Intel® NUC Kit/Mini PC NUC12SNKi72 Technical Product Specification Regulatory Models: NUC12SNK (Kit, Mini PC) October 2022 Intel® NUC12SNKi72 may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata, if any, are documented in Intel NUC12SNKi72 Specification Update.
Revision History Revision Revision History Date 1.0 Release of the Intel NUC NUC12SNKi72 Technical Product Specification September 2022 1.1 Fixed Errors October 2022 1.2 Clarifications (Table 7.d, Section 3.2.4) October 2022 Disclaimer This product specification applies to only the standard Intel NUC12SNKi72 with BIOS identifier SNADL357.00XX. INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS.
Contents Preface This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for Intel® NUC Kit NUC12SNKi72. Some features are only available on Kit SKUs. Intended Audience The TPS is intended to provide detailed, technical information about Intel® NUC Kit NUC12SNKi72 and its components to the vendors, system integrators, and other engineers and technicians who need this level of information.
Other Common Notation # Used after a signal name to identify an active-low signal (such as USBP0#) GB Gigabyte (1,073,741,824 bytes) GB/s Gigabytes per second Gb/s Gigabits per second KB Kilobyte (1024 bytes) Kb Kilobit (1024 bits) kb/s 1000 bits per second MB Megabyte (1,048,576 bytes) MB/s Megabytes per second Mb Megabit (1,048,576 bits) Mb/s Megabits per second TDP Thermal Design Power xxh An address or data value ending with a lowercase h indicates a hexadecimal value. x.
Contents Production Identification Information Intel® NUC Product NUC12SNKi72 Identification Information Product Name Intel® NUC NUC12SNKi72 NUC12SNKi72 Specification Changes or Clarifications The table below indicates the Specification Changes or Specification Clarifications that apply to the Intel NUC Kit/Mini PC NUC12SNKi72.
Table of Contents 1 2 3 4 Product Description ........................................................................................................................... 9 1.1 Overview ......................................................................................................................................................... 9 1.1.1 Summary of Mini PC SKUs .................................................................................................... 9 1.1.2 Summary of Kit SKU .........
Contents 5 4.3 Thermal Considerations ........................................................................................................................ 29 4.4 Reliability ..................................................................................................................................................... 29 4.5 Environmental ...........................................................................................................................................
1 Product Description 1.1 Overview The Intel® NUC 12 Enthusiast / Kit is a small form factor PC barebones kit. The NUC 12 Enthusiast Kits consists of the processor, chipset, memory slots, wireless, Bluetooth, M.2 storage slots, integrated heat sink and fan. See Table 1 for a summary. 1.1.1 Summary of Mini PC SKUs Product Codes and MM#s for the SKUs below can be found at https://ark.intel.com. Table 1.
1.1.3 Feature Summary Table 3 summarizes the major features of Intel® NUC Mini PC Kit NUC12SNKi72. Table 3. Feature Summary Chassis Dimensions 9.1in. by 7.1in. by 2.6in. (230mm by 180mm x 65mm) (including feet) 9.1in. by 7.1in. by 2.4in.
Technical Reference Communication Wireless connectivity using the Intel® Wi-Fi 6E AX1690i wireless networking module • • • • • 802.11ax, Concurrent Dual Band, 2x2 Wi-Fi + Bluetooth 5.2 Bands 2.4, 5, 6 GHz (160MHz) Maximum Transfer speed up to 3.0 Gbps M.2 2230 Hybrid Key E form factor Supports OFDMA, MU-MIMO More information about Intel® wireless products can be found at https://ark.intel.com To obtain drivers visit https://downloadcenter.intel.
• System Power Input19.5VDC +/- 5% with DC transient voltage protection; Operating Temperatures 0-35°C external ambient operating temperature More information about environmental specifications can be found in Section 4.
Technical Reference 2 Product Layout 2.1 Board Layout 2.1.1 Board Layout (Top) Figure 1 shows the location of the major components on the bottom of Intel® NUC Board NUC12SNKi72. Figure 1. Major Board Components (Top) Table 5. Components Shown in Figure 1 Item from Figure 1 Description A CMOS battery B M.2 2230 module connector (Key Type E) (WiFi) C CMOS battery header D DMIC connector E Fan connector F M.2 2280 module connector (NVMe/SATA) G Fan connector H M.
J RGB header (top lid) K BIOS Security header L Common I/O header M DDR4 SO-DIMM 0 Socket N DDR4 SO-DIMM 1 Socket 2.1.2 Board Layout (Bottom) No user configurable components on the bottom-side of Intel® NUC Board NUC12SNi72 2.1.3 Front Panel Figure 2. Front Panel Connectors Table 6. Components Shown in Figure 2 Item from Figure 2 Description A USB 3.2 Gen 2, 2A peak current support (amber) B USB 3.
Technical Reference 2.1.4 Back Panel Figure 3. Back Panel Connectors Table 7. Component Input Ports Shown in Figure 3 Item from Figure 3 Description A (4) USB 3.2 Gen 2 (blue) B Ethernet C Thunderbolt USB-C D 3.
2.1.5 Block Diagram Figure 4.
Technical Reference 3 Feature Descriptions 3.1 System Memory Figure 1 illustrates the memory channel and SO-DIMM configuration. 3.1.1 Intel® NUC Mini PC Memory Information Intel® NUC Mini PCs NUC12SNKi72VA can be purchased with 2 x 8 GB DDR4 3200 MHz SODIMMs included. More information about available Intel® NUC Mini PC NUC12SNKi72VA can be found in Section 1.1.1 Summary of Mini PC SKUs. For Product Codes and MM#s visit https://ark.intel.com. 3.
3.2.
Technical Reference Dolby* Digital Plus DTS-HD* LPCM, 192 kHz/24 bit, 6 channel Dolby* TrueHD, DTS-HD Master Audio* • • • • 3.3.1 Discrete Audio The integrated Realtek ALC274 audio subsystem supports the following features: Digital microphone array (DMIC) Analog line-out/Analog headphone/Analog Microphone (front panel jack) 3.5mm analog stereo / TOSLINK optical audio combination jack (back panel jack) o Analog speakers (stereo) or Digital optical audio o SPDIF optical out formats up to compressed 5.
3.6 LAN Subsystem 3.6.1 RJ-45 LAN Connector with Integrated LEDs Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5). Item Description A Link LED (Green) B Data Rate LED (Green/Yellow) Figure 5. LAN Connector LED Locations Table 8 describes the LED states when the system is powered up and the LAN subsystem is operating. Table 8. LAN Connector LED States LED LED Color Link Green Data Rate 3.6.
Technical Reference 3.7 Hardware Management Subsystem 3.7.1 Fan Monitoring Fan monitoring can be implemented using NUC Software Studio (NSS). 3.7.2 System States and Power States Table 9 describes the ACPI states supported by the processor. Table 9. Systems States State Description G0/S0/C0 Full On: CPU operating. Individual devices may be shut to save power. The different CPU operating levels are defined by Cx states.
3.7.2.1 Wake-up Devices and Events Table 10 lists the devices or specific events that can wake the computer from specific states. Table 10.
Technical Reference 4 Technical Reference 4.1 Signal Tables for the Connectors and Headers CAUTION Only the following connectors and headers have overcurrent protection: back panel USB Type A and Type C, front panel USB, internal USB headers, internal power header, and DC Vin jack. All other connectors and headers are not overcurrent protected and should connect only to devices inside the computer’s chassis, such as fans and internal peripherals.
4.1.1 M.2 2280 Module Connector Table 11. describes the M.2 2280 connector signals. SSD support is provided via PCIe Gen4 NVMe on CPU attached and PCIe Gen3 NVMe/SATA on PCH attached. See Figure 2. for location of respective M.2 2280 module connectors. Table 11. M.2 2280 Module (Mechanical Key M) Connector Pin Signal Name Pin Signal Name 74 72 70 68 3.3V (4A total for pins 74, 72, 70, 18, 16, 14, 12, 4, 2 (0.5A per pin)) 3.3V (4A total for pins 74, 72, 70, 18, 16, 14, 12, 4, 2 (0.5A per pin)) 3.
Technical Reference 4.1.2 Common IO Header This section describes the functions of the common IO header. Table 12 lists the signal names of the common IO header. Figure 6. is a connection diagram for the common IO header. Table 12. Common IO Header (1.
Figure 7. shows the location of the BIOS Security Jumper. The 3-pin jumper determines the BIOS Security program’s mode. Figure 7. Location of the BIOS Security Jumper Table 13 describes the jumper settings for the three modes: normal, lockdown, and configuration. Table 13. BIOS Security Jumper Settings Function/Mode Jumper Setting Configuration Normal 1-2 Lockdown 2-3 Configuration None The BIOS uses current configuration information and passwords for booting.
Technical Reference 4.1.4 Fan Header Current Capability Table 14 lists the current capability of the fan headers. Table 14. Fan Header Current Capability Fan Header Maximum Available Current Processor fan 1A 4.1.5 Power Supply Connectors The system has the following power supply connectors: • External Power Supply – the kit can be powered through a 19.5v DC connector on the back panel. The back-panel DC connector is compatible with a 7.4mm/OD and 5.0mm/ID plug, where the inner 0.
4.2 4.2.1 Mechanical Considerations Form Factor Figure 8 illustrates the mechanical form factor for the system. Dimensions are given in inches [millimeters]. The outer dimensions are 9.1in. x 7.1in. x 2.4in. (230mm x 180mm x 60mm) not including feet. Figure 8.
Technical Reference 4.3 Thermal Considerations CAUTION Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the system. All responsibility for determining the adequacy of any thermal or system design remains solely with the system integrator.
4.5 Environmental Table 15 lists the environmental specifications for the system. CAUTION If the external ambient temperature exceeds 35oC, further thermal testing is required to ensure components do not exceed their maximum operating temperature. Table 15. Environmental Specifications Parameter Specification Temperature Sustained Storage Limits (i.e. warehouse) Short Duration Limits (i.e.
Technical Reference 5 Overview of BIOS Features 5.1 Introduction The system uses an Intel AMI BIOS core that is stored in the Serial Peripheral Interface Flash Memory (SPI Flash) and can be updated through multiple methods (see Section 5.3). The SPI Flash contains the BIOS Setup program, POST, the PCI auto-configuration utility, LAN EEPROM information, and Plug and Play support. The SPI Flash includes a 32 MB flash memory device.
NOTE Supported file systems for BIOS recovery: NTFS (sparse, compressed, or encrypted files are not supported), FAT32, EXT 5.4 Boot Options In the BIOS Setup program, the user can choose to boot from a hard drive, removeable driver, or the network. The default setting is for the hard drive to be the first boot device, the removeable drive second, and the network third. NOTE The network can be selected as a boot device.
Technical Reference [F4] BIOS Recovery The BIOS will search for a matching .CAP file from the \EFI\Intel folder in the supported media with the supported file system. If a matching recovery capsule is found, the BIOS will display the following: BIOS will Recover to in 20 seconds. [ESC] Cancel Recovery Recovery will proceed if not cancelled via the ESC key within 20 seconds. The BIOS shall display the recovery progress. If a BIOS .
Table 18. Supervisor and User Password Functions Password Set Supervisor Mode Neither Any user can change all options Supervisor only Can change all options User only N/A Supervisor and User set 5.
