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ZICM2410P0

MeshConnect™ Module

DESCRIPTION

CEL's MeshConnect™ modules provide a high performance

and low cost RF transceiver solution for 2.4 GHz IEEE

802.15.4 / ZigBee data links and wireless networks.

CEL's MeshConnect radio module leverages the advanced

features of CEL’s ZIC2410 transceiver platform. The ZIC2410

is a true single-chip solution, compliant with ZigBee specica-

tions and IEEE 802.15.4, a complete wireless solution for all

ZigBee applications. The ZIC2410 consists of an RF transceiv-

er with baseband modem, a hardwired MAC and an embed-

ded 8051 microcontroller with internal Flash memory. The

device provides numerous general-purpose I/O pins, periph-

eral functions such as timers and UART and is one of the rst

devices to provide an embedded Voice CODEC. This device is

also ideal for low power applications.

Unique in the market, the ZIC2410 offers extended data rates,

supporting 500 kbps and 1 Mbps modes of operation. When

combined with the voice codec the ZICM2410’s high speed

modes offers an excellent voice platform. The high level of

integration reduces component count, lowers power consump-

tion, and reduces overall system costs.

Integrated Transceiver Modules for ZigBee / IEEE 802.15.4

Evaluation Kit available: ZICM2410P0-KIT1-1

The information in this document is subject to change without notice, please conrm data is current

Document No: 0007-00-07-00-000 (Issue B)

Date Published: May 14, 2009

PRELIMINARY DATA SHEET

CEL's MeshConnect™ Module Platform

APPLICATIONS

ORDERING INFORMATION

Part Number Order Number Supplying Form

ZICM2410P0 Series

MeshConnect™ Module

ZICM2410P0-1

4 mW Output power, PCB Trace Antenna

ZICM2410P0-1C

4 mW Output power, with U.FL Connector for external antenna

ZICM2410P0-KIT1-1 Engineering Development Kit

• High RF performance

- 103dB RF Link Budget

- RX Sensitivity: -97 dBm @1.5V

- RF TX Power: +6dBm @1.5V

• Scalable Data Rate: 250kbps for ZigBee, 500kbps and 1Mbps

• Miniature footprint: 1” x 1.350” (25.4 mm x 34.3 mm)

• Voice Codec Support: µ-law/a-law/ADPCM

FEATURES

Home &

Building Automation

• Security

• HVAC control

• Lighting control

• Thermostats

Industrial Controls

• Food processing controls

• Trafc Management

• Sensor Networks

• Asset Management

• Barcode reader

• Patient Monitoring

• Glucose monitor

• 4 Level Power Management Scheme w/ Deep Sleep Mode (0.3µA)

• Integrated PCB trace antenna

• 16 RF channels

• Over 3000 feet of range

• AES 128-bit encryption

• FCC, CE and IC certications (pending)

• ROHS compliant

• 96 kB FLASH Memory

• 8 kB SRAM

• 8051 compatible single-cycle

microcontroller core

• 22 GPIO Ports

• SPI (Master/Slave) + UART

• I

S/PCM Interface with two

128-byte FIFOs

• µ-law/a-law/ADPCM Voice Codec

• 4-channel 8-bit ADC

Summary of content (16 pages)

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PRELIMINARY DATA SHEET MeshConnect™ Module ZICM2410P0 Integrated Transceiver Modules for ZigBee / IEEE 802.15.4 Evaluation Kit available: ZICM2410P0-KIT1-1 DESCRIPTION CEL's MeshConnect™ Module Platform CEL's MeshConnect™ modules provide a high performance and low cost RF transceiver solution for 2.4 GHz IEEE 802.15.4 / ZigBee data links and wireless networks. CEL's MeshConnect radio module leverages the advanced features of CEL’s ZIC2410 transceiver platform.
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MeshConnect™ Module MODULE BLOCK DIAGRAM 16 MHz XTAL PWR Reg Castellation Edge Connector ANT MeshConnect ZIC2410 Micro processor 32.768 kHz XTAL Radio MeshConnect™ Module DEVELOPMENT KIT CEL's MeshConnect Development Kit (ZICM2410P0-KIT1-1) assist users in both evaluation and development. As a stand-alone radio system, the kit allows users to place the modules in to the target environment and evaluate performance on-site.
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MeshConnect™ Module TABLE OF CONTENTS Introduction and Overview Description.............................................................................................................................................................................................. 1 Features.................................................................................................................................................................................................. 1 Applications.......................
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MeshConnect™ Module TRANSCEIVER IC A true monolithic solution, the CEL ZIC2410 IEEE 802.15.4/ZigBee IC incorporates the RF transceiver with baseband modem, a hardwired MAC, and an embedded 8051 microcontroller, offering an excellent low cost high performance solution for all IEEE 802.15.4 / ZigBee applications. PS/2 ADPCM Voice FIFFO RF TX MAC RF RX UART/2 MODEM SPI a-law μ-law DMA AES Engine PLL WDT Temp.
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MeshConnect™ Module ANTENNA CEL's MeshConnect modules include an integrated Printed Circuit Board (PCB) trace antenna. An optional u.FL connector can be specified, providing connection to a 50-ohm external antenna of the user’s choice. See Ordering Information on page 1. The PCB antenna employs an F-Antenna topology that is compact and supports an omni-directional radiation pattern. To maximize antenna efficiency, an adequate ground plane must be provided on the host PCB.
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MeshConnect™ Module POWER AMPLIFIER The MeshConnect module does not incorporate an external Power Amplifier and therefore the RF output port is connected directly (through matching components) to the RF antenna. As CEL’s ZIC2410 IEEE 802.15.4 / ZigBee transceiver already offers the industry’s best link budget at 106 dB, even without an external PA the MeshConnect can maintain wireless connection over long distance (3000 ft line-of-sight).
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MeshConnect™ Module SOFTWARE TOOLS (Continued) DEVICE PROGRAMMER • Device Programmer is used to program the application firmware to the on-chip Flash program memory of the ZIC2410 device. • Device Programmer supports: • ISP Mode: Download the firmware from the host PC via serial communication through the ZIC2410’s UART1 interface.
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MeshConnect™ Module ABSOLUTE MAXIMUM RATINGS Description Min Max Unit Power Supply Voltage (Vcc) -0.3 3.3 VDC Voltage on any digital pin -0.3 3.3 VDC 10 dBm 125 °C 260 °C Input RF Level Storage Temperature -55 Reflow Soldering Temperature Note: Exceeding the maximum ratings may cause permanent damage to the module or devices. RECOMMENDED (OPERATING CONDITIONS) Description Min Typ Operating ambient temperature range, TA -40 25 Operating Supply Voltage 2.
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MeshConnect™ Module PIN SIGNALS I/O PORT CONFIGURATION MeshConnect module has 56 edge I/O interfaces for connection to the user’s host board. The MeshConnect Module Dimensions shows the layout of the 56 edge castellations. MeshConnect I/O PIN ASSIGNMENTS Pin # Name Type 1 GND4 RF GND RF Ground Description 2 GND3 RF GND RF Ground Mode Select, Bit #1.
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MeshConnect™ Module MeshConnect I/O PIN ASSIGNMENTS (Continued) Pin # Name Type Description IC Pin # 31 P3_3 Digital I/O 8051 GPIO P3.3 Alternate Functions: INT1 (Active Low) 31 32 P3_2 Digital I/O 8051 GPIO P3.2 Alternate Functions: INT0 (Active Low) 32 33 GND11 GND Digital Ground 49 33 34 P3_1 Digital I/O 8051 GPIO P3.1 Alternate Functions: TXD0 / QUADXB 35 P3_0 Digital I/O 8051 GPIO P3.
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MeshConnect™ Module MODULE DIMENSIONS MeshConnect ZICM2410P0-1C 0.111” ZICM2410P0 0007000000001 J2 0R C25 Pin 1 RF Shield R1 R7 U1 C14 L2 C24 C5B C6A C1 L6 C6B C6 R2 ZIC2410 QN48 C9 C10 R5 C4A C17 C2 R4 C16 R9 R6 C22 R8 L5 C11 L3 C13 L4 R11 C23 1.350” R10 0.895” C7B C20 Pin 56 C21 C7 XTAL1 C15 Pin 38 Pin 19 1.000” 0.193” 0.
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MeshConnect™ Module MODULE LAND FOOTPRINT Note: Unless otherwise specified. Dimensions are in Inches [mm]. 1.100 [27.94] 1.000 [25.41] 0.050 [1.27] COPPER KEEPOUT 0.298 [27.94] 0.050 [1.27] Pitch 0.940 [23.88] 1.055 [26.80] 56 x 0.040 [1.02] 56 x 0.100 [2.54] 0.105 [2.67] 0.990 [22.
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MeshConnect™ Module PROCESSING Recommended Reflow Profile Parameters Values Ramp up rate (from Tsoakmax to Tpeak) 3º/sec max Minimum Soak Temperature 150ºC Maximum Soak Temperature 200ºC Soak Time 60-120 sec TLiquidus 217ºC Time above TL 60-150 sec Tpeak 260 + 0ºC Time within 5º of Tpeak 20-30 sec Time from 25º to Tpeak 8 min max Ramp down rate 6ºC/sec max Achieve the brightest possible solder fillets with a good shape and low contact angle.
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MeshConnect™ Module PROCESSING (Continued) Hand Soldering Hand soldering is possible. Use a soldering iron temperature setting equivalent to 350°C, follow IPC recommendations/ reference document IPC-7711. Rework The MeshConnect Module can be unsoldered from the host board. Use of a hot air rework tool and hot plate for pre-heating from underneath is recommended. Avoid overheating. Warning Never attempt a rework on the module itself, e.g. replacing individual components.
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MeshConnect™ Module AGENCY CERTIFICATIONS (Continued) IC Certification — Industry Canada Statement The term "IC" before the certification / registration number only signifies that the Industry Canada technical specifications were met. Section 14 of RSS-210 The installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit RF field in excess of Health Canada limits for the general population.
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MeshConnect™ Module REFERENCES & REVISION HISTORY Previous Versions Changes to Current Version 0007-00-07-00-000 (Issue A) February 05, 2009 Initial preliminary datasheet. 0007-00-07-00-000 (Issue B) May 14, 2009 Agency Certification Page(s) N/A 14, 15 • The information in this document is current as of May, 2009. The information is subject to change without Disclaimer notice. For actual design-in, refer to the latest publications of CEL data sheets or data books, etc.