Frey M1 Module 18 July 2016 Version 2.0 Page 1 BitaTek Co., Ltd. Copyright protected. All rights reserved. NO. 115 Wugong 3rd Rd., Wugu Dist., New Taipei City 248, Taiwan (R.O.C.
Contents Charpt 1. Revision History ..................................................................... 4 Charpt 2. Charpt 3. 3.1. 3.1.1. 3.1.2. 3.1.3. 3.1.4. 3.1.5. 3.1.6. 3.1.7. 3.1.8. 3.1.9. 3.2. 3.3. 3.4. Introduction ............................................................................ 5 Product Concept .................................................................... 6 Main Feature.......................................................................... 6 Chipset on module ............
4.2.1. 4.2.2. 4.2.3. 4.2.4. 4.3. 4.3.1. 4.3.2. 4.4. 4.4.1. 4.4.2. 4.5. 4.6. 4.6.1. 4.6.2. 4.6.3. Charpt 5. 5.1. 5.2. 5.2.1. 5.3. 5.4. 5.5. 5.6. 5.6.1. 5.6.2. 5.6.3. Charpt 6. 6.1. 6.2. Charpt 7. 7.1. 7.2. General Stencil Considerations ........................................... 44 Used Parameters and Recommendations ........................... 45 Pick and Place ..................................................................... 45 Reflow Profile...........................................................
Charpt 1. Revision History Changes to the original manual are listed below: Version Date Description 1.00 2016/06/21 Initial release 2.00 2016/7/18 Update FCC statement Page 4 BitaTek Co., Ltd. Copyright protected. All rights reserved. NO. 115 Wugong 3rd Rd., Wugu Dist., New Taipei City 248, Taiwan (R.O.C.
Charpt 2. Introduction This document defines the specification for FREY M1. FREY M1 is a smart module for handheld device and builds in Bluetooth, WiFi and GPS function. It also can support SD card, LCM , Touch Screen , Audio , dual camera , Flash LED , Accelerometer / Magnetometer / Gyroscope / Proximity & Light Sensor functions through application design board. Page 5 BitaTek Co., Ltd. Copyright protected. All rights reserved. NO. 115 Wugong 3rd Rd., Wugu Dist., New Taipei City 248, Taiwan (R.O.C.
Charpt 3. Product Concept 3.1. Main Feature 3.1.1. Chipset on module Digital processor : APQ8052 (ARM Cortex-A53 octa cores) Quad core at 1.516 GHz, 512 kB L2 cache Quad core at 1.209 GHz, 512 kB L2 cache Power management : PM8952 and PMI8952 WLAN/BT/FM : WCN3680B WLAN IEEE 802.11a/b/g/n/ac dual bands Bluetooth V2.1BER/EDR+3.0HS+4.1 LE FM RDS & RBDS, RX only GPS : WGR7640 GPS, Glonass , Galileo or Beidou 3.1.2. Memory eMCP , 2GB LPDDR3 RAM plus 16GB eMMC Flash ROM 3.1.3.
3.1.4. Audio (PM8952 codec ) Support two Microphones interface with noise cancellation Support one speaker interface Support one receiver interface Support one audio jack interface Support one vibrator control interface 3.1.5. Expansion Slot Interface One micro SD Memory slot interface with SDHC UIM interface x1 3.1.6. USB Support one USB OTG 3.1.7. Keypad Support 5x5 Key matrix 3.1.8. Dimension 44 x 33.6 x 2.7 mm 3.1.9. Operation temperature Item Min. Typ. Max.
3.2. Module Block Diagram 3.3. Pin Definition Pin AI : Analog input ; AO : Analog output ; DI : Digital input ; DO : Digital output PI : Power input ; PO : Power output Pin Name Number Wakeup Pad Functional description Type Power W18 Input power from selected USB_VBUS_IN PI, PO source, or output during USB-OTG. W19 Input power from selected USB_VBUS_IN PI, PO source, or output during USB-OTG.
USB-OTG. X19 Input power from selected USB_VBUS_IN PI, PO source, or output during USB-OTG.
P20 VCOIN PI, PO For RTC battery. DO Buffered baseband Clock F17 PM8952_BB_CLK2 (low-power) XO clock 2 System W17 DI Internal pull-up to dVdd; keep C load < 10 pF. Dual function: 1. Keypad power on; KYPD_PWR_N initiates power on when grounded 2.
V17 V19 PA_THERM AI PMI8952_USB_EN DO AMUX input – PA thermistor divider Enable USB path from external power multiplexer Y18 PMI8952_USB_SNS AI USB input voltage sense pin from external power multiplexer V18 PMI8952_DC_EN DO Enable 2nd power path from external power multiplexer Y19 PMI8952_DC_SNS AI 2nd power voltage sense to determine in or out of valid range Z16 Keep it floating and doesn't NC NC H18 MIC_BIAS1 AO Microphone bias #1 I18 MIC_BIAS2 AO Microphone bias #2 H19 MI
output, plus (+) Vibrator Y15 Y14 HAP_OUT_N HAP_OUT_P AO Vibrator driver output negative AO Vibrator driver output positive SD V1 X2 W1 V2 V3 W2 SDC2_CLK SDC2_CMD SDC2_DATA_0 SDC2_DATA_1 SDC2_DATA_2 SDC2_DATA_3 DO Secure digital controller 2 clock DI,DO Secure digital controller 2 command DI,DO Secure digital controller 2 data bit 0 DI,DO Secure digital controller 2 data bit 1 DI,DO Secure digital controller 2 data bit 2 DI,DO Secure digital controller 2 data bit 3 USB Z15
transactions LED driver X9 VREG_WLED_ANOD PO LCM WLED boost output AO WLED low-side current sink E Y13 WLED_SINK1 input, string 1 Z14 WLED_SINK2 AO WLED low-side current sink input, string 2 Y12 WLED_SINK3 AO WLED low-side current sink input, string 3 Z12 WLED_SINK4 AO WLED low-side current sink input, string 4 W14 WLED_CABC DI Content adaptive backlight control (CABC); PWM signal from display controller for dynamic dimming of LCD X16 Z17 Y17 FLASH_LED1 FLASH_LED2 CHARGE_LED_RE
K1 MIPI_DSI_LN2_N DO MIPI DSI data2 negative J1 MIPI_DSI_LN2_P DO MIPI DSI data2 positive L2 MIPI_DSI_LN3_N DO MIPI DSI data3 negative L3 MIPI_DSI_LN3_P DO MIPI DSI data3 positive P3 MIPI_CSI0_CLK_N DI MIPI CSI clock negative P2 MIPI_CSI0_CLK_P DI MIPI CSI0 clock positive Q2 MIPI_CSI0_LN0_N DI MIPI CSI0 data0 negative Q3 MIPI_CSI0_LN0_P DI MIPI CSI0 data0 positive R2 MIPI_CSI0_LN2_N DI MIPI CSI0 data1 negative S2 MIPI_CSI0_LN2_P DI MIPI CSI0 data1 positive S1 MIPI_CS
configurable as analog outputs X13 MPP 1. Configurable as digital I/Os 2. Analog multiplexer inputs PMI8952_MPP_2 3. Even MPPs configurable as current sinks; odd MPPs configurable as analog outputs W13 PMI8952_MPP_3 MPP 1. Configurable as digital I/Os 2. Analog multiplexer inputs 3. Even MPPs configurable as current sinks; odd MPPs configurable as analog outputs G16 1. Configurable as digital I/Os 2. Level-translating bidirectional I/Os PM8952_MPP_02 MPP 3. Analog multiplexer inputs 4.
2. Level-translating bidirectional I/Os 3. Analog multiplexer inputs 4. Even MPPs can be current sinks and odd MPPs can be VREF buffer outputs GPIO E2 GPIO_0 GPIO 1. Configurable I/O 2. BLSP1_SPI_MOSI 3. BLSP1_UART_TX F2 GPIO 1. Configurable I/O 2. BLSP3_SPI_CS_N GPIO_1 3. BLSP3_I2C_SDA 4. GP_CLK_2B E3 GPIO_2 V GPIO 1. Configurable I/O 2. BLSP8_SPI_MISO F3 GPIO_3 GPIO 1. Configurable I/O 2. BLSP1_SPI_CLK 3. BLSP1_UART_RFR_N 4. BLSP1_I2C_SCL U4 GPIO_4 GPIO 1. Configurable I/O 2.
4. BLSP2_I2C_SCL 5. GP_PDM_2A I3 GPIO_8 GPIO 1. Configurable I/O H2 GPIO_9 GPIO 1. Configurable I/O G3 GPIO_10 GPIO 1. Configurable I/O V 2. BLSP1_SPI_MISO 3. BLSP1_UART_RX G2 GPIO 1. Configurable I/O 2. BLSP3_SPI_CLK GPIO_11 3. BLSP3_I2C_SCL 4. GP_CLK_3B D4 GPIO_12 V GPIO 1. Configurable I/O 2. BLSP4_SPI_MOSI 3. MI2S_2_D0 D1 V GPIO GPIO_13 1. Configurable I/O 2. BLSP4_SPI_MISO 3. MI2S_2_D1 F1 GPIO GPIO_14 1. Configurable I/O 2. BLSP4_SPI_CS_N 3.
4. BLSP5_I2C_SCL V9 GPIO 1. Configurable I/O 2. BLSP6_SPI_MOSI GPIO_20 3. BLSP6_UART_TX 4. GP_PDM_1B W9 V GPIO GPIO_21 1. Configurable I/O 2. BLSP6_SPI_MISO 3. BLSP6_UART_RX T15 GPIO_22 GPIO 1. Configurable I/O 2. BLSP6_SPI_CS_N 3. BLSP6_UART_CTS_N 4. BLSP6_I2C_SDA T16 C1 GPIO_23 GPIO_24 G1 GPIO 1. Configurable I/O GPIO 1. Configurable I/O 2. SDE_VSYNC_P V GPIO 1. Configurable I/O 2. SDE_VSYNC_S GPIO_25 3. PRI_MI2S_MCLK_A 4. SEC_MI2S_MCLK_A T12 Y9 T13 GPIO_26 GPIO_27 GPIO 1.
W11 GPIO_36 V GPIO 1. Configurable I/O W8 GPIO_37 V GPIO 1. Configurable I/O V8 GPIO_38 V GPIO 1. Configurable I/O Z8 GPIO_39 GPIO 1. Configurable I/O 2. CCI_ASYNC0 3. GP_MN Z13 GPIO_40 GPIO 1. Configurable I/O X11 GPIO_41 GPIO 1. Configurable I/O 2. SD_WRITE_PROTECT Z10 Y10 GPIO_42 GPIO_43 V GPIO 1. Configurable I/O 2. GP_CLK_1A V GPIO 1. Configurable I/O 2. GP_CLK_2A V12 GPIO_44 V GPIO 1. Configurable I/O 2. GP_CLK_3A T9 GPIO_45 V GPIO 1. Configurable I/O 2.
E12 GPIO_60 GPIO 1. Configurable I/O G12 GPIO_61 GPIO 1. Configurable I/O G11 GPIO_62 GPIO 1. Configurable I/O GPIO 1. Configurable I/O T11 V GPIO_63 U13 GPIO_64 H6 GPIO_65 T14 GPIO_67 H3 GPIO_68 H4 GPIO_85 D5 2. CAM_MCLK0 GPIO 1. Configurable I/O V GPIO 1. Configurable I/O V GPIO 1. Configurable I/O GPIO 1. Configurable I/O GPIO 1. Configurable I/O GPIO_86 GPIO 1. Configurable I/O E5 GPIO_87 GPIO 1. Configurable I/O C5 GPIO_88 GPIO 1.
2. BLSP8_SPI_MOSI C6 GPIO_97 GPIO 1. Configurable I/O 2. BLSP1_SPI_CS_N 3. BLSP1_UART_CTS_N 4. BLSP1_I2C_SDA D6 GPIO_98 GPIO 1. Configurable I/O 2. MI2S_1_D1 C3 1. Configurable I/O GPIO_99 GPIO 2. BLSP8_I2C_SCL 3. BLSP8_SPI_CLK D12 E11 C10 GPIO_100 GPIO_101 GPIO_102 GPIO 1. Configurable I/O 2. GRFC_0 GPIO 1. Configurable I/O 2. GRFC_1 GPIO 1. Configurable I/O 2. GRFC_2 D11 GPIO_103 GPIO 1. Configurable I/O 2. GRFC_3 D10 GPIO_104 GPIO 1. Configurable I/O 2.
F8 E8 G8 GPIO_118 GPIO_119 GPIO_120 GPIO 1.Configurable I/O 2. RFFE1_CLK GPIO 1.Configurable I/O 2. RFFE1_DATA GPIO 1. Configurable I/O 2. RFFE2_CLK G7 GPIO_121 GPIO 1. Configurable I/O 2. RFFE2_DATA G6 GPIO_122 GPIO 1. Configurable I/O 2. RFFE4_CLK G5 GPIO_123 GPIO 1. Configurable I/O 2. RFFE4_DATA H5 GPIO_124 GPIO 1. Configurable I/O 2. RFFE5_CLK F5 GPIO_125 GPIO 1. Configurable I/O 2. RFFE5_DATA H7 GPIO_126 GPIO 1. Configurable I/O 2. RFFE3_CLK F4 GPIO_127 GPIO 1.
A1 GND GND A3 GND GND A6 GND GND A7 GND GND A8 GND GND A9 GND GND A10 GND GND A11 GND GND A12 GND GND A14 GND GND A15 GND GND A16 GND GND A17 GND GND A18 GND GND A20 GND GND B1 GND GND B2 GND GND B3 GND GND B6 GND GND B7 GND GND B8 GND GND B9 GND GND B12 GND GND B13 GND GND B14 GND GND B15 GND GND B16 GND GND B17 GND GND B18 GND GND B19 GND GND B20 GND GND C7 GND GND C8 GND GND C9 GND GND C11 GND GND Pag
C12 GND GND C13 GND GND C14 GND GND C20 GND GND D7 GND GND D8 GND GND D9 GND GND D13 GND GND D14 GND GND D20 GND GND E6 GND GND E7 GND GND E9 GND GND E17 GND GND E18 GND GND E19 GND GND E20 GND GND F7 GND GND F9 GND GND F18 GND GND F19 GND GND F20 GND GND G13 GND GND G14 GND GND G17 GND GND G18 GND GND G19 GND GND G20 GND GND H1 GND GND H9 GND GND H15 GND GND H17 GND GND I19 GND GND I20 GND GND J18 GND GN
K19 GND GND M18 GND GND M20 GND GND O18 GND GND O19 GND GND O20 GND GND Q18 GND GND Q19 GND GND Q20 GND GND R3 GND GND R20 GND GND S3 GND GND S18 GND GND S19 GND GND S20 GND GND T1 GND GND T2 GND GND T5 GND GND T6 GND GND T7 GND GND T10 GND GND U1 GND GND U2 GND GND U3 GND GND U5 GND GND U6 GND GND U7 GND GND U10 GND GND U11 GND GND U12 GND GND U20 GND GND V5 GND GND V6 GND GND V7 GND GND V11 GND GND Pag
W5 GND GND W6 GND GND W7 GND GND X1 GND GND X4 GND GND X5 GND GND X6 GND GND X7 GND GND Y1 GND GND Y2 GND GND Y3 GND GND Y4 GND GND Y5 GND GND Y6 GND GND Y7 GND GND Y20 GND GND Z1 GND GND Z2 GND GND Z3 GND GND Z4 GND GND Z5 GND GND Z6 GND GND Z7 GND GND Z20 GND GND AA1 GND GND AA2 GND GND AA3 GND GND AA4 GND GND AA5 GND GND AA6 GND GND AA7 GND GND AA8 GND GND AA9 GND GND AA10 GND GND AA11 GND GND Page 26
AA12 GND GND AA13 GND GND AA14 GND GND AA15 GND GND AA16 GND GND AA17 GND GND AA20 GND GND 3.4. Pad assignments (Top view) Page 27 BitaTek Co., Ltd. Copyright protected. All rights reserved. NO. 115 Wugong 3rd Rd., Wugu Dist., New Taipei City 248, Taiwan (R.O.C.
3.5. Electrical Specification 3.5.1. Input power specification Absolute maximum rating: Operating FREY M1 under conditions beyond its absolute maximum ratings may damage the device. Absolute maximum ratings are limiting values to be considered individually when all other parameters are within their specified operating ranges. Functional operation and specification compliance under any absolute maximum condition, or after exposure to any of these conditions, is not guaranteed or implied.
Battery charger: The FREY M1 features a fully programmable switch-mode battery charger, input power and output power controller for terminal devices. The device is designed to be used in conjunction with systems using single-cell Li-ion and Li-polymer battery packs. Parameter Conditions Min Typ Max Units Peak switching current USB_IN = 9.0 V - 4 - A Maximum DC output USB_IN = 9.0 V - 3 - A Switching frequency 0.95 1.0 1.05 MHz OTG output voltage 4.85 5.00 5.15 V 1.
PMOS 1.800 1.800 300 LDO APQ DSI PLL and OTP, Camera, VREG_L6 Touch screen, Display, and sensors VREG_L10 VREG_L11 PMOS 2.850 150 Sensors 2.950 2.950 800 Micro SD 2.950 1.800/2.950 150 APQ pad LDO PMOS LDO PMOS VREG_L12 2.850 LDO group 2 and SDC2 PMOS 1.800 1.800/3.300 50 LDO APQ pad group 5, VREG_L14 dual-voltage UIM1, and NFC VREG_L16 PMOS 1.800 5 2.850 2.850 600 PMIC HKADC LDO PMOS VREG_L17 1.
LDO performance specifications Parameter Comments Min Typ Max Units Output voltage All NMOS 12.5 mV steps 0.375 - 1.5375 V All PMOS 12.5 V steps 1.75 - 3.
3.5.3. Current consumption Item Test condition Max. Units Off mode current Module is turned off 250 uA Flight mode current Module is turned on and in sleep mode 4.5 mA and all RF is turned off WiFi TX current 2.4G, 11b, 11 Mbps, 15 dBm 250 mA WiFi RX current 2.4G 130 mA WiFi TX current 5G, 11a, 54 Mbps, 15 dBm 250 mA WiFi RX current 5G 130 mA BT TX current class 2 , 2dBm 150 mA 130 mA BT RX current Note 1. The measurement is at VBAT of module and VBAT=3.8V . Note 2.
Table 3.5.4.2 SDC2,UIM Parameter Min. Max. Unit Common to UIM pads at either voltage (VDD_PX= VREG_L14) VIH High-level input voltage 0.7 × VDD_PX VDD_PX + 0.3 V VIL Low-level input voltage 0 0.2 × VDD_PX V VOH High-level output voltage 0.8 × VDD_PX VDD_PX V VOL Low-level output voltage 0 0.4 V VDD_PX + 0.3 V 0 0.25 × VDD_PX V SDC2 pads at 2.95 V only(VDD_PX= VREG_L12) VIH High-level input voltage 0.625 × VDD_PX VIL Low-level input voltage VOH High-level output voltage 0.
3.5.5. Coin-cell charging Parameter Target regulator Condition VIN > 3.3 V, ICHG = 100 µA Min Typ Max Unit 2.50 3.10 3.25 V voltage(*) (*) Valid regulator voltage settings are 2.5, 3.0, 3.1, and 3.2 V. 3.5.6. Audio All audio codec performance data are collected above Vbatt of 3.7 V, unless otherwise specified. Inputs and Tx processing All Tx performance parameters are measured with a 1.
input; analog input = 0 Vrms, terminated with 0 Ω Terminate inputs with 0 Ω; gain = 0 dB 75 95 - dB 75 95 - dB 60 97 dB Input impedance Input disabled 3 - - MΩ Input capacitance Capless input - - 15 pF Conditions Min Typ Max Units f = 1.02 kHz, 0 dBFS input, 120.0 127.0 - mW 160.0 172.0 - mW 150.0 160.0 - mW 10.7 32.0 50000 Ω - - 500 pF 1.0 - - MΩ 1.52 1.60 1.68 V Outputs and Rx processing Parameter Earpiece Output power 6 dB gain mode, 32 Ω f = 1.
Output power f = 1.02 kHz, 0 dB FS, 16 Ω 60.0 63.0 - mW 27.0 30.8 - mW 13.0 16.0 50000 Ω - - 1000 pF 1.0 - - MΩ - 1700 - mW +15 µH 1200 1400 - mW THD+N ≤ 1%; 15 µH + 8 Ω + 1500 2150 - mW 60.0 85.0 - dB 60.0 86.0 - dB 40.0 86.0 - dB 40.0 82.0 - dB Pout = 1 W, 15 µH + 8 Ω + 15 73.0 82.0 - % µH 60.0 77.0 - % load; VDD_CP = 1.95 V, 0 dB gain mode f = 1.02 kHz, 0 dB FS, 32 Ω load; VDD_CP = 1.
3.5.7. Vibrator Parameter Conditions Operational input Connected at VDD_HAP (VH voltage below) Min Typ Max Units 2.5 3.6 4.75 V Output voltage Peak, no load At HAP_OUT_P and - - VH V Average (V_HA) HAP_OUT_N 0 - 3.6 V Maximum drive Differential, over one PWM 1.2 - 3.
Range, no load to 150 mA - 100 - mV - - 150 mA - 92 - % - 1.48 - MHz Resolution Output current Efficiency I_out = 30 mA Switching frequency (default) NOTE: All specifications apply at VDD_DIS_x = 3.6 V , T = -30 to +85ºC, VDIS_P_OUT = 5.5 V, L = 4.7 µH, and C = 10 µF (capacitance value de-rated from 22 µF nominal) . Display minus bias Parameter Conditions Min Typ Max Units Operational input voltage Connected at VDD_DIS_N 2.5 - 4.75 V -1.4 - -6.
Expected source is PMI’s VREG_BST_BYP Output current per LED Flash - - 1000 mA - - 200 mA Torch NOTE: All specifications apply at VPH_PWR = 3.6 V, T = -30 to +85ºC unless noted otherwise. 3.5.10. Display backlight (WLEDs) The FREY M1 supports WLEDs with a boost converter that generates the high voltage needed for powering a string of WLEDs, plus four output drivers for sinking the current from WLED strings. Parameter Conditions Min Typ Max Units 2.5 - 4.
3.5.11. System clock (BB_CLK) Parameter Comment Min Typ Operating frequency Max 19.2 Units MHz Output levels Logic high (VOH) 1.17 - - V Logic low (VOL) - - 0.63 V 3.5.12. RF Transmit and Receiver Specifications RF Operation Frequency Band Band Min Max WIFI 2.4G 2412MHz 2472MHz WiFi 5G 5180MHz 5825MHz BT 2402MHz 2480MHz GPS 1574.40MHz 1576.44MHz Glonass 1598MHz 1606MHz WIFI Considering SAR regulatory, limit WiFi Tx power at certain level.
Parameter Bandwidth Mode 11a TX output power level HT20 11n 5G Rate Data Rate (Mbps) 54 Unit Min Typical Max 13 15 17 dBm 10 12 14 dBm OFDM-54 65 MCS7 11ac 78 MAC8 10 12 14 dBm 11n 135 MCS7 10 12 14 dBm 11ac 180 MCS9 10 12 14 dBm 11ac 433 MCS9 9 11 13 dBm 11a 54 OFDM-54 - -24 - dB 11n 65 MCS7 - -25 - dB 11ac 78 MCS8 - -28 - dB 11n 135 MCS7 - -25 - dB 11ac 180 MCS9 - -28 - dB 11ac 390 MCS9 - -32 - dB 11a 54 OFDM-5
3Mbps Packet Length: 3-DH1 TRM/CA/01/C Output power(class1) 0 8 12 dBm TRM/CA/01/C Output power(class2) -6 0 4 dBm GPS Test Items Test condition CN ration Satellites@-130dBm Min Sensitivity 3.5.13. Typical - 38 - -145 Max Unit 40 dBm - dBm Electrostatic Discharge The module is not protected against Electrostatic Discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components.
Note ** : Air discharge on location 1,2,3,4,5 on module , module is mounted on EVB . Page 43 BitaTek Co., Ltd. Copyright protected. All rights reserved. NO. 115 Wugong 3rd Rd., Wugu Dist., New Taipei City 248, Taiwan (R.O.C.
Charpt 4. Module Mounting Issues Frey M1 modules have been designed with an easy integration into SMT processes in mind. Some module mounting issues are discussed in more detail in the sections below. Please note that Frey M1 modules are specified for one soldering cycle only. Once removed from the application, the module will very likely be destroyed and cannot be soldered onto another application.
It is recommended that customers do their own testing to determine the optimal solder paste volume. This volume can be applied by stencil printing with different stencil heights to fit your existing assembly needs. The volume is kept constant by varying the aperture size accordingly. The most common thicknesses 110μm and 150μm (stainless steel, laser cut) have been tested with good results with regard to printing process, soldering process and reliability testing.
As an example and during Frey M1 internal tests, forced convection machines were able to realize a good reflow soldering profile, so there was no need for using vapor phase equipment. For analyzing and adapting solder profiles a carrier board was prepared with thermocouples (TC) . In order to get a good overall performance the resulting voiding and the formation of intermetallics as well as other thermal induced degradations must be well balanced.
4.3. Soldering Conditions and Temperature 4.3.1. Reflow Profile Profile Feature Pb-Free Assembly Preheat & Soak Temperature Minimum (Tsmin) Temperature Maximum (Tsmax) Time (Tsmin to Tsmax) (tS) 150°C 200°C 60-120 seconds Average ramp up rate (Tsmax to Tp) 3K/second max. Liquidous temperature (TL) 217°C Time at liquidous (tL) 60-90 seconds Peak package body temperature (Tp) 245°C +0/-5°C Time (tP) within 5 °C of the peak package body 30 seconds max.
Time 25°C to maximum temperature 8 minutes max. 4.3.2. Maximum Temperature and Duration The following limits are recommended for the SMT board-level soldering process to attach the module: • A maximum module temperature of 245°C. This specifies the temperature as measured at the module’s top side. • A maximum duration of 30 seconds at this temperature.
The set shows typical X-Ray images of sample modules soldered to an assumed application board including some failure samples. The images are taken from assembly and BLR testing and comprise two different stencil versions (110μm and 150μm thickness). A good solder joint at Frey M1 signal pins in X-Ray inspection is characterized by a rectangular shape, described by the dimensions of the pad at the module.
IEC60068-2-56 IEC60068-2-38 IEC60068-2-30 4 Thermal Shock IEC60068-2-14 5 Vibration IEC60068-2-6 IEC60068-2-59 6 Mechanical Shock IEC60068-2-27 7 Micro Drop IEC60068-2-32 8 ESD IEC61000-4-2 9 Low temperature start test IEC60068-2-1 10 High temperature start test IEC60068-2-2 4.6. Desoldering Process In case of persisting module issues, the module may be desoldered from the application board.
4.6.1. Preparation of LGA Module It is recommended to use a vacuum lift system to pick up the desoldered module from the application board. To secure a fixed connection between module shielding and module PCB, additional glue points have to be provided. 4.6.2. Baking of Application Board For a reliable desoldering process the moisture level has to taken into account. As known from the soldering process, the moisture has to be limited to a certain level to avoid any damages to components.
Charpt 5. Packaging 5.1. Mechanical Dimensions of Frey M1 Length: 44mm Width: 33.6mm Height: 2.7mm Page 52 BitaTek Co., Ltd. Copyright protected. All rights reserved. NO. 115 Wugong 3rd Rd., Wugu Dist., New Taipei City 248, Taiwan (R.O.C.
Page 53 BitaTek Co., Ltd. Copyright protected. All rights reserved. NO. 115 Wugong 3rd Rd., Wugu Dist., New Taipei City 248, Taiwan (R.O.C.
Bottom 5.2. Shipping Materials FREY M1 is described below, including the following required shipping materials: • Moisture barrier bag, including desiccant and humidity indicator card. FREY M1 well be put into the antistatic tray plate. One antistatic tray plate will have 15 Frey M1 modules, and one moisture barrier bag will have max 5 antistatic tray plates. The material of tray plate is styrene-butadiene Copolymer(CAS NO. 9003-55-8), the operation temperature range please refence CAS NO 9003-55-8.
Page 55 BitaTek Co., Ltd. Copyright protected. All rights reserved. NO. 115 Wugong 3rd Rd., Wugu Dist., New Taipei City 248, Taiwan (R.O.C.
5.2.1. Moisture Barrier Bag Those are stored inside a moisture barrier bag, The bag is ESD protected and delimits moisture transmission. It is vacuum-sealed and should be handled carefully to avoid puncturing or tearing. The bag protects the Frey M1 modules from moisture exposure. It should not be opened until the devices are ready to be soldered onto the application. The moisture barrier bag size : 420 x 240 MM The moisture barrier bag thickness : 0.15MM Page 56 BitaTek Co., Ltd. Copyright protected.
Desiccant size : 90MM+ /-10MM The moisture barrier bag s contain one or more desiccant pouches to absorb moisture that may be in the bag. The humidity indicator card described below should be used to determine whether the enclosed components have absorbed an excessive amount of moisture. Page 57 BitaTek Co., Ltd. Copyright protected. All rights reserved. NO. 115 Wugong 3rd Rd., Wugu Dist., New Taipei City 248, Taiwan (R.O.C.
The desiccant pouches should not be baked or reused once removed from the moisture barrier bag. The humidity indicator card is a moisture indicator and is included in the moisture barrier bag to show the approximate relative humidity level within the bag. A sample humidity card is shown in follow Figure. If the components have been exposed to moisture above the recommended limits, the units will have to be rebaked. 5.3.
Caution label Page 59 BitaTek Co., Ltd. Copyright protected. All rights reserved. NO. 115 Wugong 3rd Rd., Wugu Dist., New Taipei City 248, Taiwan (R.O.C.
Module label : this label will on the top site of Frey M1. Page 60 BitaTek Co., Ltd. Copyright protected. All rights reserved. NO. 115 Wugong 3rd Rd., Wugu Dist., New Taipei City 248, Taiwan (R.O.C.
Vacuum bag label : It is attached to the outside of the moisture barrier bag. Page 61 BitaTek Co., Ltd. Copyright protected. All rights reserved. NO. 115 Wugong 3rd Rd., Wugu Dist., New Taipei City 248, Taiwan (R.O.C.
Carton label : It is attached to the outside of the carton 5.4. Storage Conditions The conditions stated below are only valid for modules in their original packed state in weather protected, non-temperature-controlled storage locations. Normal storage time under these conditions is 12 months maximum. The modules will be delivered in a packaging that meets the requirements Low Temperature Carriers. Page 62 BitaTek Co., Ltd. Copyright protected. All rights reserved. NO. 115 Wugong 3rd Rd., Wugu Dist.
5.5. Moisture Sensitivity Level Frey M1 comprises components that are susceptible to damage induced by absorbed moisture. 5.6. Durability and Mechanical Handling 5.6.1. Storage Life Frey M1 modules must be stored in sealed, moisture barrier anti-static bags. The shelf life in a sealed moisture bag is an estimated 12 months. However, such a life span requires a non-condensing atmospheric environment, ambient temperatures below 40°C and a relative humidity below 90% 5.6.2.
Charpt 6.
EN301 893 V1.8.1: 2015 performance RLAN; Harmonized EN covering the essential requirements of article 3.2 of the R&TTE Directive. DFS The advantage of 802.11a wireless market and the EN301893 V1.8.1 constant push to open up spectrum for unlicensed use EN301 893 V1.8.1: 2015 created a requirement for Dynamic Frequency Selection (DFS), a mechanism to use the 5GHz frequency bands already allocated to radar systems without causing interference to those radars. EN300 440-1 v1.6.
material information infrastructure device operating in the DFS 5.25Ghz ~5.35GHz and 5.47GHz~5.
When in a hospital or other health care facility, observe the restrictions on the use of mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guidelines posted in sensitive areas. Medical equipment may be sensitive to RF energy. The operation of cardiac pacemakers, other implanted medical equipment and hearing aids can be affected by interference from cellular terminals or mobiles placed close to the device.
phone features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate those features before you can make an emergency call. Some networks require that a valid SIM card be properly inserted in the cellular terminal or mobile. 6.2. Safety European Union notice This device complies with the R&TTE Directive (1999/5/EC) issued by the Commission of the European Community.
FCC Warning: The FCC requires that you be notified that any changes or modifications to this device not expressly approved by the manufacturer could void the user’s authority to operate the equipment. RF Radiation Exposure Statement: This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20 centimeters between the radiator and your body.
Charpt 7. Appendix 7.1. Abbreviations Abbreviation Description BGA Ball Grid Array BLR Board Level Reliability DCE Data Communication Equipment DTE Data Terminal Equipment ENIG Electroless Nickel Immersion Gold LGA Land Grid Array PCB Printed Circuit Board RF Radio Frequency SMD Surface Mount Device SMT Surface Mount Technology TC Thermocouples TP Test Point UART Universal Asynchronous Receiver-Transmitter 7.2.
By pressing from above By mounting under pressure By putting object on top By putting objects below Page 71 BitaTek Co., Ltd. Copyright protected. All rights reserved. NO. 115 Wugong 3rd Rd., Wugu Dist., New Taipei City 248, Taiwan (R.O.C.
