Autel Intelligent Tech. Corp., Ltd GOC-Q82008W V1.2 Bluetooth Module Hardware Specification GOC-Q82008W V1.2 Bluetooth Module Hardware Specification Document Type: Bluetooth Module Hardware Specification Document Number: GOC-Q82008W V1.2 Document Version: V1.0 Release 2022/09/01 Date: Autel Intelligent Tech. Corp., Ltd Fax:0755-86147758 TEL：0755-86147778 Website:www.auteltech.net Address:7th, 8th and 10th Floor, Building B1, Zhiyuan, Xueyuan Road, Xili, Nanshan, Shenzhen, 518055, China.
Autel Intelligent Tech. Corp., Ltd GOC-Q82008W V1.2 Bluetooth Module Hardware Specification Be careful: 1. The module must use ladder steel net, and recommend ladder steel net thickness 0.16--0.20mm. The adaptability of the products is adjusted accordingly. 2. Before the use of the module, bake at 60 degrees centigrade and bake for 12 hours. Release Record Version Number V1.0 Release Date 2022/09/01 Initial issue Comments Autel Intelligent Tech. Corp.
Autel Intelligent Tech. Corp., Ltd GOC-Q82008W V1.2 Bluetooth Module Hardware Specification Contents 1. Introduction .............................................................................................................................. 4 1.1 Module Block Diagram ................................................................................................... 4 1.2 Features ...........................................................................................................................
Autel Intelligent Tech. Corp., Ltd GOC-Q82008W V1.2 Bluetooth Module Hardware Specification 1. Introduction The GOC-Q82008W V1.2 is a single-chip flash programmable dual mode Bluetooth v5.0 device with integrated application processor, low-power audio DSP, on-chip ROM and RAM, stereo codec, battery charger, switch-mode and linearregulators, and LED drivers. The GOC-Q82008W V1.
Autel Intelligent Tech. Corp., Ltd GOC-Q82008W V1.2 Bluetooth Module Hardware Specification PXP V1.0.1 FMP V1.0 BAS V1.
Autel Intelligent Tech. Corp., Ltd GOC-Q82008W V1.2 Bluetooth Module Hardware Specification 2. Main Specification Instruction Production Type Standard IC Frequency Range Modulation Method Max Speed For Transfer Hop Output Impedance Crystal Frequency Outer Interface Apply To Bluetooth Instructions Receiving Sensitivity Transmit Power Dimension Power Voltage Working Current Standby Current Storage Temperature Temperature Range Humidity Range Antenna Type Antenna Gain Bluetooth Module GOC-Q82008W V1.
Autel Intelligent Tech. Corp., Ltd GOC-Q82008W V1.2 Bluetooth Module Hardware Specification 3. Pin Diagram And Description 3.1 Pin Diagram Figure 2: Pin Diagram 3.2 Pin Definition Pin Pin Name Pad Type Description 1 GND GND Ground connections 2 VDD Power 3.3V Supply voltage 3 MIC_P Analog in Microphone input positive 4 MIC_N Analog in Microphone input negative 5 UART_RTS# Bidirectional with strong pull-up UART request to send, active low Autel Intelligent Tech. Corp.
Autel Intelligent Tech. Corp., Ltd GOC-Q82008W V1.2 Bluetooth Module Hardware Specification 6 UART_RX Bidirectional with strong pull-up UART data input 7 PCM_OUT Bidirectional with weak pull-down Synchronous data output 8 USB_D+ Bidirectional USB data plus with selectable internal 1.
Autel Intelligent Tech. Corp., Ltd 28 GND GOC-Q82008W V1.2 Bluetooth Module Hardware Specification GND Ground connections Table 2: Pin Description 3.3 PCB Layout Footprint Figure 3: GOC-Q82007W PCB Layout Footprint Autel Intelligent Tech. Corp.
Autel Intelligent Tech. Corp., Ltd GOC-Q82008W V1.2 Bluetooth Module Hardware Specification 4. UART Interface GOC-Q82008W V1.2 has a UART serial interface that provides a simple mechanism for communicating with other serial devices using the RS232 protocol, including for test and debug. The UART interface is multiplexed with PIOs and other functions, and hardware flow control is optional.
Autel Intelligent Tech. Corp., Ltd GOC-Q82008W V1.2 Bluetooth Module Hardware Specification 38400 57600 76800 115200 230400 460800 921600 1382400 1843200 2764800 3686400 -0.18% 0.03% 0.14% 0.03% 0.03% -0.02% 0.00% -0.01% 0.00% 0.00% 0.00% Table 4: Standard baud rates 5. PCM Imterface The PCM Interface on the GOC-Q82008W V1.2 can connect to linear PCM Codec devices in master or slave mode. In master mode,the GOC-Q82008W V1.
Autel Intelligent Tech. Corp., Ltd GOC-Q82008W V1.
Autel Intelligent Tech. Corp., Ltd Reference 1 2 3 4 5 6 7 8 9 GOC-Q82008W V1.
Autel Intelligent Tech. Corp., Ltd GOC-Q82008W V1.
Autel Intelligent Tech. Corp., Ltd Reference 1 2 3 4 5 6 7 8 Characteristics PCM bit clock frequency PCM bit clock LOW PCM bit clock HIGH PCM_SYNC setup PCM_SYNC hold PCM_OUT delay PCM_IN setup PCM_IN hold GOC-Q82008W V1.2 Bluetooth Module Hardware Specification Minimum 20.8 20.
Autel Intelligent Tech. Corp., Ltd GOC-Q82008W V1.2 Bluetooth Module Hardware Specification As well as describing USB basics and architecture, the application note describes: USB Audio DFU 7. Electrical Characteristics 7.1 Absolute Maximum Ratings Maximum Ratings VDD Min 3.10V Typical 3.30V Max 3.60V Table 11: Absolute Maximum Ratings 7.2 Recommended Operating Conditions Operating Conditions Storage Temperature OperatingTemperature Range VDD Min -40°C -40°C 3.14V Typical / 20°C 3.
Autel Intelligent Tech. Corp., Ltd GOC-Q82008W V1.2 Bluetooth Module Hardware Specification 9. PCB Layout Recommendation 9.1 HCI UART Lines Layout Guideline The following HCI line routing must obey the following rule to prevent overshoot/undershoot, as these lines drive 4 ~ 8mA UART_RX UART_TX UART_CTS UART_RTS The route length of these signals be less than 15 cm and the line impedance be less than 50Ω. 9.
Autel Intelligent Tech. Corp., Ltd GOC-Q82008W V1.2 Bluetooth Module Hardware Specification 12. Packaging Information 12.1 Net Weight The module net weight: 2g±0.2g 12.2 Package TBD 12.3 Storage Requirements 1）Temperature: 22~28°C； 2 ）Humidity: <70%（ RH）； Vacuum packed and sealed in good condition to ensure 12 months of welding. 12.4 Humidity Sensitive Characteristic 1） MSL: 3 level 2） Once opened, SMT within 168 hours in the condition of temperature: 22~28°C and humidity<60%(RH).
