Data Sheet

BDE-RFM208P-2.4
Multi-Band Wireless Module with PA
Datasheet
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BDE Technology Inc.
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General Description
BDE-RFM208P-2.4 is a multi-band wireless module which supports Sub-1G and 2.4G
band. It also supports multiprotocol, such as Thread, Zigbee, Bluetooth 5 Low Energy,
IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), Wireless M-Bus, Wi-SUN, KNX
RF, proprietary systems, SimpleLink TI 15.4-Stack (Sub-1 GHz), and Dynamic
Multiprotocol Manager (DMM) driver.
BDE-RFM208P-2.4 has an integrated power amplifier which enables 20dBm output power.
BDE-RFM208P-2.4 highly integrates radio, stack, profile and applications in a SoC, without the need of using
an external MCU. The module also offers flexible hardware interfaces for the sensor application.
It enables ultra-low power connectivity and data transfer for the applications that are sensitive to power
consumption, size and cost.
Key Features
 Multi-Band, supports 2.4G and Sub-1G band
 Powerful ARM Cortex-M4F processor
 Clock speed: up to 48MHz
 352KB of In-System programmable flash
 80KB SRAM
 8KB of cache SRAM
 2-Pin cJTAG and JTAG debugging
 Support Over-the-Air upgrade (OTA)
 Ultra-Low power sensor controller with 4KB of SRAM
 26 GPIOs
 4 x 32-Bit or 8 x 16-Bit general purpose timer
 12-Bit ADC, 200 kSamples/s, 8 channels
 2 x comparator with internal reference DAC
 Programmable current source
 2 x UART
 2 x SSI (SPI, MICROWIRE, TI)
 IIC, IIS
 Real-Time-Clock (RTC)
 AES 128- and 256-bit crypto accelerator
 ECC and RSA public key hardware accelerator
 SHA2 accelerator (Full suite up to SHA-512)
 True Random Number Generator (TRNG)
 Capacitive sensing, up to 8 channels
 Integrated temperature and battery monitor