Shenzhen Core (SMIC Technology Co., Ltd SHENZHENSHI XINZHONGXIN TECHNOLOGY CO., LTD. C-3L-M. C-3L-M product specifications (WiFi &B LE module) Product model: C-3L-M Document number: X ZX_RD_SP_C-3L-M _V1.2 Hardware version: V 1.0 Document version: V 1.
Shenzhen Core (SMIC Technology Co., Ltd SHENZHENSHI XINZHONGXIN TECHNOLOGY CO., LTD. C-3L-M. File include (C-CHIP) confidential documents, without permission, can not be disclosed. Change record Change History: Vers ion Change record Revised content Page times V1.0. First time, when formulated V1.2.
Shenzhen Core (SMIC Technology Co., Ltd SHENZHENSHI XINZHONGXIN TECHNOLOGY CO., LTD. C-3L-M. 1 Summary Summary C-3L-M integrates Bluetooth dual-mode 5.1 and Wi-Fi 802.11n with BK7231M chips. Integrate hardware and software resources required to complete complete Wi-Fi and Bluetooth applications, can support AP and STA dual-role connectivity, and both classic and low-power Bluetooth connectivity.
Shenzhen Core (SMIC Technology Co., Ltd SHENZHENSHI XINZHONGXIN TECHNOLOGY CO., LTD. C-3L-M. MCU speeds are up to 120 MHz high-speed or low-power clocks 256 KB Internal RAM Six-way highway 10-bit multi-channel ADC, 2MB or 4MB internal Flash UART or SPI download 50 MHz clock frequency SDIO High-speed SPI interface Dual I2C interface Six-way 32-bit counter and a low-power counter and supports internal filtering to 16 bits 32-Bytes eFUSE • 256 Byte ~ 2 KByte OTP.
Shenzhen Core (SMIC Technology Co., Ltd SHENZHENSHI XINZHONGXIN TECHNOLOGY CO., LTD. C-3L-M. 4 Block diagram Module block diagram 5 Performance parameter, P erformance P arameter 5.1 Modulparameters Wireless standard The antenna is available Frequency range Emission power Modulparameters WIFI 802.11b /g/n,1T1R. Built-in antenna 2.402GHz-2.484GHz. IEEE802.11b <17 dBm. IEEE802.11g <14 dBm. IEEE802.11n <13 dBm. BLE <6dbm.
Shenzhen Core (SMIC Technology Co., Ltd C-3L-M. SHENZHENSHI XINZHONGXIN TECHNOLOGY CO., LTD. Receiving sensitivity Wireless network type WIFI distance Extended the interface Safety mechanism Encryption type Upgrade online Dimensions Certification information 11b <-90dB. 11g <-73dB. 11n <-71dB. BLE <-95dB. STA/AP/AP + STA. >, 100 m UART,GPIO,ADC,PWM,I2C,. W EP,WPA-PSK/WPA 2_PSK,WPA/WPA2. WEP64/WEP128/AES. Support for this system 16±0.35mm (W)×24±0.35mm (L) × 2.8±0.15mm (H) SMD. In certification 5.
Shenzhen Core (SMIC Technology Co., Ltd SHENZHENSHI XINZHONGXIN TECHNOLOGY CO., LTD. C-3L-M. 6 Module dimension diagram and foot position definition Mechanical Size and Pin Definition 6.1 Module size diagram Address: Building A3, Shajing East Ring Industrial Zone, Baoan District, Shenzhen City Tel: 0755-29179480 / 81 / 82 Fax: 0755-84736169 Company website: WWW.C-CHIP.COM.
Shenzhen Core (SMIC Technology Co., Ltd SHENZHENSHI XINZHONGXIN TECHNOLOGY CO., LTD. C-3L-M. Address: Building A3, Shajing East Ring Industrial Zone, Baoan District, Shenzhen City Tel: 0755-29179480 / 81 / 82 Fax: 0755-84736169 Company website: WWW.C-CHIP.COM.
Shenzhen Core (SMIC Technology Co., Ltd SHENZHENSHI XINZHONGXIN TECHNOLOGY CO., LTD. C-3L-M. 6.2 Foot in description Pin . 1 Name. P in Type. I. Description. 3 RST. P23_ADC/TDO . EN. 4 P14. I/O. P14. 5 6 7 8 9 10 11 12 13 14 15 16 PWM5. PWM4. PWM0. 3V3. GND. PWM3. UART2. P16. PWM2. PWM1. 1RX. 1TX. I/O. I/O. I/O. P. G. I/O. I/O. I/O. I/O. I/O. I/O. I/O. PWM5. PWM4. PWM0. Power input(3.3V-3.6V) GND. PWM3. UART2. P16. PWM2. PWM1. 1RX. 1TX. 2 I/O. I. reset,active low. P23 or ADC or JTAG TDO.
Shenzhen Core (SMIC Technology Co., Ltd SHENZHENSHI XINZHONGXIN TECHNOLOGY CO., LTD. C-3L-M. 2. O:Output. 3. P:Power. 4. G:Ground. 7 Note Application Note A. In the use of the module, please pay attention to avoid the influence of the power amplifier, booster line, DC/DC circuit and other interference sources on the module, to avoid the module power supply circuit and the high power circuit unit, and reduce the interference B. If there is a battery, metal, LCD, horn, etc.
Shenzhen Core (SMIC Technology Co., Ltd SHENZHENSHI XINZHONGXIN TECHNOLOGY CO., LTD. C-3L-M. Key features of the profile:. -Initial Ramp=1-2.5 ℃ / sec to 175 ℃ equilibrium. -Equilibrium time=60 to 80 seconds. -Ramp to Maximum temperature (250 ℃) =3 ℃ / sec Max. -Time above liquidus temperature(217 ℃): 45-90 seconds. -Device absolute maximum reflow temperature: 250 ℃.
Shenzhen Core (SMIC Technology Co., Ltd SHENZHENSHI XINZHONGXIN TECHNOLOGY CO., LTD. C-3L-M. FCC Statements (OEM) Integrator has to assure compliance of the entire end-product incl. the integrated RF Module. For 15 B (§15.107 and if applicable §15.109) compliance, the host manufacturer is required to show compliance with 15 while the module is installed and operating.
Shenzhen Core (SMIC Technology Co., Ltd SHENZHENSHI XINZHONGXIN TECHNOLOGY CO., LTD. C-3L-M. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.
