http://www.ember.
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MeshConnect™ EM357 Module ABSOLUTE MAXIMUM RATINGS Description MeshConnect™ EM357 Module Unit Min Max Power Supply Voltage (VDD) -0.3 3.6 VDC Voltage on any I/O Line -0.3 VDD + 0.3 VDC – 15 dBm -40 125 °C – 260 °C RF Input Power Storage Temperature Range Reflow Soldering Temperature Note: Exceeding the maximum ratings may cause permanent damage to the module or devices.
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MeshConnect™ EM357 Module PIN SIGNALS I/O PORT CONFIGURATION MeshConnect module has 56 edge I/O interfaces for connection to the user’s host board. The MeshConnect Module Dimensions shows the layout of the 56 edge castellations. MeshConnect I/O PIN ASSIGNMENTS CEL Ember MeshConnect EM357 IC Pin EM357 Module Number PIN Number Name Notes 1 2 3 4 5 6 7 8 9 49 N/C 21 22 24 25 49 16, 23, 28, 37 12 GROUND WP PA0 PA1 PA2 PA3 GROUND VCC RESET 10 13 PC6 11 14 PC7 Digital I/O OSC32A - 32.
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MeshConnect™ EM357 Module MeshConnect I/O PIN ASSIGNMENTS (Continued) CEL Ember MeshConnect EM357 IC Pin EM357 Module Number PIN Number Name 18 30 PB1 19 20 21 49 49 49 GROUND GROUND GROUND 22 31 PB2 23 32 JTCK 24 33 PC2 25 NC 26 34 PC3 27 35 PC4 28 49 GROUND 29 36 PB0 30 38 PC1 31 40 PC0 32 33 NC 41 PB7 Notes Digital I/O SC1MISO - SPI slave data out of Serial Controller 1 SC1MOSI - SPI master data out of Serial Controller 1 SC1SDA - TWI data of Serial Controller 1 SC
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MeshConnect™ EM357 Module MeshConnect I/O PIN ASSIGNMENTS (Continued) CEL Ember MeshConnect EM357 IC Pin EM357 Module Number PIN Number Name 34 42 PB6 35 43 PB5 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 49 49 49 GROUND GROUND GROUND NC NC NC NC NC NC GROUND GROUND GROUND GROUND GROUND GROUND GROUND GROUND GROUND GROUND GROUND GROUND 49 49 49 49 49 49 49 49 49 49 49 49 Notes Digital I/O ADC1 - ADC Input 1 IRQB - External interrupt source B TIM1C1 - Timer 1 channel 1 output TI
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MeshConnect™ EM357 Module MODULE DIMENSIONS MeshConnect™ EM357 Module w/PCB Trace Antenna EM357 Module RF Shield ZICM357P2 0000000000000 Pin 1 U1 C6A C1 L6 C6B C6 R2 C9 ARM R6 R5 C4A C17 EM357 Series C10 C22 R8 C5B C2 R4 1.413” C14 L2 R7 C24 R11 C23 0.903” R1 R10 L5 C11 L3 C13 L4 C20 C20 Pin 56 C21 C7 C7B C16 R9 XTAL1 C15 Pin 38 Pin 19 0.062” 1.000” 0.195” MeshConnect™ EM357 Module w/U.FL Connector for external antenna 0.
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MeshConnect™ EM357 Module MODULE LAND FOOTPRINT Note: Unless otherwise specified. Dimensions are in Inches [mm].
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MeshConnect™ EM357 Module PROCESSING Recommended Reflow Profile Parameters Values Ramp up rate (from Tsoakmax to Tpeak) 3º/sec max Minimum Soak Temperature 150ºC Maximum Soak Temperature 200ºC Soak Time 60-120 sec TLiquidus 217ºC Time above TL 60-150 sec Tpeak 250ºC Time within 5º of Tpeak 20-30 sec Time from 25º to Tpeak 8 min max Ramp down rate 6ºC/sec max Pb-Free Solder Paste Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering
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MeshConnect™ EM357 Module PROCESSING (Continued) Hand Soldering Hand soldering is possible. When using a soldering iron, follow IPC recommendations (reference document IPC-7711) Rework The MeshConnect Module can be unsoldered from the host board. Use of a hot air rework tool should be programmable and the solder joint and module should not exceed the maximum peak reflow temperature of 250 ºC.
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MeshConnect™ EM357 Module AGENCY CERTIFICATIONS (Continued) IC Certification — Industry Canada Statement The term "IC" before the certification / registration number only signifies that the Industry Canada technical specifications were met. Certification IC - Déclaration d'Industrie Canada Le terme "IC" devant le numéro de certification / d'enregistrement signifie seulement que les spécifications techniques Industrie Canada ont été respectées.
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MeshConnect™ EM357 Module SHIPMENT, HANDLING, AND STORAGE Shipment The MeshConnect Modules are delivered in trays of 28. Handling The MeshConnect Modules are designed and packaged to be processed in an automated assembly line. Warning The MeshConnect Modules contain highly sensitive electronic circuitry. Handling without proper ESD protection may destroy or damage the module permanently. Warning The MeshConnect Modules are moisture-sensitive devices.
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MeshConnect™ EM357 Module REFERENCES & REVISION HISTORY Previous Versions Changes to Current Version Page(s) 0008-00-07-00-000 (Issue ES) October 14, 2010 Initial preliminary datasheet. N/A 0008-00-07-00-000 (Issue A) January 21, 2011 Updated RF Channels to 15 for FCC Certification. Updated Pin out table. Updated processing guidelines. 1, 5 Disclaimer • The information in this document is current as of the published date. The information is subject to change without notice.