Digi XBee® 3 RF Module Hardware Reference Manual
Revision history—90001543 Revision Date Description K March 2019 Added BLE power output specifications. Added I2C pin specifications. Added a new antenna. Added XBee3 USB Adapter information. L April 2019 Added XBIB-C board information. M May 2019 Added FCC publication 996369 related information. N December Added antennas. 2019 P January 2020 Added Mexican certifications.
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Contents Digi XBee® 3 RF Module Hardware Reference Manual General XBee 3 specifications General specifications Regulatory conformity summary Serial communication specifications UART pin assignments SPI pin assignments GPIO specifications Electro Static Discharge (ESD) 9 9 10 10 10 10 11 IEEE 802.15.
Design notes Power supply design Board layout Antenna performance Design notes for PCB antenna and chip antenna devices Surface-mount embedded antenna keepout area XBee 3 Micro chip antenna keepout area Through-hole embedded antenna keepout area Design notes for RF pad devices Copper keepout for test points 32 32 32 33 33 34 35 35 38 Regulatory information United States (FCC) OEM labeling requirements FCC notices FCC-approved antennas (2.
Flux and cleaning Reworking 72 73 Troubleshooting Brownout issue Voltage brownout Voltage ramp up discontinuities How to distinguish revision B parts Digi XBee® 3 RF Module Hardware Reference Manual 75 75 75 75 6
Digi XBee® 3 RF Module Hardware Reference Manual This manual provides information for the XBee 3 RF Module hardware. The XBee 3 RF Module can be any of the following form factors: n Micro-mount n Through-hole n Surface-mount For more information about the operation and programming functions of the device, see: n XBee 3 DigiMesh RF Module User Guide n XBee 3 Zigbee RF Module User Guide n XBee 3 802.15.
General XBee 3 specifications The following tables provide general specifications for the hardware.
General XBee 3 specifications General specifications General specifications The following table describes the general specifications for the devices. Specification XBee 3/XBee 3-PRO micro-mount XBee 3/XBee 3-PRO surface-mount XBee 3/XBee 3-PRO through-hole Through-hole Operating frequency band ISM 2.4 – 2.4835 GHz Form factor Micro-mount Surface-mount Dimensions Micro-mount: 1.36 cm x 1.93 cm x 0.241 cm (0.534 in x 0.760 in x 0.095 in) Surface-mount: 2.199 Through-hole: 2.438 x 3.4 x 0.
General XBee 3 specifications Serial communication specifications Serial communication specifications The XBee 3 RF Module supports Universal Asynchronous Receiver / Transmitter (UART) and Serial Peripheral Interface (SPI) serial connections.
General XBee 3 specifications Electro Static Discharge (ESD) GPIO electrical specification Value Input pull-down resistor value 40 kΩ (typical) Output voltage for logic 0 0.2 x VCC (maximum) Output voltage for logic 1 0.8 x VCC (minimum) Output source/sink current 50 mA (maximum) Total output current (for GPIO pads) 200 mA (maximum) Electro Static Discharge (ESD) XBee 3 RF Module pins are tolerant to human-body model ± 1.5 kV. Note Take care to limit all electrostatic discharges to the device.
IEEE 802.15.4-specific specifications The following tables provide specifications specific to the XBee 3 RF Module when using the IEEE 802.15.4 physical layer, for example: XBee 802.15.4, Zigbee, DigiMesh, and so on.
IEEE 802.15.4-specific specifications Performance specifications Performance specifications The following table describes the performance specifications for the devices. Specification XBee 3 XBee 3-PRO Indoor/urban range Up to 60 m (200 ft) Up to 90 m (300 ft) Outdoor RF line-of-sight range Up to 1200 m (4000 ft) Up to 3200 m (2 mi) RF Transmit power output (maximum) 6.3 mW (+8 dBm) 79 mW (+19 dBm) BLE power output 6.3 mW (+8 dBm) 6.
IEEE 802.15.4-specific specifications Communication interface specifications Communication interface specifications The following table provides the device's communication interface specifications.
Mechanical drawings The following mechanical drawings of the XBee 3 RF Modules show all dimensions in inches.
Mechanical drawings XBee 3 surface-mount antennas XBee 3 surface-mount antennas The following mechanical drawings are for the XBee 3 surface-mount antennas. XBee 3 surface-mount - U.
Mechanical drawings XBee 3 surface-mount antennas XBee 3 surface-mount - embedded antenna Digi XBee® 3 RF Module Hardware Reference Manual 17
Mechanical drawings XBee 3 micro antennas XBee 3 micro antennas The following mechanical drawings are for the XBee 3 micro antennas. XBee 3 micro (U.
Mechanical drawings XBee 3 micro antennas XBee 3 micro (chip antenna) Digi XBee® 3 RF Module Hardware Reference Manual 19
Mechanical drawings XBee 3 through-hole antennas XBee 3 through-hole antennas The following mechanical drawings are for the XBee 3 through-hole antennas. XBee 3 through-hole - PCB antenna XBee 3 through-hole - U.
Mechanical drawings XBee 3 through-hole antennas XBee 3 through-hole - RPSMA antenna Digi XBee® 3 RF Module Hardware Reference Manual 21
Pin signals Pin signals for the XBee 3 surface-mount module Pin signals for the XBee 3 micro module Pin signals for the XBee 3 through-hole module Recommended pin connections Digi XBee® 3 RF Module Hardware Reference Manual 23 26 29 30 22
Pin signals Pin signals for the XBee 3 surface-mount module Pin signals for the XBee 3 surface-mount module The following drawing shows the surface-mount (SMT) pin locations. The following table shows the pin signals and their descriptions for the surface-mount device. Pin# Name Direction Default state Description 1 GND - - Ground. 2 VCC - - Power supply. 3 DOUT /DIO13 Both Output UART data out /GPIO. 4 DIN / CONFIG /DIO14 Both Input UART data in /GPIO. 5 DIO12 Both GPIO.
Pin signals Pin signals for the XBee 3 surface-mount module Pin# Name Direction Default state Description 10 DTR/SLEEP_RQ /DIO8 Both Input Pin sleep control Line/GPIO. 11 GND - - Ground. 12 SPI_ATTN/ BOOTMODE /DIO19 Output Output Serial peripheral interface attention . Do not tie low on reset. 13 GND - - Ground. 14 SPI_CLK /DIO18 Input Input Serial peripheral interface clock/GPIO. 15 SPI_SSEL/DIO17 Input Input Serial peripheral interface not select/GPIO.
Pin signals Pin signals for the XBee 3 surface-mount module Pin# Name Direction Default state Description 28 ASSOCIATE/DIO5 Both Output Associate Indicator/GPIO. 29 RTS/DIO6 Both Input Request to send flow control /GPIO. 30 AD3/DIO3 Both Disabled Analog input/GPIO. 31 AD2/DIO2 Both Disabled Analog input/GPIO 32 AD1/DIO1/I2C SCL Both Disabled Analog input/GPIO/I2C SCL. 33 AD0 /DIO0 Both Input Analog input / GPIO / Commissioning button.
Pin signals Pin signals for the XBee 3 micro module Pin signals for the XBee 3 micro module The following drawing shows the micro pin locations. The following table shows the pin signals and their descriptions for the XBee 3 Micro device. Pin# Name Default Direction state Description 1 GND - - Ground. 2 VCC - - Power supply. 3 DOUT /DIO13 Both Output UART data out /GPIO. 4 DIN / CONFIG /DIO14 Both Input UART data in /GPIO. 5 DIO12 Both GPIO. 6 RESET Input Device reset.
Pin signals Pin signals for the XBee 3 micro module Pin# Name Default Direction state Description 10 GND - - Ground. 11 SPI_ATTN/ BOOTMODE/DIO19 Output Output 12 GND - - Ground. 13 SPI_CLK /DIO18 Input Input Serial peripheral interface clock/GPIO. 14 SPI_SSEL/DIO17 Input Input Serial peripheral interface not select/GPIO. 15 SPI_MOSI/DIO16 Input Input Serial peripheral interface data in/GPIO. 16 SPI_MISO/DIO15 Output Output Serial peripheral interface data out/GPIO.
Pin signals Pin signals for the XBee 3 micro module Pin# Name Default Direction state 29 AD2/DIO2 Both Disabled Analog input/GPIO. 30 AD1/DIO1/I2C SCL Both Disabled Analog input/GPIO/I2C SCL. 31 AD0 /DIO0 Both Input Analog input / GPIO / Commissioning button. 32 GND - - Ground. 33 RF Both - RF I/O for RF pad variant. 34 GND - - Ground. Description Signal direction is specified with respect to the device. This is a complete list of functionalities.
Pin signals Pin signals for the XBee 3 through-hole module Pin signals for the XBee 3 through-hole module The following drawing shows the through-hole pin locations. The following table shows the pin signals and their descriptions for the XBee 3 though-hole device. Pin# Name Default Direction state Description 1 VCC - - Power supply. 2 DOUT/DIO13 Both Output UART data out/GPIO. 3 DIN/CONFIG/DIO14 Both Intput UART data in/GPIO. 4 DIO12/SPI_MISO Both - GPIO/SPI data out.
Pin signals Recommended pin connections Pin# Name Default Direction state 11 DIO4/SPI_MOSI Both Disabled GPIO/Serial peripheral interface data in. 12 CTS/DIO7 Both Output Clear to send flow control/GPIO. 13 ON/SLEEP/DIO9 Both Output Device status indicator/GPIO. 14 [reserved] - Disabled Do not connect or connect to Ground. 15 ASSOCIATE/DIO5 Both Output Associate Indicator/GPIO. 16 RTS/DIO6 Both Input Request to send flow control/GPIO.
Design notes Recommended pin connections Design notes XBee 3 modules do not require any external circuitry or specific connections for proper operation. However, there are some general design guidelines that we recommend to build and troubleshoot a robust design.
Design notes Power supply design Power supply design A poor power supply can lead to poor device performance, especially if you do not keep the supply voltage within tolerance or if it is excessively noisy. To help reduce noise, place a 1.0 µF and 8.2 pF capacitor as near as possible to the VCC connection on the XBee 3 (pad 2 for micro and surfacemount, and pin 1 for through-hole). Adding a 10 µF decoupling capacitor is also recommended.
Design notes Design notes for PCB antenna and chip antenna devices n Do not place XBee 3 modules with the chip antenna or the embedded antenna inside a metal enclosure. n Do not place any ground planes or metal objects above or below the antenna. n For the best results, mount the device at the edge of the host PCB. Ensure that the ground, power, and signal planes are vacant immediately below the antenna section.
Design notes Design notes for PCB antenna and chip antenna devices Notes 1. We recommend non-metal enclosures. For metal enclosures, use an external antenna. 2. Keep metal chassis or mounting structures in the keepout area at least 2.54 cm (1 in) from the antenna. 3. Maximize the distance between the antenna and metal objects that might be mounted in the keepout area. 4. These keepout area guidelines do not apply for chip antennas or external RF connectors.
Design notes Design notes for RF pad devices Through-hole embedded antenna keepout area Notes 1. We recommend non-metal enclosures. For metal enclosures, use an external antenna. 2. Keep metal chassis or mounting structures in the keepout area at least 2.54 cm (1 in) from the antenna. 3. Maximize the distance between the antenna and metal objects that might be mounted in the keepout area. 4. These keepout area guidelines do not apply for external RF connectors.
Design notes Design notes for RF pad devices Following good design practices is essential when implementing the RF trace on a PCB. Consider the following points: n Minimize the length of the trace by placing the RPSMA jack close to the device. n Connect all of the grounds on the jack and the device to the ground planes directly or through closely placed vias. n Space any ground fill on the top layer at least twice the distance d, for Micro modules at least 0.
Design notes Design notes for RF pad devices Number Description 1 Maintain a distance of at least 2 d between microstrip and ground fill. 2 RF pad pin. 3 50 Ω microstrip trace. 4 RF connection of RPSMA jack. This example is on a surface-mount device. The width in this example is approximately 0.045" for a 50 Ω trace, assuming d=0.025”, and that the dielectric has a relative permittivity of 4.4. This trace width is a good fit with the device footprint's 0.060" pad width.
Design notes Copper keepout for test points Copper keepout for test points The following keepouts are required for all surface-mount or micro-mount devices. These keepouts are in addition to the other keepouts if using a PCB or chip antenna. While the underside of the device is mostly coated with solder resist, we recommended the copper layer directly below the device be left open to avoid unintended contacts.
Design notes Copper keepout for test points Copper keepout for the XBee 3 Micro Digi XBee® 3 RF Module Hardware Reference Manual 39
Regulatory information United States (FCC) Europe (CE) ISED (Innovation, Science and Economic Development Canada) Australia (RCM)/New Zealand Brazil ANATEL Japan (TELEC) Mexico (IFETEL) South Korea Digi XBee® 3 RF Module Hardware Reference Manual 41 51 53 54 54 55 56 56 40
Regulatory information United States (FCC) United States (FCC) XBee 3 RF Modules comply with Part 15 of the FCC rules and regulations. Compliance with the labeling requirements, FCC notices and antenna usage guidelines is required. To fulfill FCC Certification, the OEM must comply with the following regulations: 1. The system integrator must ensure that the text on the external label provided with this device is placed on the outside of the final product. 2.
Regulatory information United States (FCC) FCC-approved antennas (2.4 GHz) The XBee 3 RF Module can be installed using antennas and cables constructed with non-standard connectors (RPSMA, RPTNC, etc.) An adapter cable may be necessary to attach the XBee connector to the antenna connector. The modules are FCC approved for fixed base station and mobile applications for the channels indicated in the tables below. If the antenna is mounted at least 20 cm (7.
The following table shows the antennas approved for use with the XBee 3 RF module. All antenna part numbers followed by an asterisk (*) are not available from Digi. Consult with an antenna manufacturer for an equivalent option. Required antenna cable loss (dB) Min. separation 802.15.4 Based Protocols (Ex: Zigbee) Bluetooth low energy technology (when available) Fixed/Mobile 20 cm N/A N/A 0.0 Fixed/Mobile 20 cm N/A N/A Integral PCB antenna (through-hole only) -0.
Part number Type (description) Gain (dBi) Application* Min. separation 802.15.4 Based Protocols (Ex: Zigbee) Bluetooth low energy technology (when available) Omni-directional (Collinear Dipole Array) antennas Omni-directional (Fiberglass base station) 2.1 Fixed/Mobile 20 cm N/A N/A A24-F3NF Omni-directional (Fiberglass base station) 3.0 Fixed/Mobile 20 cm N/A N/A A24-F5NF Omni-directional (Fiberglass base station) 5.
Min. separation 802.15.4 Based Protocols (Ex: Zigbee) Bluetooth low energy technology (when available) Fixed 2m N/A N/A 13.0 Fixed 2m N/A N/A Flat Panel 14.0 Fixed 2m N/A N/A A24-P15NF Flat Panel 15.0 Fixed 2m N/A N/A A24-P16NF Flat Panel 16.0 Fixed 2m N/A N/A A24-P19NF Flat Panel 19.0 Fixed 2m N/A N/A A24-Y6NF Yagi (6-element) 8.8 Fixed 2m N/A N/A A24-Y7NF Yagi (7-element) 9.0 Fixed 2m N/A N/A A24-Y9NF Yagi (9-element) 10.
The following table shows the antennas approved for use with the XBee3-PRO RF Module. All antenna part numbers followed by an asterisk (*) are not available from Digi. Consult with an antenna manufacturer for an equivalent option. Required antenna cable loss (dB) Type (description) Gain (dBi) Application* Min separation 802.15.4 Based Protocols (Ex: Zigbee) 29000313 Integral PCB antenna (surface mount only) 0.0 Fixed/Mobile 20 cm N/A N/A 29000710 Chip antenna (micro only) 0.
Part number Type (description) Gain (dBi) Application* Min separation 802.15.4 Based Protocols (Ex: Zigbee) A24-HABUF-P5I Dipole (Half-wave articulated bulkhead mount U.FL. w/ 5” pigtail) Fixed/Mobile 20 cm N/A N/A A24-HASM-525 Dipole (Half-wave 2.1 articulated RPSMA 5.25") Fixed 20 cm N/A N/A 31000019-01 Integral Dipole (USB Adapter Only) Fixed only 20 cm N/A N/A 2.1 0.
Part number Type (description) Gain (dBi) Application* Min separation 802.15.4 Based Protocols (Ex: Zigbee) Bluetooth low energy technology (when available) A24-F10NF Omni-directional (Fiberglass base station) 10 Fixed 2m N/A N/A A24-F12NF Omni-directional (Fiberglass base station) 12 Fixed 2m N/A N/A A24-W7NF Omni-directional (Fiberglass base station) 7.2 Fixed 2m N/A N/A A24-M7NF Omni-directional (Mag-mount base station) 7.
Type (description) Gain (dBi) Application* Min separation 802.15.4 Based Protocols (Ex: Zigbee) A24-Y6NF Yagi (6-element) 8.8 Fixed 2m N/A N/A A24-Y7NF Yagi (7-element) 9.0 Fixed 2m N/A N/A A24-Y9NF Yagi (9-element) 10.0 Fixed 2m N/A N/A A24-Y10NF Yagi (10-element) 11.0 Fixed 2m N/A N/A A24-Y12NF Yagi (12-element) 12.0 Fixed 2m N/A N/A A24-Y13NF Yagi (13-element) 12.0 Fixed 2m N/A N/A A24-Y15NF Yagi (15-element) 12.
Regulatory information United States (FCC) RF exposure If you are an integrating the XBee 3 into another product, you must include the following Caution statement in OEM product manuals to alert users of FCC RF exposure compliance: CAUTION! To satisfy FCC RF exposure requirements for mobile transmitting devices, a separation distance of 20 cm or more should be maintained between the antenna of this device and persons during device operation.
Regulatory information Europe (CE) 2.7 Antennas A list of approved antennas is provided for the XBee 3 product. For the XBee 3, see XBee 3 RF module. For the Pro XBee 3, see XBee3-PRO RF module. 2.8 Label and compliance information Host product manufacturers need to follow the sticker guidelines outlined in OEM labeling requirements. 2.9 Information on test modes and additional testing requirements Contact a Digi sales representative for information on how to configure test modes for the XBee 3 product.
Regulatory information Europe (CE) The CE mark shall consist of the initials “CE” taking the following form: n If the CE marking is reduced or enlarged, the proportions given in the above graduated drawing must be respected. n The CE marking must have a height of at least 5 mm except where this is not possible on account of the nature of the apparatus. n The CE marking must be affixed visibly, legibly, and indelibly.
Regulatory information ISED (Innovation, Science and Economic Development Canada) ISED (Innovation, Science and Economic Development Canada) Labeling requirements Labeling requirements for Industry Canada are similar to those of the FCC. A clearly visible label on the outside of the final product enclosure must display the following text. For XBee 3 Contains Model XBEE3, IC: 1846A-XBEE3 The integrator is responsible for its product to comply with IC ICES-003 & FCC Part 15, Sub. B Unintentional Radiators.
Regulatory information Australia (RCM)/New Zealand requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur. Detachable Antenna Under Industry Canada regulations, this radio transmitter may operate using only an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada.
Regulatory information Japan (TELEC) Japan (TELEC) The XBee 3 (not XBee 3-PRO) complies with Japan MIC Article 2 Paragraph 1, Item 19. The customer product is subject to testing for conformity to the same Japanese standard.
Regulatory information Mexico (IFETEL) Mexico (IFETEL) Manufacturer: Digi International Country: USA Brand: Digi Model: XBEE3 Tariff Code (HS): 8517-62-15 IFETEL (IFT) number RCPDIXB19-1820 applies to these XBee3 radios: XB3-24ACM XB3-24ACM-J XB3-24ARM XB3-24ARM-J XB3-24AUM XB3-24AUM-J XB3-24DMCM XB3-24DMCM-J XB3-24DMRM XB3-24DMRM-J XB3-24DMUM XB3-24DMUM-J XB3-24Z8CM XB3-24Z8CM-J XB3-24Z8PS XB3-24Z8PS-J XB3-24Z8PT XB3-24Z8PT-J XB3-24Z8RM XB3-24Z8RM-J XB3-24Z8RS XB3-24Z8RS-J XB3-24Z8S
Regulatory information Digi XBee® 3 RF Module Hardware Reference Manual South Korea 57
XBIB-C development boards This section describes the XBIB-C development boards and how to interact with them.
XBIB-C development boards XBIB-C Micro Mount reference XBIB-C Micro Mount reference This picture shows the XBee-C Micro Mount development board and the table that follows explains the callouts in the picture. Note This board is sold separately.
XBIB-C development boards Number Item XBIB-C Micro Mount reference Description 1 Secondary USB Secondary USB Connector for possible future use. Not used. (USB MICRO B) 2 Current Measure Large switch controls whether current measure mode is active or inactive. When inactive, current can freely flow to the VCC pin of the XBee. When active, the VCC pin of the XBee is disconnected from the 3.3 V line on the development board.
XBIB-C development boards XBIB-C SMT reference XBIB-C SMT reference This picture shows the XBee-C SMT development board and the table that follows explains the callouts in the picture. Note This board is sold separately.
XBIB-C development boards Number Item XBIB-C SMT reference Description 1 Secondary USB Secondary USB Connector for possible future use. Not used. (USB MICRO B) 2 Current Measure Large switch controls whether current measure mode is active or inactive. When inactive, current can freely flow to the VCC pin of the XBee. When active, the VCC pin of the XBee is disconnected from the 3.3 V line on the dev board.
XBIB-C development boards XBIB-CU TH reference XBIB-CU TH reference This picture shows the XBee-CU TH development board and the table that follows explains the callouts in the picture. Note This board is sold separately.
XBIB-C development boards Number Item 1 XBIB-CU TH reference Description Secondary USB Secondary USB Connector for direct programming of modules on some (USB MICRO B) XBee units. Flip the Dip switches to the right for I2C access to the and DIP Switch board; flip Dip switches to the left to disable I2C access to the board. The USB_P and USB_N lines are always connected to the XBee, regardless of Dip switch setting. This USB port is not designed to power the module or the board.
XBIB-C development boards XBIB-C-GPS reference Number Item Description 8 UART Dip Switch This dip switch allows the user to disconnect any of the primary UART lines on the XBee from the USB to UART conversion chip. This allows for testing on the primary UART lines without the USB to UART conversion chip interfering. Push Dip switches to the right to disconnect the USB to UART conversion chip from the XBee.
XBIB-C development boards Digi XBee® 3 RF Module Hardware Reference Manual XBIB-C-GPS reference 66
XBIB-C development boards Number Item Interface with the XBIB-C-GPS module Description 1 40-pin This header is used to connect the XBIB-C-GPS board to a compatible XBIB header development board. Insert the XBIB-C-GPS module slowly with alternating pressure on the upper and lower parts of the connector. If added or removed improperly, the pins on the attached board could bend out of shape. 2 GPS unit This is the CAM-M8Q-0-10 module made by u-blox. This is what makes the GPS measurements.
XBIB-C development boards Interface with the XBIB-C-GPS module I2C communication There are two I2C lines connected to the host board through the 40-pin header, SCL and SDA. I2C communication is performed over an I2C-compliant Display Data Channel. The XBIB-C-GPS module operates in slave mode. The maximum frequency of the SCL line is 400 kHz. To access data through the I2C lines, the data must be queried by the connected XBee 3 RF Module.
Manufacturing information Manufacturing information The surface-mount and micro XBee 3 RF Module are designed for surface-mounting on the OEM PCB. It has castellated pads to allow for easy solder attaching and inspection. The pads are all located on the edge of the device so there are no hidden solder joints on these devices.
Manufacturing information Recommended solder reflow cycle Recommended solder reflow cycle The following diagram shows the recommended solder reflow cycle. The device reflows during this cycle, and must not be reflowed upside down. Be careful not to jar the device while the solder is molten, as parts inside the device can be removed from their required locations. Hand soldering is possible and should be done in accordance with approved standards.
Manufacturing information Recommended footprint XBee 3 surface-mount recommended footprint Digi XBee® 3 RF Module Hardware Reference Manual 71
Manufacturing information Flux and cleaning XBee 3 Micro recommended footprint Match the solder footprint to the copper pads, but it may need to be adjusted depending on the specific needs of assembly and product standards. Recommended stencil thickness is 0.15 mm/0.005”. Place the component last and set the placement speed to the slowest setting. Flux and cleaning Digi recommends that a “no clean” solder paste be used in assembling these devices.
Manufacturing information Reworking Reworking Never perform rework on the device itself. The device has been optimized to give the best possible performance, and reworking the device itself will void warranty coverage and certifications. We recognize that some customers choose to rework and void the warranty. The following information serves as a guideline in such cases to increase the chances of success during rework, though the warranty is still voided.
Troubleshooting This section contains troubleshooting steps for the XBee 3 RF Module.
Troubleshooting Brownout issue Brownout issue The XBee 3 RF Module uses a Silicon Labs EFR32MG System on Chip (SoC). Silicon Labs has announced an intermittent restarting issue with EFR32MG revision B SoCs which can be caused by voltage brownout or supply dips during power-on. The information below is provided to help you avoid this issue. Voltage brownout This issue may occur if the VCC pin momentarily dips past the specified lower bound of the voltage range (2.1 V) into the range of 1.
